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AMD XC6SLX100T-3FGG484C
- Part No.:
- XC6SLX100T-3FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX100T-3FGG484C.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,836
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Product details
Overview
XC6SLX100T-3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18 Kbit block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with 1.2 V core voltage. It is used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX100T-3FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS-capable banks, single-ended signaling compatibility, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC6SLX100T-3FGG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic and shift registers. It integrates SelectIO technology supporting SSTL, HSTL, LVCMOS, and LVDS standards across 12 I/O banks.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled initialization. Built-in clock management includes two DCMs per bank for phase alignment and frequency synthesis up to 500 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 348 - supports high-density interface routing with bank-wise voltage assignment |
| Block RAM | 1,824 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 220 × DSP48A1 - provides fixed-point multiply-accumulate operations at up to 250 MHz |
| Speed Grade | -3 - guarantees timing closure at worst-case junction temperature (85°C) and VCCINT = 1.14 V |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| I/O Standards | SSTL-2, HSTL-I, LVCMOS, LVDS - allows direct interfacing with DDR2 memory, FPGAs, and ADCs |
Pinout & Package
XC6SLX100T-3FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 2.7 W under typical operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - must be set to match connected peripheral signaling standard |
| K1 | GCLK1 | Global clock input - low-skew routing to all clock-capable resources in device |
| P2 | M0 | Configuration mode select - sets boot source as Master SPI when pulled High |
| T3 | TCK | JTAG test clock - synchronizes boundary-scan instruction and data register shifts |
| U1 | VCCAUX | Analog auxiliary supply - powers configuration logic, DCMs, and JTAG circuitry at 3.3 V |
| W2 | PROGRAM_B | Active-Low configuration reset - initiates reinitialization of configuration memory and logic state |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module updates without full device reset - critical for runtime protocol adaptation |
| Dual-Mode PCI Express Endpoint | Integrated hard IP supporting x1 Gen1 PCIe links - reduces soft-core resource usage and latency |
| Embedded Block RAM Initialization | Allows preloading BRAM contents during configuration - eliminates post-configuration initialization delay |
| SelectIO Technology | Per-bank programmable I/O standards with internal termination - simplifies board-level signal integrity design |
| Digital Clock Manager (DCM) | Two DCMs per I/O bank provide jitter reduction, duty-cycle correction, and frequency synthesis - supports precise timing control |
Applications
| Industrial Motion Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time servo loop execution with synchronized analog feedback sampling and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID computation, encoder interface, and gate driver timing control. Use Value: Deterministic sub-microsecond I/O response enables <1 µs jitter in motor commutation timing. | Use Scenario: Multi-channel digital pattern generation and acquisition with precise inter-channel skew control. IC Role / Device Role / Timing Role: Configurable logic generates stimulus vectors while capturing responses with timestamped parallel bus interfaces. Use Value: 348 user I/Os allow simultaneous connection to 16+ DUT pins with independent voltage domain control per bank. |
| Video Processing Bridge | Communications Baseband |
Use Scenario: Conversion between MIPI CSI-2 camera interface and parallel CMOS image sensor output. IC Role / Device Role / Timing Role: Deserializes high-speed differential video streams and reformats pixel data for downstream processing. Use Value: LVDS-capable I/O banks directly receive 1.5 Gbps CSI-2 lanes without external level-shifting components. | Use Scenario: Channel coding acceleration (Viterbi, Turbo decoding) and symbol mapping for narrowband IoT modems. IC Role / Device Role / Timing Role: DSP48A1 slices execute fixed-point convolution kernels while logic fabric manages frame synchronization. Use Value: 220 DSP slices deliver >1.2 GOPS at 200 MHz - sufficient for real-time LTE Cat-M1 baseband processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG484C | 147,443 logic cells, 2,128 Kbits BRAM, same package and pinout | Higher gate count supports larger state machines and wider datapaths | Choose when XC6SLX100T-3FGG484C fails timing closure or exceeds LUT utilization in final place-and-route |
| XC7S100-2FTG256I | Artix-7 architecture, 100K logic cells, 4.9 Mb BRAM, 256-pin FTBGA | Lower I/O count (170), higher BRAM density, no DCM (uses MMCM instead) | Prefer for new designs needing lower static power, higher DSP efficiency, or integrated PCIe Gen2 support |
Compared with XC6SLX100T-3FGG484C, the XC6SLX150T-3FGG484C offers headroom within identical PCB layout, while the XC7S100-2FTG256I requires board redesign but delivers improved power efficiency and modern transceiver capabilities.
Availability
XC6SLX100T-3FGG484C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and video bridge applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable performance, low power, and long-term availability - especially in industrial automation and legacy system upgrades.
FAQ
What is the maximum operating junction temperature for XC6SLX100T-3FGG484C?
The XC6SLX100T-3FGG484C has a maximum operating junction temperature of +85°C for commercial-grade operation. This rating applies under worst-case voltage (VCCINT = 1.14 V) and timing (-3 speed grade) conditions. Thermal design must ensure sustained junction temperature remains below this limit during continuous operation with full logic and I/O activity.
Does XC6SLX100T-3FGG484C support JTAG boundary-scan testing?
Yes, XC6SLX100T-3FGG484C fully supports IEEE 1149.1 JTAG boundary-scan testing. Pins TCK, TMS, TDI, TDO, and TRST are dedicated for this function and enable full visibility into I/O pin states and interconnect integrity. This capability is active during configuration and operational modes, facilitating in-circuit test and debug workflows.
Can XC6SLX100T-3FGG484C interface directly with DDR2 SDRAM?
Yes, XC6SLX100T-3FGG484C supports DDR2 SDRAM interfacing through its SelectIO banks configured for SSTL-18 I/O standard. The device provides dedicated DQS capture logic and phase-aligned clocking via DCM outputs, enabling reliable 400 MT/s data rates. External termination resistors and careful PCB layout remain required for signal integrity.
What configuration modes are supported by XC6SLX100T-3FGG484C?
XC6SLX100T-3FGG484C supports Master SPI, Slave Serial, and JTAG configuration modes. Mode selection is controlled by M2:M0 pins at power-up. Master SPI uses on-board serial PROM; Slave Serial allows processor-driven configuration; JTAG enables programming and debugging via standard tools like iMPACT or Vivado Hardware Manager.
Is partial reconfiguration supported on XC6SLX100T-3FGG484C?
Yes, XC6SLX100T-3FGG484C supports partial reconfiguration through Xilinx ISE Design Suite tools. This feature allows dynamic replacement of logic modules while the rest of the design remains operational - essential for applications like protocol switching, adaptive filtering, or field-upgradable functionality without system downtime.
XC6SLX100T-3FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX100T-3FGG484C FAQ
1.How can I place an order for XC6SLX100T-3FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-3FGG484C reliable?
The price and inventory of XC6SLX100T-3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-3FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-3FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-3FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-3FGG484C?
XC6SLX100T-3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-3FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-3FGG484C?
For technical support, including XC6SLX100T-3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-3FGG484C requirements.
6.How does Aetrix verify that XC6SLX100T-3FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-3FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-3FGG484C?
All XC6SLX100T-3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-3FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-3FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX100T-3FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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