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AMD XC6SLX100T-3FGG676I
- Part No.:
- XC6SLX100T-3FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100T-3FGG676I.pdf
- Description:
- IC FPGA 376 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,829
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Product details
Overview
XC6SLX100T-3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18 Kbit block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial motor control, embedded vision preprocessing, and protocol bridging applications.
For engineers reviewing the XC6SLX100T-3FGG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (480 user I/Os), LVDS support, SelectIO™ voltage flexibility (1.2V–3.3V), and integrated clock management (DCM and PLL).
Technical Context
The XC6SLX100T-3FGG676I implements a fully configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates dual 18×18 multipliers per DSP48A1 slice and supports distributed memory up to 32-bit depth.
Its clocking architecture includes two DCMs and one PLL per device, enabling internal clock division, multiplication, phase shifting, and jitter reduction. I/O banks are independently configurable for SSTL, HSTL, LVCMOS, LVDS, and TMDS signaling standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - total configurable logic resources for implementing state machines, data paths, and glue logic |
| Block RAM | 1,824 Kbits - distributed across 192 blocks of 18 Kbits each, usable as FIFOs or dual-port memory |
| DSP Slices | 220 × DSP48A1 - each supports 18×18 signed multiplication with pre-adder and accumulator |
| User I/O Pins | 480 - supports mixed-voltage I/O banks with programmable drive strength and slew rate |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in critical paths under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| Package | FGG676 - 676-pin Fine-Pitch BGA, 27×27 mm, 1.0 mm pitch, RoHS-compliant |
Pinout & Package
XC6SLX100T-3FGG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 27×27 array, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation. Pinout follows Xilinx Spartan-6 FPGA Pin Planning Guide UG381 (v1.12), with dedicated configuration, clock, JTAG, and I/O bank pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_DONE | Open-drain output confirming successful configuration; pulled high externally to enable startup |
| E20 | INIT_B | Active-low open-drain status signal indicating configuration memory readiness |
| H19 | PROGRAM_B | Active-low input that resets configuration logic and clears internal SRAM upon assertion |
| A12, A13 | CLK0, CLK1 | Dedicated single-ended clock inputs routed to global clock networks with low skew |
| V16, W16 | M0, M1 | Mode pins sampled at power-up to select configuration source (JTAG, Master SPI, Slave SelectMAP) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two DCMs + one PLL per device enable precise clock synthesis, deskew, and jitter filtering without external ICs |
| SelectIO™ Technology | Supports 17 I/O standards including LVDS, SSTL-2, HSTL-I, and 1.2–3.3 V LVCMOS with programmable termination |
| Embedded Memory | 192 × 18 Kb block RAMs allow true dual-port operation and synchronous read/write with independent clocks |
| DSP48A1 Slice | 220 slices each deliver 18×18 multiply-accumulate in one clock cycle with pipeline registers |
| Configuration Security | Bitstream encryption via AES-128 key stored in on-chip eFUSE prevents unauthorized cloning or reverse engineering |
Applications
| Industrial Motor Control | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase PMSM/BLDC motors with current sensing and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, space-vector modulation (SVM), and encoder interpolation logic. Use Value: Deterministic latency (<500 ns) and parallel I/O handling enable sub-microsecond current loop updates at 20 kHz switching frequency. | Use Scenario: On-camera image enhancement before transmission to host processor - including Bayer demosaicing, gamma correction, and noise filtering. IC Role / Device Role / Timing Role: Configurable logic processes pixel streams from parallel CMOS sensors using line buffers and pipelined arithmetic units. Use Value: 480 user I/Os support 24-bit parallel sensor interface plus DDR2 memory controller for frame buffering. |
| Protocol Bridging | Test & Measurement Equipment |
