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AMD XC6SLX100T-4FGG900C
- Part No.:
- XC6SLX100T-4FGG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX100T-4FGG900C.pdf
- Description:
- IC FPGA 498 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,487
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Product details
Overview
XC6SLX100T-4FGG900C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18-bit × 32-bit embedded multipliers, 478 I/O pins, and operation at -4 speed grade (4 ns CLB delay) in industrial temperature range (0°C to 85°C). It serves as a reconfigurable logic fabric for high-throughput digital signal processing in industrial motion control systems.
For engineers reviewing the XC6SLX100T-4FGG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic density, embedded memory depth, differential signaling support (LVDS), and thermal performance under sustained 100+ MHz clocking.
Technical Context
The XC6SLX100T-4FGG900C implements a hierarchical architecture with Configurable Logic Blocks (CLBs), Block RAM (1,824 × 36-bit), and Digital Clock Managers (DCMs) supporting phase-shifted and frequency-synthesized clocks. It integrates 228 DSP48A1 slices for arithmetic-intensive tasks and supports SelectIO™ standards including LVCMOS, LVTTL, LVDS, and SSTL.
Configuration occurs via Master Serial (SPI flash) or JTAG, with bitstream encryption available. The device uses 65 nm CMOS process and requires dual-supply operation: 1.2 V core, 2.5/3.3 V I/O, and 1.2 V auxiliary (VCCAUX).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom state machines or protocol engines |
| I/O Pins | 478 - supports high-pin-count interfaces such as parallel video buses or multi-axis encoder inputs |
| Block RAM | 1,824 × 36-bit - enables on-chip buffering of video frames or real-time data streams without external memory |
| DSP Slices | 228 - delivers fixed-point MAC throughput for motor control PID loops or FIR filtering |
| Speed Grade | -4 - guarantees timing closure up to 400 MHz system clock in critical paths with 4 ns CLB propagation |
| Operating Temp | 0°C to 85°C - validated for use in enclosed industrial cabinets without forced air cooling |
| Package | FBGA-900 - 31 mm × 31 mm footprint with 1.0 mm ball pitch, compatible with standard reflow profiles |
Pinout & Package
XC6SLX100T-4FGG900C is housed in a 900-ball Fine-Pitch Ball Grid Array (FBGA) package with 31 × 31 array, 1.0 mm ball pitch, and thermal pad exposed on underside for PCB-level heat dissipation. Pin functions are organized into I/O banks, configuration banks (M0–M2, CCLK, DONE), and dedicated clock inputs (GCLK0–GCLK3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Dedicated global clock input | Low-skew routing to all CLBs; required for synchronous design with >100 MHz clock domains |
| M0, M1, M2 | Mode configuration pins | Set boot mode (Master Serial, Slave Serial, JTAG) at power-up; must be pulled high/low per config scheme |
| CCLK | Configuration clock | Drives bitstream loading from SPI flash; externally generated during Master Serial mode |
| DONE | Configuration status output | Open-drain signal indicating successful bitstream load; used to enable downstream logic after init |
| VCCO_0–VCCO_4 | I/O bank voltage supplies | Independent 1.2/1.5/1.8/2.5/3.3 V rails per bank-enables mixed-voltage interface coexistence |
| VCCINT | Core logic supply | 1.2 V ±3% regulated supply; powers CLBs, interconnect, and block RAM |
Key Features
| Feature | Design Value |
|---|---|
| Embedded DSP48A1 slices | 228 units with 18 × 25-bit multiplier + 48-bit accumulator - enables real-time 16-bit motor current loop computation |
| SelectIO™ technology | Supports LVDS, SSTL-18, HSTL-I, and differential termination - allows direct connection to ADCs, encoders, and DDR memory without level shifters |
| Digital Clock Manager (DCM) | Two DCMs per device with jitter < ±100 ps - provides phase-aligned clocks for image sensor synchronization and PWM generation |
| Block RAM configuration | Configurable as true dual-port RAM, ROM, or shift register - facilitates FIFO-based data bridging between asynchronous peripherals |
| Bitstream encryption | AES-128 decryption with battery-backed key storage - protects proprietary IP in deployed industrial controllers |
Applications
| Industrial Motion Control | Machine Vision Interface |
|---|---|
Use Scenario: Real-time coordination of 8-axis servo drives with synchronized PWM outputs and encoder feedback sampling. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop PID, generates time-critical PWM waveforms, and manages high-speed encoder quadrature decoding. Use Value: Deterministic sub-microsecond latency ensures axis synchronization within ±50 ns, preventing mechanical resonance in CNC gantries. | Use Scenario: Aggregating four 10-bit, 60 fps CMOS image sensors into a unified 40-bit parallel pixel bus feeding an external processor. IC Role / Device Role / Timing Role: Timing bridge and pixel alignment engine using Block RAM FIFOs and DCM-synchronized capture clocks. Use Value: Eliminates external frame buffers by storing two full frames on-chip, reducing BOM cost and board area by 35%. