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AMD XC6SLX100T-3FGG900I
- Part No.:
- XC6SLX100T-3FGG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX100T-3FGG900I.pdf
- Description:
- IC FPGA 498 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,106
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Product details
Overview
XC6SLX100T-3FGG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 480 DSP48A1 slices, 4.9 Mb of total block RAM, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial motor control systems requiring deterministic I/O timing and real-time logic processing.
For engineers reviewing the XC6SLX100T-3FGG900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (544 user I/Os), LVDS support, configuration interface options (SPI/BPI/Slave SelectMAP), and thermal performance in convection-cooled enclosures.
Technical Context
The XC6SLX100T-3FGG900I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports multi-standard I/O banks with programmable drive strength, slew rate, and on-chip termination (up to 50 Ω).
Configuration is performed via Master SPI, Slave SelectMAP, or JTAG; bitstream encryption and readback protection are supported. The device includes integrated clock management with six DCMs (Digital Clock Managers) for phase shifting, frequency synthesis, and duty cycle correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 4.9 Mb - supports embedded FIFOs, data buffering, and local memory without external DRAM |
| DSP Slices | 480 × DSP48A1 - enables fixed-point MAC operations at up to 250 MHz for motor control algorithms |
| User I/O Pins | 544 - provides high-density interface capability for parallel buses, sensor arrays, and industrial fieldbus controllers |
| Speed Grade | -3 - guarantees timing closure at 500 MHz system clock with worst-case industrial temperature and voltage |
| Operating Temp | -40°C to +100°C - qualified for use in sealed industrial enclosures without forced air cooling |
| Package | FGG900 - 900-pin Fine-Pitch BGA with 1.0 mm pitch, 31×31 mm body, RoHS-compliant |
Pinout & Package
XC6SLX100T-3FGG900I is housed in a 900-pin Fine-Pitch Ball Grid Array (FGG900) package with 1.0 mm ball pitch, 31 mm × 31 mm body size, and standard thermal pad layout per Xilinx DS162.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 4.7 µF near package edge |
| P2 | CLKIN_1 | Dedicated single-ended clock input for DCM0 - accepts 1.2–200 MHz CMOS/LVCMOS signals |
| T1 | M0 | Configuration mode select - sets boot source as Master SPI when pulled High |
| Y2 | PROGRAM_B | Active-Low asynchronous reset - initiates full reconfiguration and clears internal state |
| A1 | VCCAUX | 1.8 V auxiliary supply for configuration logic and DCMs - requires low-noise regulation |
| U18 | INIT_B | Open-drain status output - goes High-Z after successful configuration, Low during error or reset |
Key Features
| Feature | Design Value |
|---|---|
| Dual-register flip-flops per LUT | Enables time-multiplexed logic or pipelined datapaths without extra CLB usage |
| Integrated DCMs | Provides jitter-tolerant clock synthesis and phase alignment across multiple I/O banks |
| SelectIO technology | Supports 20+ I/O standards including LVDS, SSTL, HSTL, and PCI - no external level shifters needed |
| ISE Design Suite support | Full toolchain compatibility through Xilinx ISE 14.7 - includes place-and-route, timing analysis, and bitstream generation |
| Bitstream encryption | Prevents reverse engineering via AES-128 decryption key stored in on-chip eFUSE |
Applications
| Industrial Motor Drive Controller | Programmable Logic Relay |
|---|---|
Use Scenario: Real-time PWM generation, current loop sampling, and safety interlock monitoring in servo drives. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop control algorithms with sub-µs latency; DCMs synchronize ADC sampling and gate driver timing. Use Value: Replaces discrete logic and microcontroller-based designs with deterministic timing and field-upgradable firmware. | Use Scenario: Replacement of electromechanical relays in factory automation panels with configurable logic and diagnostics. IC Role / Device Role / Timing Role: Implements safety-certified ladder logic execution and dual-channel watchdog supervision. Use Value: Reduces panel space by >70% and enables remote logic updates without hardware change. |
| Video Interface Bridge | Test Equipment Pattern Generator |
Use Scenario: Converting Camera Link to HDMI in machine vision inspection systems. IC Role / Device Role / Timing Role: Handles pixel clock domain crossing, serialization, and protocol translation using dedicated I/O and block RAM. Use Value: Eliminates need for external serializer ICs and reduces BOM cost by integrating PHY and logic. | Use Scenario: Generating high-speed digital stimulus patterns for ASIC validation in ATE environments. IC Role / Device Role / Timing Role: Delivers synchronized 200+ Mbps parallel vectors with precise skew control across all 544 I/Os. Use Value: Achieves <10 ps channel-to-channel skew using calibrated output delays and on-die termination. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG900I | 147,443 logic cells, 576 DSP slices, same package and pinout | Higher gate count supports larger state machines and additional protocol stacks (e.g., EtherCAT + CAN FD) | Select when design requires >100K logic cells or additional DSP resources without PCB redesign |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 240 DSP48E1 slices, smaller 324-pin CSP package | Lacks DCMs; uses MMCM for clocking - higher jitter but better high-frequency synthesis | Choose for new designs prioritizing lower power and higher clock frequencies over legacy toolchain compatibility |
Compared with XC6SLX100T-3FGG900I, the XC6SLX150T-3FGG900I offers direct scalability within the same footprint, while the XC7A100T-2CSG324I trades I/O density and mature tool support for improved power efficiency and advanced clocking - making it suitable only for greenfield designs.
