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AMD XC6SLX100T-N3FG484I
- Part No.:
- XC6SLX100T-N3FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX100T-N3FG484I.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,415
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Product details
Overview
XC6SLX100T-N3FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,261 logic cells, 18 Kbit block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial motor control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX100T-N3FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS/PCIe-compatible transceivers (up to 1.25 Gbps), dual-boot configuration capability, and support for JTAG boundary-scan testing per IEEE 1149.1.
Technical Context
The XC6SLX100T-N3FG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated digital signal processing (DSP) slices, and block RAM primitives. It supports SelectIO™ technology with programmable I/O standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and TMDS.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. The device includes internal oscillator, power-on reset circuitry, and supports multi-boot with fallback configuration memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,261 - total available lookup table (LUT) and flip-flop resources for logic implementation |
| User I/O Pins | 348 - configurable single-ended and differential I/Os supporting multiple voltage standards |
| Block RAM | 1,824 Kbits - distributed across 182 block RAM primitives, each 18 Kbits, usable as memory or FIFO |
| DSP Slices | 220 - dedicated 18×18 multiplier-accumulator units for high-speed arithmetic operations |
| Speed Grade | -3 - maximum operating frequency for critical paths under industrial temperature and voltage conditions |
| Operating Temp | –40°C to +100°C - qualified for extended industrial environments without derating |
| Configuration Mode | Master SPI / Slave Serial / JTAG - flexible boot options enabling field updates and debug access |
Pinout & Package
Package: 484-ball Fine-Pitch BGA (FG484), 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output supply - sets voltage level for associated I/O pins (1.2V to 3.3V) |
| P2 | IO_L0N_0 | Differential pair negative input for Bank 0 - supports LVDS, TMDS, RSDS signaling |
| T1 | IO_L1P_0 | Differential pair positive input for Bank 0 - paired with T2 for full-duplex differential I/O |
| Y17 | M0 | Configuration mode select - determines boot source (SPI, serial, or JTAG) |
| V16 | PROGRAM_B | Active-low asynchronous reset - initiates reconfiguration sequence when pulsed low |
| W18 | INIT_B | Open-drain status indicator - goes high-Z after successful configuration completion |
| U17 | CCLK | Configuration clock input - driven externally during slave serial mode or internally during master SPI |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Boot Support | Enables dual configuration images stored in external SPI flash, allowing fail-safe firmware rollback |
| SelectIO Technology | Per-bank I/O voltage control supports mixed-voltage system interfacing without level shifters |
| Partial Reconfiguration | Allows dynamic replacement of logic modules at runtime while preserving active functionality elsewhere |
| Dedicated Clock Resources | Eight global clock networks plus regional and I/O clocks reduce skew and simplify timing closure |
| ISE Design Suite Support | Fully compatible with Xilinx ISE 14.7 toolchain for synthesis, place-and-route, and bitstream generation |
Applications
| Industrial Motor Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time closed-loop servo drive with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric executes position loop control, generates synchronized 16-channel PWM, and processes quadrature encoder inputs. Use Value: 348 user I/Os enable direct connection to gate drivers, encoders, and analog front-ends; -3 speed grade ensures sub-100 ns control loop latency. | Use Scenario: Modular PXI-based instrument controller managing multiple DMM, SMU, and waveform generator modules. IC Role / Device Role / Timing Role: Configurable logic handles protocol bridging (LXI, GPIB, PCIe), trigger distribution, and real-time data buffering. Use Value: 220 DSP48A1 slices accelerate FFT-based signal analysis; dual-boot allows safe firmware updates without interrupting test sequences. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Ultrasound beamformer interface aggregating 128-channel echo data from ADCs before GPU transfer. IC Role / Device Role / Timing Role: High-bandwidth parallel I/O captures time-aligned sample streams; block RAM buffers frame data prior to PCIe transmission. Use Value: 1,824 Kbits of block RAM provides sufficient depth for two full 128×1024-sample frames; LVDS I/O supports 1.25 Gbps link rates to ADCs. | Use Scenario: ARINC 429/664 (AFDX) gateway consolidating sensor data from flight control, navigation, and environmental systems. IC Role / Device Role / Timing Role: Implements deterministic packet scheduling, CRC generation, and redundant channel arbitration logic. Use Value: Industrial temperature rating (–40°C to +100°C) meets DO-160E Section 22 Category E requirements; JTAG support enables in-system verification per DO-254. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FG484I | 147,443 logic cells, 2,184 Kbits block RAM, 328 DSP slices - higher resource density and bandwidth | Better suited for multi-channel video processing or high-throughput packet inspection where XC6SLX100T-N3FG484I reaches utilization limits | Select when design requires >120K logic cells or >200 DSP slices; same package enables drop-in upgrade path |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 4.3 Mb block RAM, 240 DSP slices, native PCIe Gen2 x2 support | Offers integrated transceivers and AXI interconnect; preferred for systems requiring high-speed serial uplinks or SoC-style integration | Choose for new designs needing PCIe, DDR3 controller, or lower static power; not pin-compatible with XC6SLX100T-N3FG484I |
Compared with XC6SLX100T-N3FG484I, the XC6SLX150T-3FG484I offers scalable logic headroom in identical packaging, while the XC7A100T-2CSG324I delivers modern transceiver and memory controller IP at the cost of board redesign and toolchain migration.
