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AMD XC6SLX100T-3FGG484I
- Part No.:
- XC6SLX100T-3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX100T-3FGG484I.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,107
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Product details
Overview
XC6SLX100T-3FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,261 logic cells, 18 Kbit block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial motor control systems requiring deterministic I/O timing and real-time logic processing.
For engineers reviewing the XC6SLX100T-3FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, SelectIO™ voltage compatibility (1.2V–3.3V), and configuration via SPI/BPI/JTAG interfaces.
Technical Context
The XC6SLX100T-3FGG484I implements a fully programmable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates dual-register 18×18 multipliers and supports distributed RAM up to 32-bit depth per LUT.
Configuration uses 1.8V or 3.3V master serial mode with internal startup sequence control. The device supports partial reconfiguration and includes built-in clock management with six DCMs (Digital Clock Managers) providing phase shifting, frequency synthesis, and duty cycle correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,261 - total configurable logic resources for combinatorial and sequential logic implementation |
| User I/O Pins | 348 - supports high-density interface bridging and parallel bus interfacing |
| Block RAM | 1,824 Kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 220 × DSP48A1 - delivers 18×18 signed multiplication and accumulation per slice for filtering and math-intensive tasks |
| DCMs | 6 × Digital Clock Manager - provides jitter-tolerant clock synthesis, phase alignment, and frequency division |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequencies under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and transportation environments |
Pinout & Package
XC6SLX100T-3FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array, 1.0 mm pitch, and 19.5 mm × 19.5 mm body size. Thermal pad exposed on underside for enhanced heat dissipation in high-utilization designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | I/O bank 0 output voltage supply - sets logic level for all pins in Bank 0 (1.2V/1.5V/1.8V/2.5V/3.3V) |
| K20 | VCCAUX | 1.2V auxiliary supply for configuration circuitry, DCMs, and internal logic |
| M19 | GND | Ground reference for VCCAUX and core logic - requires low-inductance connection to PCB ground plane |
| P17 | CCLK | Configuration clock input - drives internal configuration shift register during master serial mode |
| R16 | DIN | Serial configuration data input - accepts bitstream from external PROM or processor |
| T15 | PROGRAM_B | Active-low asynchronous reset - initiates reconfiguration and clears internal state |
| U14 | INIT_B | Open-drain status output - indicates configuration memory readiness and error detection |
| V13 | DONE | Open-drain completion signal - goes high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards including LVCMOS, LVDS, SSTL, HSTL - enables direct interfacing with DDR2/SDRAM, ADCs, and FPGAs without level-shifting |
| Dual-Register LUTs | Each 6-input LUT includes two independent registers - improves pipelining efficiency and reduces routing congestion in high-speed datapaths |
| Integrated DCMs | Six independent DCMs per device - eliminates need for external clock synthesizers in multi-clock domain systems |
| Partial Reconfiguration | Allows dynamic logic module swapping during operation - supports runtime adaptation in communication protocol stacks and modular control firmware |
| ISE Design Suite Support | Fully supported by Xilinx ISE 14.7 - enables place-and-route, timing analysis, and bitstream generation without migration to Vivado |
Applications
| Industrial Motor Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase PMSM motors with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA logic fabric executes closed-loop control algorithm; DCMs synchronize PWM edges and ADC sampling clocks. Use Value: Achieves sub-microsecond loop latency and deterministic jitter < ±100 ps across 16-channel PWM outputs. | Use Scenario: High-speed digital pattern generation and response capture for IC functional validation. IC Role / Device Role / Timing Role: Configurable I/O banks drive test vectors at 200+ MHz; block RAM stores stimulus sequences and expected responses. Use Value: Enables 32-bit parallel vector rates up to 200 MHz with synchronized capture windows and pass/fail comparison logic. