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AMD XC6SLX100T-N3FG900I
- Part No.:
- XC6SLX100T-N3FG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX100T-N3FG900I.pdf
- Description:
- IC FPGA 498 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,367
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Product details
Overview
XC6SLX100T-N3FG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,729 kbits of block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is used in industrial vision systems for real-time image preprocessing and protocol bridging.
For engineers reviewing the XC6SLX100T-N3FG900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (544 user I/Os), LVDS support, embedded memory depth, and compatibility with Xilinx ISE 14.7 design tools.
Technical Context
The XC6SLX100T-N3FG900I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates six CMT clock management tiles-each containing two DCMs-for jitter-reduced clock synthesis and phase alignment across multiple domains.
It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS, Mini-LVDS, RSDS, and BLVDS. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external SPI flash or PROM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for HDL implementation |
| Block RAM | 4,729 kbits - supports FIFOs, frame buffers, and data caching without external memory |
| DSP Slices | 220 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| User I/O Pins | 544 - provides high-density interface routing for parallel buses, camera sensors, and FMC connectors |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Operating Temp | –40°C to +100°C - qualified for deployment in enclosed industrial enclosures without forced cooling |
| Package | FG900 - 900-pin Fine-Pitch Ball Grid Array (FBGA), 31×31 mm, 1.0 mm pitch |
Pinout & Package
XC6SLX100T-N3FG900I is housed in a 900-ball fine-pitch BGA (FG900) package with 544 user-configurable I/Os distributed across 16 banks. Power delivery includes dedicated VCCINT (1.2 V), VCCAUX (2.5 V), and VCCO (1.2–3.3 V selectable per bank) pins, plus multiple ground and decoupling ball assignments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion |
| H19 | INIT_B | Active-low bidirectional initialization and reconfiguration control |
| K18 | CCLK | Configuration clock input for Master Serial mode; drives internal config logic |
| M20 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and restarts boot |
| P19 | TCK | JTAG test clock input for boundary-scan and debug access |
| R18 | TMS | JTAG test mode select controlling TAP controller state transitions |
| T19 | TDO | JTAG test data output carrying scan-out results during debug or verification |
| U18 | TDI | JTAG test data input feeding instruction/data into the boundary-scan register |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Supports DDR2/DDR3 SDRAM up to 800 Mbps with built-in calibration and timing closure assistance |
| PCI Express Endpoint | Hard IP block compliant with PCIe Gen1 x1/x2/x4, enabling direct host CPU communication |
| Embedded Multi-Gigabit Transceivers | None - XC6SLX100T lacks transceivers; this feature applies only to LX150T and higher variants |
| SelectIO Technology | Per-bank voltage support (1.2–3.3 V) and programmable slew rate/driver strength for noise-sensitive interfaces |
| ISE Design Suite Support | Fully supported in Xilinx ISE 14.7 with place-and-route, timing analysis, and bitstream generation |
Applications
| Industrial Machine Vision | Programmable Logic Controllers (PLC) |
|---|---|
Use Scenario: Real-time pixel-level filtering and multi-camera synchronization in automated optical inspection systems. IC Role / Device Role / Timing Role: Configurable logic fabric processes sensor data streams while CMT blocks align camera trigger and frame capture clocks. Use Value: Enables sub-microsecond inter-camera skew correction and on-FPGA histogram equalization without external processors. | Use Scenario: Deterministic I/O scanning and fieldbus protocol translation (e.g., EtherCAT to Modbus TCP) in modular PLC backplanes. IC Role / Device Role / Timing Role: Acts as a protocol gateway and cyclic I/O mapper with deterministic latency under 10 µs per scan cycle. Use Value: Reduces system latency by eliminating software-based protocol stacks and supports hot-swappable I/O modules via reconfigurable logic. |
| Medical Imaging Front-End | Test & Measurement Equipment |
