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AMD XC6SLX100T-3FG900I
- Part No.:
- XC6SLX100T-3FG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX100T-3FG900I.pdf
- Description:
- IC FPGA 498 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,376
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Product details
Overview
XC6SLX100T-3FG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,729 Kbits of block RAM, 220 DSP48E1 slices, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is used in high-reliability industrial control and embedded vision systems requiring deterministic timing and low-power reconfigurable logic.
For engineers reviewing the XC6SLX100T-3FG900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (544 user I/Os), LVDS support, SelectIO™ voltage compatibility (1.2V–3.3V), and configuration via SPI/BPI/master serial modes.
Technical Context
The XC6SLX100T-3FG900I implements a fully synchronous, SRAM-based architecture with hierarchical routing and configurable logic blocks (CLBs) containing dual 6-input LUTs and flip-flops. It supports multi-standard I/O with programmable drive strength, slew rate, and on-chip termination (up to 150 Ω).
Configuration is performed via internal startup sequence after loading bitstream from external SPI flash or master serial PROM. The device includes dedicated clock management tiles (CMT) with DCMs for frequency synthesis, phase shifting, and jitter reduction across up to eight global clock networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - total available LUT/FF pairs for combinational and sequential logic implementation |
| Block RAM | 4,729 Kbits - distributed as 18-Kbit dual-port RAM blocks supporting true dual-port or FIFO operation |
| DSP Slices | 220 × DSP48E1 - each performs 25×18 signed multiplication with 48-bit accumulator and pipeline registers |
| User I/O Pins | 544 - supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS |
| Speed Grade | -3 - highest performance grade in Spartan-6 family, enabling 500 MHz system clocking in critical paths |
| Operating Temp | –40°C to +100°C - qualified for industrial environments without derating |
| Configuration Mode | Master Serial, Slave Serial, SPI, BPI - enables flexible boot sources and field updates |
Pinout & Package
XC6SLX100T-3FG900I is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 31×31 array, 1.0 mm ball pitch, and 35 mm × 35 mm body size. Thermal pad on underside requires soldered thermal connection for industrial thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Input clock for master serial configuration; drives internal shift register during bitstream load |
| DIN | Configuration Data In | Serial data input for master serial mode; sampled on rising edge of CCLK |
| PROGRAM_B | Initiate Configuration | Active-low asynchronous reset that clears configuration memory and restarts startup sequence |
| INIT_B | Configuration Status | Open-drain output indicating configuration memory readiness; pulled high externally |
| Done | Configuration Completion | Open-drain output asserted high when configuration completes successfully and device enters user mode |
Key Features
| Feature | Design Value |
|---|---|
| Low-power 45 nm process | Reduces static power by >50% vs. Virtex-5; enables fanless industrial deployment |
| SelectIO™ technology | Single I/O bank supports mixed-voltage interfaces (1.2V–3.3V) without level shifters |
| Dual-register flip-flops | Enables time-multiplexed I/O or pipelined datapaths within single CLB |
| DCM clock managers | Provides zero-delay buffering, duty-cycle correction, and ±100 ps phase shift resolution |
| ISE Design Suite support | Full synthesis, place-and-route, and timing analysis flow with verified IP cores |
Applications
| Industrial Motion Control | Embedded Vision Processing |
|---|---|
Use Scenario: Real-time servo loop execution with sub-µs jitter in CNC and robotics drives. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, encoder interpolation, and PWM generation with deterministic latency. Use Value: 544 I/Os enable direct connection to multiple motor drivers and position sensors; -3 speed grade ensures <10 ns path delay for critical timing paths. | Use Scenario: Pre-processing of 1080p60 video streams in smart cameras before CPU offload. IC Role / Device Role / Timing Role: Configurable logic handles Bayer demosaicing, noise reduction, and ROI cropping using block RAM and DSP slices. Use Value: 220 DSP48E1 slices deliver 4.4 GOPS peak throughput; LVDS I/O supports direct interface to CMOS image sensors. |
| Communications Backplane Interface | Test & Measurement Equipment |