Use Scenario: Converting between legacy industrial protocols (e.g., RS-485 Modbus) and modern Ethernet-based stacks (TCP/IP, EtherCAT). IC Role / Device Role / Timing Role: Implements protocol state machines, packet assembly/disassembly, and timing-critical UART-to-GMII bridging logic. Use Value: Dual DCMs generate precise baud rates (e.g., 115.2 kbps ±0.5%) and synchronize Ethernet MAC timing domains. | Use Scenario: High-speed digital pattern generation and acquisition in automated test equipment (ATE) with multi-channel synchronization. IC Role / Device Role / Timing Role: Generates deterministic stimulus waveforms and captures response data with timestamp alignment across 32+ channels. Use Value: -3 speed grade ensures setup/hold timing margins for 200+ MHz sampling clocks with <100 ps jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG676I | 147,443 logic cells, 2,184 Kbits BRAM, same package and speed grade | Higher gate count enables larger designs (e.g., dual-core soft CPU + peripherals) | Select when design exceeds XC6SLX100T resource utilization by >20% and board layout allows same footprint |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 4.9 Mb BRAM, lower static power, no DCM (only PLL) | Lacks DCM-based fine-grained phase shift but adds PCIe Gen2 endpoint and 6.6 Gbps transceivers | Prefer for new designs requiring serial connectivity or lower power; requires PCB redesign due to CSG324 package |
Compared with XC6SLX100T-3FGG676I, the XC6SLX150T offers headroom within identical mechanical and thermal constraints, while the XC7A100T trades DCM flexibility for transceiver integration and power efficiency-requiring package and signal integrity reassessment.
Availability
XC6SLX100T-3FGG676I is available at Aetrix Electronics and suitable for industrial automation, embedded vision systems, and protocol conversion applications requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX100T-3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic implementation, embedded processing, and flexible I/O interfacing - particularly in industrial and automotive subsystems.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100T-3FGG676I?
The XC6SLX100T-3FGG676I supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces such as 1.8 V LVDS receivers alongside 3.3 V CMOS outputs on the same device. This capability is defined in Xilinx DS162 and verified in the XC6SLX100T-3FGG676I pinout file.
Does XC6SLX100T-3FGG676I include built-in configuration memory?
No, the XC6SLX100T-3FGG676I does not include non-volatile configuration memory. It relies on external SPI flash (e.g., XCFxxP series) or JTAG programming for bitstream loading at power-up. Configuration is stored in SRAM, making it volatile - the XC6SLX100T-3FGG676I must be reconfigured each time power is applied unless using an external master PROM.
Can XC6SLX100T-3FGG676I operate in a 0°C to +70°C environment?
Yes, the XC6SLX100T-3FGG676I is rated for industrial temperature range (-40°C to +100°C), so it fully supports operation at 0°C to +70°C. Its -3 speed grade guarantees timing performance across this full range without derating, unlike commercial-grade variants which are limited to 0°C to +70°C and lack extended thermal qualification.
How many clock regions does XC6SLX100T-3FGG676I have for DCM and PLL placement?
The XC6SLX100T-3FGG676I contains four clock regions, each supporting one DCM and one PLL. Two DCMs and one PLL are available per device, all located in separate clock regions to minimize routing delay and skew. Placement constraints for XC6SLX100T-3FGG676I require assigning clock sources to specific regions per UG382 v1.11.
Is bitstream encryption supported on XC6SLX100T-3FGG676I?
Yes, XC6SLX100T-3FGG676I supports AES-128 bitstream encryption using a 128-bit key stored in on-chip eFUSE. Encryption is enabled during bitstream generation in Vivado or ISE, and the key is programmed once via JTAG. This prevents unauthorized readback or cloning of the configured logic design.
XC6SLX100T-3FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 376
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100T-3FGG676I FAQ
1.How can I place an order for XC6SLX100T-3FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-3FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-3FGG676I reliable?
The price and inventory of XC6SLX100T-3FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-3FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-3FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-3FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-3FGG676I?
XC6SLX100T-3FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-3FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-3FGG676I?
For technical support, including XC6SLX100T-3FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-3FGG676I requirements.
6.How does Aetrix verify that XC6SLX100T-3FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-3FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-3FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-3FGG676I?
All XC6SLX100T-3FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-3FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-3FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX100T-3FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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