AMD XC6SLX100T-N3FG676C
- Part No.:
- XC6SLX100T-N3FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100T-N3FG676C.pdf
- Description:
- IC FPGA 376 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,379
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Product details
Overview
XC6SLX100T-N3FG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,729 Kbits of block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with commercial temperature range (0°C to 85°C). It is used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX100T-N3FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2V/1.8V/2.5V/3.3V), LVDS/BLVDS differential signaling capability, and integrated clock management with six DCMs and one PLL.
Technical Context
The XC6SLX100T-N3FG676C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It supports SelectIO™ technology enabling single-ended and differential standards including SSTL, HSTL, LVCMOS, and LVDS across 12 I/O banks.
Its clocking architecture includes six Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction, plus one PLL for higher-frequency multiplication and jitter reduction. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - total available LUT+FF pairs for combinational and sequential logic implementation |
| Block RAM | 4,729 Kbits - distributed as 18-Kbit dual-port RAM blocks usable as memory or FIFO buffers |
| DSP Slices | 220 × DSP48A1 - each supports 18×18-bit multiply, accumulate, and pre-adder functions |
| I/O Pins | 480 user I/O - supports mixed-voltage operation across 12 configurable I/O banks |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case commercial conditions |
| Configuration Mode | Master Serial / Slave Serial / JTAG - enables flexible programming via SPI flash or host processor |
Pinout & Package
XC6SLX100T-N3FG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27×27 array, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 2.5 W under typical operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - sets logic levels for pins in Bank 0 |
| K1 | GCLK1 | Global clock input - low-skew routing to all clock-capable resources |
| P2 | M0 | Configuration mode select - determines boot source (SPI flash vs. processor) |
| T3 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration sequence |
| V4 | CCLK | Configuration clock - generated internally or supplied externally during slave serial mode |
| Y5 | DONE | Configuration status indicator - goes high when bitstream loading completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs + PLL | Six DCMs and one PLL provide precise clock synthesis, phase alignment, and jitter filtering without external components |
| SelectIO™ Technology | Supports 18 I/O standards including LVDS, SSTL-2, and HSTL-I with programmable drive strength and slew rate |
| Partial Reconfiguration | Enables dynamic module swapping in-system without full device reset - critical for real-time protocol adaptation |
| Embedded Block RAM | Configurable as true dual-port RAM, FIFO, or shift register - reduces external memory footprint in data buffering applications |
Applications
| Industrial Motor Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis synchronization and encoder feedback processing. IC Role / Device Role / Timing Role: FPGA fabric executes PID algorithms and generates PWM waveforms with sub-100 ns jitter; DCMs align encoder sampling clocks to motion control cycles. Use Value: Deterministic latency enables <5 µs loop update time, meeting IEC 61800-7 functional safety timing constraints. | Use Scenario: High-speed digital pattern generation and response analysis for semiconductor wafer testing. IC Role / Device Role / Timing Role: Configurable I/O banks drive and capture signals at 200+ Mbps per pin; DSP slices perform real-time pass/fail decision logic. Use Value: On-chip memory and logic reduce test vector storage latency, cutting test cycle time by up to 35% versus microcontroller-based solutions. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of ultrasound transducer channel data before transfer to GPU subsystem. IC Role / Device Role / Timing Role: LVDS receivers capture 64-channel echo data at 80 MSPS; block RAM buffers frames while FIR filters smooth noise in real time. Use Value: Parallel processing across 101K logic cells enables 16-bit pixel depth reconstruction at 30 fps without frame loss. | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control computers with deterministic latency. IC Role / Device Role / Timing Role: Dedicated I/O banks interface with multiple legacy avionics buses; DCMs generate synchronized timestamps for message correlation. Use Value: Hardware-level protocol handling eliminates software interrupt jitter, ensuring <1 µs timestamp accuracy required for DO-254 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FG676C | 147,443 logic cells, 5,888 Kbits BRAM, same package and pinout but higher resource count | Required for designs needing >120K LUTs or additional DSP slices beyond XC6SLX100T-N3FG676C capacity | Select when scaling logic density without PCB redesign; shares identical I/O banking and clocking architecture |
| XC7A100T-2CSG324C | Artix-7 architecture: 101,440 logic cells, 4,860 Kbits BRAM, 240 DSP slices, smaller 324-pin CSP package | Used where lower power, higher DSP throughput, or smaller footprint is prioritized over legacy Spartan-6 toolchain compatibility | Choose for new designs targeting Vivado toolflow and improved power efficiency; not pin-compatible with XC6SLX100T-N3FG676C |
Compared with XC6SLX100T-N3FG676C, the XC6SLX150T-3FG676C offers direct scalability within the same footprint and toolchain, while the XC7A100T-2CSG324C delivers better DSP performance and 30% lower static power but requires board layout change and migration to Vivado.
Availability
XC6SLX100T-N3FG676C is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX100T-N3FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. Xilinx pioneered programmable logic architectures for cost-sensitive, high-volume applications.
The Spartan-6 family was designed for embedded vision, industrial automation, and communications infrastructure where balanced logic density, I/O flexibility, and low power are essential.
FAQ
What is the maximum operating frequency of the XC6SLX100T-N3FG676C?
The XC6SLX100T-N3FG676C is rated at speed grade -3, guaranteeing timing closure up to 500 MHz for internal logic paths under worst-case commercial conditions (0°C to 85°C, VCCINT = 1.2 V ±3%). Actual achievable frequency depends on design complexity, routing, and I/O standard selection.
Does the XC6SLX100T-N3FG676C support partial reconfiguration?
Yes, the XC6SLX100T-N3FG676C supports partial reconfiguration through its ICAP interface and hierarchical design flow in ISE Design Suite. This allows dynamic replacement of logic modules without resetting the entire device, enabling runtime protocol adaptation in communication gateways and test instrumentation.
What configuration modes does the XC6SLX100T-N3FG676C support?
The XC6SLX100T-N3FG676C supports Master Serial (SPI flash), Slave Serial (host processor-driven), and JTAG configuration modes. Each mode uses distinct pin assignments and initialization sequences, with M0–M2 pins selecting the active mode during power-up.
Can the XC6SLX100T-N3FG676C interface directly with DDR2 memory?
Yes, the XC6SLX100T-N3FG676C supports DDR2 SDRAM interfaces via its SelectIO™ banks configured for SSTL-18 I/O standard. It includes dedicated DQS capture circuitry and phase-aligned clocking through DCM outputs to meet DDR2 timing requirements up to 400 Mbps data rate.
Is the XC6SLX100T-N3FG676C RoHS compliant?
Yes, the XC6SLX100T-N3FG676C is RoHS compliant and manufactured with lead-free packaging. The FG676 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.
XC6SLX100T-N3FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 376
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100T-N3FG676C FAQ
1.How can I place an order for XC6SLX100T-N3FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-N3FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-N3FG676C reliable?
The price and inventory of XC6SLX100T-N3FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-N3FG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-N3FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-N3FG676C transactions.
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5.How can I obtain technical support or documentation for XC6SLX100T-N3FG676C?
For technical support, including XC6SLX100T-N3FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-N3FG676C requirements.
6.How does Aetrix verify that XC6SLX100T-N3FG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-N3FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-N3FG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-N3FG676C?
All XC6SLX100T-N3FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-N3FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-N3FG676C part is unused and in its original packaging.
Return procedure for XC6SLX100T-N3FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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