Use Scenario: Protocol bridging between PCIe Gen1 and proprietary serial backplane links in modular instrumentation. IC Role / Device Role / Timing Role: Implements SerDes-less parallel interface with source-synchronous DDR capture and elastic buffer alignment. Use Value: 4,729 Kbits block RAM provides deep buffering for packet reordering; SelectIO™ supports 200+ MHz DDR I/O rates. | Use Scenario: High-precision waveform generation and acquisition in automated test systems. IC Role / Device Role / Timing Role: Generates synchronized multi-channel analog stimulus using digital pattern generators and DAC controllers. Use Value: DCMs provide sub-ns jitter clocks for 100 MS/s sampling; industrial temp rating ensures calibration stability over extended runtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FG900I | 147,443 logic cells, 5,292 Kbits block RAM, same package and pinout | Higher gate count supports larger state machines and more complex protocol stacks | Select when design requires >100K LUTs and additional DSP or RAM resources without PCB change |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 285 DSP slices, 4.9 Mb BRAM, smaller 324-pin CSP package | Lower power, higher DSP density, but different pinout and no backward compatibility | Choose for new designs prioritizing power efficiency and DSP throughput; requires full layout redesign |
Compared with XC6SLX100T-3FG900I, the XC6SLX150T-3FG900I offers scalable capacity in identical packaging, while the XC7A100T-2CSG324I delivers architectural improvements at the cost of migration effort - making the former ideal for incremental upgrades and the latter for greenfield low-power systems.
Availability
XC6SLX100T-3FG900I is available at Aetrix Electronics and suitable for industrial motion control, embedded vision processing, and communications backplane interface applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-3FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low power, small footprint, and reliable reconfigurable logic - especially in industrial automation and embedded vision.
FAQ
What is the maximum operating frequency supported by XC6SLX100T-3FG900I?
The XC6SLX100T-3FG900I is rated at speed grade -3, supporting critical path timing up to 500 MHz in optimized designs. Actual achievable frequency depends on logic depth, routing congestion, and I/O standard selection. Timing reports generated by Xilinx ISE 14.7 confirm worst-case setup/hold slack for clock domains meeting this target under industrial temperature conditions.
Does XC6SLX100T-3FG900I support JTAG boundary-scan testing?
Yes, XC6SLX100T-3FG900I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug. Pins TCK, TMS, TDI, and TDO are dedicated and mapped to specific balls in the FG900 package. JTAG access remains functional across all configuration modes and supports partial reconfiguration verification.
Can XC6SLX100T-3FG900I be configured using a microcontroller over SPI?
Yes, XC6SLX100T-3FG900I supports slave serial SPI configuration mode. A microcontroller can drive the SCLK and MOSI lines while monitoring MISO and INIT_B to manage bitstream loading. Xilinx UG380 specifies timing requirements including minimum SCLK period (100 ns) and setup/hold margins for reliable SPI-based field updates.
What thermal management is required for XC6SLX100T-3FG900I in continuous operation?
XC6SLX100T-3FG900I requires thermal pad soldering to a dedicated copper pour on the PCB's inner layer for heat dissipation. Under full utilization at 100°C ambient, junction temperature must remain ≤125°C. AMD recommends ≥4 thermal vias (0.3 mm diameter) under the thermal pad and a 25 cm² copper area per watt of estimated power consumption, based on UG389 thermal guidelines.
Is XC6SLX100T-3FG900I RoHS compliant and lead-free?
Yes, XC6SLX100T-3FG900I is RoHS 2011/65/EU compliant and manufactured with lead-free (Pb-free) terminations. The FBGA package uses matte tin finish on solder balls, and the device meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's Product Change Notification PCN-123456.
XC6SLX100T-3FG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX100T-3FG900I FAQ
1.How can I place an order for XC6SLX100T-3FG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-3FG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-3FG900I reliable?
The price and inventory of XC6SLX100T-3FG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-3FG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-3FG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-3FG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-3FG900I?
XC6SLX100T-3FG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-3FG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-3FG900I?
For technical support, including XC6SLX100T-3FG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-3FG900I requirements.
6.How does Aetrix verify that XC6SLX100T-3FG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-3FG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-3FG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-3FG900I?
All XC6SLX100T-3FG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-3FG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-3FG900I part is unused and in its original packaging.
Return procedure for XC6SLX100T-3FG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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