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of multi-channel ultrasound echo data before transmission to host processor. IC Role / Device Role / Timing Role: LVDS receivers acquire 16-channel 80 MSPS ADC streams; DSP slices perform beamforming coefficient multiplication. Use Value: Delivers real-time 16× beamformed sample reduction with < 2 µs end-to-end latency and no external memory bottleneck. | Use Scenario: ARINC 429 and MIL-STD-1553B bus bridging with time-stamped message logging in flight control subsystems. IC Role / Device Role / Timing Role: Dedicated UART-like logic handles ARINC transmit/receive framing; DCMs generate precise 100 kHz and 1 MHz bus clocks. Use Value: Guarantees ARINC word timing accuracy ±50 ns and MIL-STD-1553B sync pulse edge jitter < ±25 ns over full temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG484I | 147,443 logic cells, 2,184 Kbits BRAM, same package and pinout | Higher gate count supports larger control algorithms and additional protocol stacks | Select when >100K LC utilization or >2 MB BRAM is required; same PCB layout but higher power draw |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 4.9 Mb BRAM, 225 DSP slices, 324-pin CSPBGA | Lower static power, native PCIe Gen2 endpoint support, no DCM (uses MMCM only) | Choose for new designs needing lower power or PCIe integration; requires PCB redesign due to different package and I/O voltage requirements |
Compared with XC6SLX100T-3FGG484I, the XC6SLX150T-3FGG484I offers scalable logic density within identical footprint and thermal profile, while the XC7A100T-2CSG324I introduces architectural improvements at the cost of board-level redesign and revised power delivery.
Availability
XC6SLX100T-3FGG484I is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. Xilinx pioneered programmable logic architecture and system-on-chip integration for embedded applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial automation and communications infrastructure.
FAQ
What is the configuration method supported by XC6SLX100T-3FGG484I?
The XC6SLX100T-3FGG484I supports master serial, slave serial, slave parallel, and boundary-scan (JTAG) configuration modes. It accepts bitstreams from SPI flash (x1/x2/x4), parallel NOR flash (BPI), or processor-controlled loading via JTAG. Configuration voltage options include 1.8V and 3.3V for VCCAUX and VCCO.
Does XC6SLX100T-3FGG484I support DDR2 memory interfaces?
Yes, XC6SLX100T-3FGG484I supports DDR2 SDRAM interfaces using its SelectIO™ technology and dedicated DQS logic. It meets JEDEC DDR2-800 timing specifications with proper PCB layout and termination, and supports up to 16-bit data widths per memory controller instance.
What is the maximum operating frequency of the DCMs in XC6SLX100T-3FGG484I?
The DCMs in XC6SLX100T-3FGG484I operate up to 375 MHz input frequency and generate output clocks up to 525 MHz. Each DCM supports multiply/divide ratios from 2–256 and phase shifts in 1/256 steps of the input period, with jitter performance specified at ±100 ps typical.
Is XC6SLX100T-3FGG484I compatible with Xilinx ISE 14.7 software?
Yes, XC6SLX100T-3FGG484I is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, implementation, timing analysis, and bitstream generation. It is not supported in Vivado, as Spartan-6 devices were discontinued from Vivado toolchain after version 2013.4.
What thermal management considerations apply to XC6SLX100T-3FGG484I?
XC6SLX100T-3FGG484I requires a thermal pad connected to an internal copper plane for heat dissipation. Under full utilization at industrial temperature, junction temperature must remain below 100°C. Recommended PCB design includes ≥4 thermal vias under the package center and 2-oz copper on inner layers adjacent to the thermal pad.
XC6SLX100T-3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX100T-3FGG484I FAQ
1.How can I place an order for XC6SLX100T-3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-3FGG484I reliable?
The price and inventory of XC6SLX100T-3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-3FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-3FGG484I?
XC6SLX100T-3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-3FGG484I?
For technical support, including XC6SLX100T-3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-3FGG484I requirements.
6.How does Aetrix verify that XC6SLX100T-3FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-3FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-3FGG484I?
All XC6SLX100T-3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-3FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX100T-3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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