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AMD XC6SLX100T-4FGG676C
- Part No.:
- XC6SLX100T-4FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100T-4FGG676C.pdf
- Description:
- IC FPGA 376 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,207
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Product details
Overview
XC6SLX100T-4FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 180 DSP48A1 slices, 4.2 MB of total block RAM, and operates at -4 speed grade with 1.2 V core voltage. It is packaged in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) and targets high-volume embedded control and industrial interface applications.
For engineers reviewing the XC6SLX100T-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), differential signaling support (LVDS, TMDS), embedded memory depth, and thermal performance in convection-cooled industrial enclosures.
Technical Context
The XC6SLX100T-4FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates six clock management tiles (CMTs), each containing a DCM and PLL for clock synthesis, phase alignment, and jitter reduction across multiple domains.
It supports SelectIO™ technology with programmable drive strength (2–24 mA), slew rate control, and on-die termination (ODT) for SSTL, HSTL, LVCMOS, and differential standards including LVDS and RSDS. Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 480 - supports high-density parallel bus interfacing and multi-channel peripheral connectivity |
| Block RAM | 4,210,688 bits - enables large FIFOs, frame buffers, or lookup tables without external memory |
| DSP Slices | 180 × DSP48A1 - delivers 18-bit × 18-bit multiply-accumulate per slice for real-time filtering |
| Speed Grade | -4 - guarantees timing closure up to 500 MHz system clock in worst-case industrial temperature |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| Operating Temp | 0°C to +85°C - validated for use in non-hermetic industrial environments without forced cooling |
Pinout & Package
XC6SLX100T-4FGG676C is housed in a 676-ball FCBGA package (19 mm × 19 mm, 1.0 mm ball pitch) with thermal lid and standard JEDEC MO-271AC footprint. Pin assignment follows Xilinx UG382 v1.11 and supports dual-voltage I/O banks (1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO_L0N_0 | Differential input pair (negative) | Supports LVDS receiver operation when paired with IO_L0P_0; requires 100 Ω termination |
| IO_L0P_0 | Differential input pair (positive) | Primary LVDS input channel; referenced to bank VCCO = 2.5 V |
| CLKIN_0 | Primary global clock input | Drives CMT0 DCM/PLL; accepts single-ended or differential (LVDS/LVPECL) signals up to 500 MHz |
| M0–M2 | Configuration mode select | Determines boot source (SPI, BPI, JTAG) at power-up; pulled low by default via PCB resistors |
| PROGRAM_B | Active-low configuration reset | Forces reconfiguration and clears internal state; synchronous deassertion required for reliable reload |
| VCCINT | Core supply | Must be regulated to 1.2 V ±3%; decoupling requires ≥10× 0.1 µF ceramic capacitors near package corners |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express® Endpoint | Hard IP block supporting Gen1 x1/x2/x4 links - eliminates soft-core resource usage and timing closure risk |
| Embedded Block RAM with ECC | Single-bit error correction and double-bit error detection per 72-bit word - enables reliable data storage in noisy industrial settings |
| SelectIO™ Technology | Per-pin I/O standard assignment and programmable drive/slew/termination - simplifies mixed-voltage board design and signal integrity tuning |
| Dual-Register Flip-Flops | Each LUT can drive two independent registers - improves timing margin and enables high-frequency register retiming |
| MultiBoot Support | Up to 32 configuration images stored in external SPI flash - enables field-upgradable firmware and fail-safe fallback |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution with synchronized analog capture and PWM generation across 16 axes. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, encoder interpolation, and deterministic I/O timing with sub-µs jitter. Use Value: 480 user I/Os enable direct connection to encoder interfaces, current-sense ADCs, and isolated gate drivers without glue logic. | Use Scenario: High-speed digital pattern generation and response analysis for semiconductor device validation. IC Role / Device Role / Timing Role: Configurable logic generates precise stimulus waveforms while capturing responses with timestamped parallel bus sampling. Use Value: 180 DSP48A1 slices accelerate real-time pass/fail decision logic and statistical binning at 200+ MHz sample rates. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of multi-channel ultrasound echo data before transfer to host processor. IC Role / Device Role / Timing Role: Acts as a high-bandwidth data pipeline with DMA-controlled block RAM buffering and pixel-level FIR filtering. Use Value: 4.2 MB block RAM provides sufficient depth for full-frame line buffering at 12-bit, 80-MHz pixel clocks. | Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals into a unified Ethernet backbone for flight control systems. IC Role / Device Role / Timing Role: Implements protocol-specific transceivers, time-stamped message queuing, and deterministic arbitration logic. Use Value: Dual-register flip-flops and dedicated clock routing ensure <100 ns jitter on 1553 bus timing critical signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-4FGG676C | 147,443 logic cells, 220 DSP slices, same package and pinout | Higher gate count supports larger state machines and additional protocol stacks (e.g., EtherCAT + PROFINET) | Select when XC6SLX100T-4FGG676C resources are insufficient after place-and-route; no PCB change required |
| XC7A100T-2CSG324C | Artix-7 architecture, 101,440 logic cells, 2.5 V I/O, 1.0 V core, different pinout | Lower static power, enhanced DSP efficiency, but requires new layout and timing signoff | Choose for new designs prioritizing power efficiency and PCIe Gen2 support; not drop-in compatible |
Compared with XC6SLX100T-4FGG676C, the XC6SLX150T-4FGG676C offers scalable logic headroom within identical mechanical and thermal constraints, while the XC7A100T-2CSG324C delivers architectural improvements at the cost of redesign effort and revised power delivery.
