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AMD XC6SLX100T-N3FG676I
- Part No.:
- XC6SLX100T-N3FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100T-N3FG676I.pdf
- Description:
- IC FPGA 376 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,302
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Product details
Overview
XC6SLX100T-N3FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 101,280 logic cells, 4.9 Mb of block RAM, 220 DSP48E1 slices, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is packaged in a 676-pin Fine-Pitch BGA (FG676) and used in industrial motor control systems requiring deterministic I/O timing and embedded processing.
For engineers reviewing the XC6SLX100T-N3FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (480 user I/Os), LVDS/PCIe-compatible transceivers, and support for DDR2/DDR3 memory interfaces in space-constrained industrial controllers.
Technical Context
The XC6SLX100T-N3FG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for high-speed I/O standards including LVCMOS, LVDS, and SSTL. Its clocking system includes four DCMs and two PLLs for jitter-reduced clock synthesis and phase alignment across multiple domains.
It supports configuration via Master SPI, Slave SelectMAP, or JTAG, and integrates internal configuration memory with fallback capability. Built-in analog-to-digital converter (XADC) provides dual 12-bit 1 MSPS monitoring of on-chip temperature and supply voltages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational and sequential logic capacity for custom IP integration |
| Block RAM | 4.9 Mb - enables large on-chip data buffering for video frame stores or protocol stacks |
| DSP Slices | 220 × DSP48E1 - supports real-time FIR filtering, FFT, and motor control algorithms |
| User I/O Pins | 480 - allows direct connection to sensors, encoders, and industrial fieldbus peripherals |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Operating Temp | –40°C to +100°C - qualified for deployment in uncooled factory automation cabinets |
| XADC Channels | 17-channel 12-bit - enables simultaneous monitoring of VCCINT, VCCAUX, die temperature, and external analog signals |
Pinout & Package
XC6SLX100T-N3FG676I is housed in a 27 mm × 27 mm, 676-ball Fine-Pitch BGA (FG676) package with 1.0 mm ball pitch and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 5.2 W under typical industrial operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% supply for logic fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V ±3% supply for I/O banks, configuration circuitry, and PLLs |
| VCCO | I/O bank power | Programmable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface design |
| CONFIG_IO | Configuration I/O | Dedicated pins for Master SPI or SelectMAP configuration modes; not usable as general-purpose I/O |
| CLKIN | Primary clock input | Differential-capable input supporting LVDS, LVPECL, or single-ended CMOS clocks up to 500 MHz |
| INIT_B | Configuration status | Open-drain output indicating configuration success/failure; drives external reset logic |
Key Features
| Feature | Design Value |
|---|---|
| Integrated XADC | On-die 12-bit ADC with 17 analog inputs eliminates need for external monitoring ICs in motor drive designs |
| Dual-Register Flip-Flops | Each LUT output can drive two independent registers, improving timing margin and reducing logic depth in control loops |
| SelectIO Technology | Supports 21 I/O standards including LVDS, SSTL-2, HSTL-I, and PCI-X; enables direct interfacing to industrial SERDES links |
| DCM + PLL Clock Management | Four DCMs and two PLLs allow independent clock domain generation for encoder capture, PWM, and communication peripherals |
| Fallback Configuration | Automatic reversion to backup bitstream upon CRC error ensures continuous operation in safety-critical motion control systems |
Applications
| Industrial Motor Drive Controller | Factory Automation PLC Module |
|---|---|
Use Scenario: Real-time closed-loop control of 3-phase PMSM motors with field-oriented control (FOC) and current sensing. IC Role / Device Role / Timing Role: FPGA fabric executes FOC algorithm, generates synchronized PWM outputs, and captures encoder position via differential LVDS inputs. Use Value: 220 DSP48E1 slices enable sub-1 µs vector rotation computation; 480 I/Os support dual encoder interfaces and isolated gate driver control. | Use Scenario: Modular I/O expansion unit for distributed control systems with analog input, digital I/O, and EtherCAT slave interface. IC Role / Device Role / Timing Role: Configurable logic manages time-critical EtherCAT frame processing, local analog signal conditioning, and hot-swap I/O supervision. Use Value: Integrated XADC monitors 16 channels of sensor inputs; LVDS I/O supports 100 Mbps EtherCAT PHY interface without external level shifters. |
| Railway Signaling Interface Unit | Medical Imaging Data Acquisition |
Use Scenario: Safety-certified trackside interface handling axle counter pulses, signal lamp status, and interlocking logic. IC Role / Device Role / Timing Role: Deterministic logic fabric implements SIL-2 compliant voting logic, pulse width measurement, and fail-safe output gating. Use Value: –40°C to +100°C rating ensures reliability in outdoor rail cabinets; fallback configuration prevents runtime bitstream corruption during EMI events. | Use Scenario: High-speed raw data aggregation from multi-channel CT detector arrays before compression and transmission. IC Role / Device Role / Timing Role: FPGA buffers parallel ADC streams, performs pixel-level gain correction, and formats data for PCIe Gen2 host transfer. Use Value: 4.9 Mb block RAM holds full-frame detector data; 500 MHz speed grade sustains 200 MSPS aggregate sampling rate across 32 channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based industrial control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-N3FGG676I | 147,443 logic cells, 5.2 Mb BRAM, same FG676 package but higher static power and larger die area | Targeted at more complex motion profiles with dual-axis interpolation and integrated safety logic | Choose when additional logic resources are required for redundant control paths or expanded protocol stacks |
| XC7K160T-2FFG676I | Kintex-7 architecture: 162,240 logic cells, 6.1 Mb BRAM, 360 DSP slices, 2.5x higher performance per watt | Requires migration to Vivado toolchain and revised PCB layout due to different pinout and power delivery | Consider for new designs needing higher throughput or future-proofing with PCIe Gen3 and DDR4 support |
Compared with XC6SLX100T-N3FG676I, the XC6SLX150T offers headroom for feature expansion within identical footprint and toolflow, while the XC7K160T delivers architectural upgrades at the cost of redesign effort and toolchain transition.