Availability
XC6SLX100T-N3FG484I is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX100T-N3FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and aerospace markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low power, small footprint, and reliable I/O interfacing - especially in industrial automation and legacy system upgrades.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100T-N3FG484I?
The XC6SLX100T-N3FG484I supports I/O voltages from 1.2 V to 3.3 V per bank, with independent VCCO supply for each of its 12 I/O banks. This allows mixed-voltage operation - for example, interfacing 1.8 V sensors and 3.3 V microcontrollers simultaneously. Each bank's VCCO must be set to match the connected peripheral's I/O voltage, and all pins within a bank share the same VCCO setting. The device does not support 5 V-tolerant inputs.
Does XC6SLX100T-N3FG484I support partial reconfiguration in production systems?
Yes, XC6SLX100T-N3FG484I supports partial reconfiguration through Xilinx ISE 14.7 tools and the PlanAhead implementation flow. It requires dedicated configuration logic (e.g., ICAP interface) and careful floorplanning to isolate reconfigurable regions. Field-deployed systems use this capability for dynamic function swapping - such as switching between ultrasound beamforming and Doppler processing kernels - without resetting the entire FPGA fabric or attached peripherals.
What configuration memory options are compatible with XC6SLX100T-N3FG484I?
XC6SLX100T-N3FG484I supports serial configuration from industry-standard SPI flash devices including Micron, Spansion, and Winbond families with densities from 2 MB to 32 MB. It is validated with Xilinx Platform Flash XL (XCFxxS/XCFxxP) PROMs and supports dual-image storage for multi-boot. Configuration can also be loaded via JTAG from a host processor or boundary-scan controller, enabling in-system programming and debugging.
Is XC6SLX100T-N3FG484I qualified for automotive applications?
No, XC6SLX100T-N3FG484I is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably within automotive under-hood ambient ranges, it lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and change notification protocols required for Tier 1 automotive ECUs. For automotive use, Xilinx recommends the Spartan-6Q family (e.g., XC6SLX100T-QFG484I) with extended qualification.
Can XC6SLX100T-N3FG484I interface directly with DDR2 memory?
No, XC6SLX100T-N3FG484I does not include a hard DDR2 memory controller. It supports DDR2 SDRAM interfacing only through soft logic implementations using IODELAY and ISERDES primitives, which require significant logic resources and careful timing closure. For robust, high-speed DDR2/DDR3 support, Xilinx recommends Spartan-6 LX150T or Artix-7 devices with dedicated MIG (Memory Interface Generator) IP and hardware memory controller blocks.
XC6SLX100T-N3FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX100T-N3FG484I FAQ
1.How can I place an order for XC6SLX100T-N3FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-N3FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-N3FG484I reliable?
The price and inventory of XC6SLX100T-N3FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-N3FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-N3FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-N3FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-N3FG484I?
XC6SLX100T-N3FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-N3FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-N3FG484I?
For technical support, including XC6SLX100T-N3FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-N3FG484I requirements.
6.How does Aetrix verify that XC6SLX100T-N3FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-N3FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-N3FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-N3FG484I?
All XC6SLX100T-N3FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-N3FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-N3FG484I part is unused and in its original packaging.
Return procedure for XC6SLX100T-N3FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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