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Replacing ASIC-based I/O modules in modular PLC backplanes with field-upgradable logic for analog/digital signal conditioning. IC Role / Device Role / Timing Role: Configurable I/O hub with integrated sigma-delta decimation filters and isolated digital input debouncing logic. Use Value: Enables firmware-defined I/O behavior (e.g., 4–20 mA vs. 0–10 V analog input) without hardware change, cutting product variant SKUs by 60%. | Use Scenario: High-precision time-interval analyzer capturing edge transitions across 16 channels with 200 ps resolution. IC Role / Device Role / Timing Role: Time-to-digital converter (TDC) implemented in CLBs with calibrated delay chains and timestamp FIFO buffering. Use Value: Achieves 200 ps single-shot resolution using internal carry-chain delays, avoiding costly external TDC ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture, 2,586K logic cells, 48.5 GT/s transceivers, 0.85 V core - higher density, serial connectivity, lower power per gate | Targeted at PCIe Gen4 endpoint designs and 10G Ethernet packet processing, not cost-sensitive industrial I/O expansion | Select when migrating from Spartan-6 to scalable high-speed serial infrastructure with long-term roadmap support |
| XC7A100T-2CSG324C | Artix-7 architecture, 101,440 logic cells, same I/O count (210), but only 285 DSP slices and no dedicated GCLK pins - smaller package, lower static power | Better suited for portable test equipment and low-power imaging subsystems where thermal envelope is constrained | Choose for new designs requiring lower standby current and smaller PCB footprint, accepting reduced clock routing flexibility |
Compared with XC6SLX100T-4FGG900C, the XC7A100T-2CSG324C offers lower power and compact packaging but lacks dedicated global clock pins and has reduced DSP slice count; the XCVU9P-2FLGA2104I delivers massive scalability and serial transceivers at significantly higher cost and complexity.
Availability
XC6SLX100T-4FGG900C is available at Aetrix Electronics and suitable for industrial motion control, machine vision interface, programmable logic controller (PLC), and test & measurement equipment requiring stable component supply across extended production lifecycles.
Supply support for XC6SLX100T-4FGG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and industrial applications.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume embedded applications demanding reliable I/O flexibility, moderate logic density, and industrial temperature operation - ideal for factory automation and legacy system upgrades.
FAQ
What is the maximum operating frequency supported by XC6SLX100T-4FGG900C?
The XC6SLX100T-4FGG900C is rated at speed grade -4, guaranteeing timing closure for critical paths up to 400 MHz with 4 ns CLB propagation delay. Actual achievable system clock frequency depends on design topology, routing congestion, and I/O standard selection - verified post-place-and-route using Xilinx ISE 14.7 or Vivado 2018.4 toolchain.
Does XC6SLX100T-4FGG900C support JTAG boundary-scan testing?
Yes, XC6SLX100T-4FGG900C fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing. The TDI, TDO, TMS, and TCK pins are dedicated and electrically compliant; boundary-scan instruction register and BSDL file are provided in Xilinx UG380 v1.11 documentation.
What configuration modes are supported by XC6SLX100T-4FGG900C?
XC6SLX100T-4FGG900C supports Master Serial (SPI flash), Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up; Master Serial is most common for standalone operation, while JTAG is used for development and in-system programming.
Can XC6SLX100T-4FGG900C interface directly with DDR2 memory?
Yes, XC6SLX100T-4FGG900C supports DDR2 SDRAM interfaces through its SelectIO™ banks configured for SSTL-18 I, with dedicated DQS groups and phase-matched routing constraints. Xilinx UG382 specifies timing parameters and PCB layout guidelines for reliable 400 MT/s operation.
Is bitstream encryption available on XC6SLX100T-4FGG900C?
Yes, XC6SLX100T-4FGG900C supports AES-128 bitstream encryption using a battery-backed key storage mechanism. Encryption is enabled during bitstream generation in ISE Design Suite; decrypted configuration occurs automatically on-load, protecting intellectual property in deployed industrial controllers.
XC6SLX100T-4FGG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX100T-4FGG900C FAQ
1.How can I place an order for XC6SLX100T-4FGG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-4FGG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-4FGG900C reliable?
The price and inventory of XC6SLX100T-4FGG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-4FGG900C is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-4FGG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-4FGG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-4FGG900C?
XC6SLX100T-4FGG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-4FGG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-4FGG900C?
For technical support, including XC6SLX100T-4FGG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-4FGG900C requirements.
6.How does Aetrix verify that XC6SLX100T-4FGG900C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-4FGG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-4FGG900C meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-4FGG900C?
All XC6SLX100T-4FGG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-4FGG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-4FGG900C part is unused and in its original packaging.
Return procedure for XC6SLX100T-4FGG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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