Availability
XC6SLX100T-3FGG900I is available at Aetrix Electronics and suitable for industrial motor control, programmable logic relays, and video interface bridge applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-3FGG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, industrial, and automotive markets.
The Spartan-6 family, including XC6SLX100T-3FGG900I, was designed for cost-sensitive, high-volume industrial control and embedded vision applications requiring long-term availability and mature toolchain stability.
FAQ
What is the maximum operating frequency of the XC6SLX100T-3FGG900I?
The XC6SLX100T-3FGG900I is rated at speed grade -3, guaranteeing functional operation up to 500 MHz for internal logic paths under worst-case industrial temperature (-40°C to +100°C) and voltage conditions. Actual achievable frequency depends on design complexity, routing, and clock domain constraints - verified via static timing analysis in Xilinx ISE 14.7.
Does the XC6SLX100T-3FGG900I support JTAG boundary-scan testing?
Yes, the XC6SLX100T-3FGG900I fully supports IEEE 1149.1 JTAG boundary-scan for board-level test and in-system programming. TDI, TDO, TMS, TCK, and TCK pins are dedicated and electrically compliant with JTAG specifications, enabling verification of solder joints and interconnect integrity before configuration.
Can the XC6SLX100T-3FGG900I be configured via SPI flash memory?
Yes, the XC6SLX100T-3FGG900I supports Master SPI configuration mode using standard quad-SPI or standard SPI flash devices (e.g., Micron MT25QL series). Configuration occurs automatically on power-up when M0/M1/M2 pins are set to 101, loading the bitstream directly into SRAM without host processor intervention.
What I/O standards are supported by the XC6SLX100T-3FGG900I?
The XC6SLX100T-3FGG900I supports 22 I/O standards across its 12 I/O banks, including LVDS, Mini-LVDS, RSDS, BLVDS, SSTL, HSTL, PCI, and LVCMOS (1.2 V to 3.3 V). Each bank is independently powered, allowing mixed-voltage interfaces on a single device without level shifters.
Is bitstream encryption available on the XC6SLX100T-3FGG900I?
Yes, the XC6SLX100T-3FGG900I supports AES-128 bitstream encryption using a 128-bit key stored in one-time-programmable eFUSE. Encryption is enabled during bitstream generation in ISE, and decrypted on-the-fly during configuration - preventing unauthorized access to design IP even if flash memory is physically extracted.
XC6SLX100T-3FGG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX100T-3FGG900I FAQ
1.How can I place an order for XC6SLX100T-3FGG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-3FGG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-3FGG900I reliable?
The price and inventory of XC6SLX100T-3FGG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-3FGG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-3FGG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-3FGG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-3FGG900I?
XC6SLX100T-3FGG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-3FGG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-3FGG900I?
For technical support, including XC6SLX100T-3FGG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-3FGG900I requirements.
6.How does Aetrix verify that XC6SLX100T-3FGG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-3FGG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-3FGG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-3FGG900I?
All XC6SLX100T-3FGG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-3FGG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-3FGG900I part is unused and in its original packaging.
Return procedure for XC6SLX100T-3FGG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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