Availability
XC6SLX100T-N3FG676I is available at Aetrix Electronics and suitable for industrial motor drives, factory automation PLC modules, and railway signaling interface units requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-N3FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, industrial, and automotive markets.
The Spartan-6 family was designed for cost-sensitive, high-volume industrial and embedded applications requiring reliable I/O flexibility, low-power operation, and long-term availability-without sacrificing deterministic timing or configurability.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100T-N3FG676I?
The XC6SLX100T-N3FG676I supports I/O bank voltages from 1.2 V to 3.3 V, configurable per bank. Each bank can be independently set to LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, SSTL18_I, SSTL2_I, HSTL_I, or LVDS. This enables mixed-voltage board design without level-shifting components. XC6SLX100T-N3FG676I must be powered with appropriate VCCO supplies matching the selected standard.
Does XC6SLX100T-N3FG676I include an on-chip analog-to-digital converter?
Yes, XC6SLX100T-N3FG676I integrates the Xilinx Analog-to-Digital Converter (XADC), a dual 12-bit, 1 MSPS ADC with 17 analog input channels. It monitors internal parameters such as die temperature and VCCINT/VCCAUX supply voltages, and accepts external analog signals for system health monitoring. XC6SLX100T-N3FG676I uses this capability in industrial applications for real-time thermal and power integrity checks.
What configuration modes does XC6SLX100T-N3FG676I support?
XC6SLX100T-N3FG676I supports three primary configuration modes: Master SPI (using on-chip oscillator), Slave SelectMAP (parallel synchronous), and JTAG boundary-scan. It also supports fallback configuration-automatically loading a backup bitstream if CRC verification fails. XC6SLX100T-N3FG676I uses these modes to ensure robust startup and field-upgrade capability in unattended industrial equipment.
Is XC6SLX100T-N3FG676I qualified for industrial temperature operation?
Yes, XC6SLX100T-N3FG676I carries the "I" suffix denoting industrial temperature grade, rated from –40°C to +100°C junction temperature. It undergoes extended burn-in and characterization across this range, and its timing models are validated for worst-case conditions. XC6SLX100T-N3FG676I is commonly deployed in fanless control cabinets and outdoor railway enclosures where ambient extremes occur.
Can XC6SLX100T-N3FG676I interface directly with DDR3 memory?
No, XC6SLX100T-N3FG676I supports DDR2 memory interfaces up to 400 Mbps data rate but does not natively support DDR3. Its memory controller IP targets DDR2-400, LPDDR, and QDR-II/II+ protocols. For DDR3 compatibility, XC6SLX100T-N3FG676I requires external PHY or migration to 7-series FPGAs. Designers must verify memory interface timing using Xilinx ISE tools and the XC6SLX100T-N3FG676I-specific IBIS models.
XC6SLX100T-N3FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 376
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100T-N3FG676I FAQ
1.How can I place an order for XC6SLX100T-N3FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-N3FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-N3FG676I reliable?
The price and inventory of XC6SLX100T-N3FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-N3FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-N3FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-N3FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-N3FG676I?
XC6SLX100T-N3FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-N3FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-N3FG676I?
For technical support, including XC6SLX100T-N3FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-N3FG676I requirements.
6.How does Aetrix verify that XC6SLX100T-N3FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-N3FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-N3FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-N3FG676I?
All XC6SLX100T-N3FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-N3FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-N3FG676I part is unused and in its original packaging.
Return procedure for XC6SLX100T-N3FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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