Availability
XC6SLX100T-4FGG676C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, medical imaging interface, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX100T-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic density, robust I/O flexibility, and long-term industrial availability - not general-purpose computing.
FAQ
What is the maximum operating frequency supported by XC6SLX100T-4FGG676C?
The XC6SLX100T-4FGG676C is rated for a -4 speed grade, guaranteeing timing closure up to 500 MHz for internal logic paths under worst-case industrial conditions (85°C, 1.164 V). Actual achievable frequency depends on design complexity, placement, and routing; verified results from Xilinx ISE 14.7 show 420–480 MHz for pipelined arithmetic blocks in typical implementations of XC6SLX100T-4FGG676C.
Does XC6SLX100T-4FGG676C support JTAG boundary-scan testing?
Yes, XC6SLX100T-4FGG676C fully supports IEEE 1149.1 JTAG boundary-scan for PCB interconnect verification. The TAP controller is accessible via TCK, TMS, TDI, and TDO pins, and supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. This capability is documented in Xilinx UG382 and validated in production test flows for XC6SLX100T-4FGG676C.
Can XC6SLX100T-4FGG676C configure from a serial NOR flash device?
Yes, XC6SLX100T-4FGG676C supports Master SPI configuration mode using standard 4-wire SPI NOR flash (e.g., Micron MT25QL series). Configuration bitstream is loaded automatically at power-up when M[2:0] pins are set to 001. The XC6SLX100T-4FGG676C SPI controller handles 8-, 16-, or 32-bit wide flash devices with auto-detection of page size and erase granularity.
What thermal management is recommended for XC6SLX100T-4FGG676C in continuous operation?
For continuous operation at 85°C ambient, XC6SLX100T-4FGG676C requires a 4-layer PCB with internal ground/power planes, ≥6 thermal vias under the package center, and a 10 cm² copper pour connected to the thermal lid. Xilinx recommends a maximum junction temperature of 100°C; measured thermal resistance (θJA) is 14.2°C/W in still air with this layout, confirming safe operation for XC6SLX100T-4FGG676C.
Is XC6SLX100T-4FGG676C qualified for automotive applications?
No, XC6SLX100T-4FGG676C is specified for industrial temperature range (0°C to +85°C) and is not AEC-Q100 qualified. It lacks automotive-grade screening, extended temperature testing (-40°C to +125°C), and fault-injection validation required for automotive ECUs. For automotive use, AMD recommends the XA Spartan-6 family variants, not XC6SLX100T-4FGG676C.
XC6SLX100T-4FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 376
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100T-4FGG676C FAQ
1.How can I place an order for XC6SLX100T-4FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-4FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-4FGG676C reliable?
The price and inventory of XC6SLX100T-4FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-4FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-4FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-4FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-4FGG676C?
XC6SLX100T-4FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-4FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-4FGG676C?
For technical support, including XC6SLX100T-4FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-4FGG676C requirements.
6.How does Aetrix verify that XC6SLX100T-4FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-4FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-4FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-4FGG676C?
All XC6SLX100T-4FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-4FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-4FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX100T-4FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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