Use Scenario: Time-of-flight compensation and analog front-end digitization control in portable ultrasound beamformers. IC Role / Device Role / Timing Role: Coordinates ADC sampling, digital gain control, and FIR filter execution using synchronous logic and block RAM-based coefficient storage. Use Value: Achieves 12-bit effective resolution at 40 MSPS with <1 LSB integral nonlinearity drift over temperature. | Use Scenario: High-precision waveform generation and real-time FFT analysis in benchtop signal analyzers. IC Role / Device Role / Timing Role: Hosts custom DDS engines and streaming FFT cores synchronized to ultra-low-jitter reference clocks. Use Value: Delivers 14-bit spectral purity up to 100 MHz with on-chip windowing and zero-padding logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FG900I | 147,443 logic cells, 5,298 kbits BRAM, same FG900 package and pinout | Supports larger state machines and deeper pipeline stages for complex motion control algorithms | Choose when design requires >120k logic cells or additional DSP slices without changing PCB layout |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 4,915 kbits BRAM, 240 DSP48E1 slices, CSG324 package (324-pin CSP) | Higher DSP throughput and native PCIe Gen2 x4 support; incompatible pinout and voltage requirements | Choose for new designs requiring higher performance density or Gen2 PCIe, accepting full board redesign |
Compared with XC6SLX100T-N3FG900I, the XC6SLX150T offers scalable logic headroom within identical mechanical and thermal constraints, while the XC7A100T delivers architectural improvements-including enhanced DSP efficiency and lower static power-at the cost of package and toolchain incompatibility.
Availability
XC6SLX100T-N3FG900I is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-N3FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic integration, reliable I/O flexibility, and long-term industrial availability-particularly where legacy ISE toolchain support remains essential.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100T-N3FG900I?
The XC6SLX100T-N3FG900I supports I/O voltages from 1.2 V to 3.3 V per bank, with VCCO independently configured per I/O bank. Each bank must be set to a single voltage level, and compatible standards include LVCMOS, LVTTL, SSTL, HSTL, and differential protocols like LVDS and RSDS. This allows mixed-voltage interfacing without level shifters.
Does XC6SLX100T-N3FG900I include built-in PCI Express capability?
Yes, the XC6SLX100T-N3FG900I integrates a hard PCIe endpoint block compliant with PCI Express Base Specification v1.1, supporting Gen1 x1, x2, and x4 link widths. It handles physical layer signaling, data link layer ACK/NAK, and transaction layer request/completion handling without soft-core overhead.
What configuration modes are supported by XC6SLX100T-N3FG900I?
The XC6SLX100T-N3FG900I supports Master Serial, Slave Serial, JTAG, and Boundary Scan configuration modes. Master Serial uses an external SPI flash; Slave Serial accepts configuration data from a microcontroller; JTAG enables programming and debugging; Boundary Scan verifies interconnect integrity before and after configuration.
Is XC6SLX100T-N3FG900I qualified for automotive applications?
No, the XC6SLX100T-N3FG900I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure rate reporting, and extended temperature validation required for under-hood or safety-critical vehicle systems.
Can XC6SLX100T-N3FG900I interface directly with DDR3 SDRAM?
Yes, the XC6SLX100T-N3FG900I includes a dedicated DDR2/DDR3 memory controller hard IP block supporting data rates up to 800 Mbps. It provides automatic calibration, read/write leveling, and timing closure assistance for x8/x16/x32 configurations with discrete or packaged DDR3 components.
XC6SLX100T-N3FG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX100T-N3FG900I FAQ
1.How can I place an order for XC6SLX100T-N3FG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-N3FG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-N3FG900I reliable?
The price and inventory of XC6SLX100T-N3FG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-N3FG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-N3FG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-N3FG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-N3FG900I?
XC6SLX100T-N3FG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-N3FG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-N3FG900I?
For technical support, including XC6SLX100T-N3FG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-N3FG900I requirements.
6.How does Aetrix verify that XC6SLX100T-N3FG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-N3FG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-N3FG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-N3FG900I?
All XC6SLX100T-N3FG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-N3FG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-N3FG900I part is unused and in its original packaging.
Return procedure for XC6SLX100T-N3FG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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