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AMD XC6SLX100T-N3FGG484I
- Part No.:
- XC6SLX100T-N3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX100T-N3FGG484I.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,021
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Product details
Overview
XC6SLX100T-N3FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18 Kbit block RAM, and 200 user I/Os in a 484-pin Fine-Pitch Flip-Chip BGA (FFG) package. It supports LVCMOS/LVTTL, SSTL, and HSTL I/O standards with differential signaling capability and is used in industrial motor control interface modules requiring deterministic timing and reconfigurable logic.
For engineers reviewing the XC6SLX100T-N3FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded DSP slice count, total block RAM capacity, and -3 speed grade timing performance for real-time control loop implementation.
Technical Context
The XC6SLX100T-N3FGG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48A1 slices for arithmetic-intensive tasks, and dual-port block RAM for data buffering. It integrates six CMT clock management tiles supporting phase-matched clocking across multiple domains.
Configuration is performed via Master Serial or Slave SelectMAP modes using external SPI flash or processor-controlled parallel interface. The device supports JTAG boundary-scan testing and partial reconfiguration through ICAP interface, enabling runtime logic updates without full system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom state machines or protocol engines |
| Block RAM | 2,192 Kbits (18 Kbit × 122 blocks) - enables local data storage for FIFOs, lookup tables, or frame buffers |
| DSP Slices | 180 - provides hardware-accelerated multiply-accumulate operations for servo control algorithms |
| User I/Os | 200 - supports mixed-voltage interfaces including 3.3V, 2.5V, 1.8V, and 1.2V banks |
| Speed Grade | -3 - guarantees worst-case propagation delay of 1.1 ns for LUT-to-LUT paths at junction temperature ≤85°C |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, Differential LVDS - allows direct connection to ADCs, encoders, and industrial buses |
Pinout & Package
XC6SLX100T-N3FGG484I is housed in a 484-pin Fine-Pitch Flip-Chip BGA (FFG) package with 23×23 mm body size, 1.0 mm ball pitch, and Pb-free RoHS-compliant finish. Thermal pad on underside requires solder paste stencil design per Xilinx UG381.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 4.7 µF capacitors near package corner |
| P2 | IO_L1P_T0_0 | Differential pair positive input - supports LVDS receiver operation up to 640 Mbps |
| R1 | IO_L1N_T0_0 | Differential pair negative input - routed as matched-length pair with P2 for signal integrity |
| T14 | M0 | Configuration mode select - tied low to enable Master Serial mode with external SPI flash |
| U13 | INIT_B | Open-drain status output - asserted low during configuration failure or CRC error detection |
| V15 | CCLK | Configuration clock input - driven by external oscillator or FPGA-generated clock during slave mode |
Key Features
| Feature | Design Value |
|---|---|
| Embedded DSP48A1 slices | Hardware multiplier-accumulator units enabling 18-bit × 18-bit multiplication at 250 MHz for motion control PID loops |
| Multi-voltage I/O banks | Independent VCCO per bank allows simultaneous interfacing with 3.3V sensors and 1.2V FPGAs or ASICs |
| Clock Management Tiles (CMT) | Six CMTs provide phase-shifted, frequency-synthesized clocks for encoder sampling and PWM generation |
| Partial Reconfiguration Support | Runtime logic update capability via ICAP port reduces downtime in field-upgradable industrial controllers |
Applications
| Industrial Motor Control Interface | Programmable Logic Relay Module |
|---|---|
Use Scenario: Real-time closed-loop control of three-phase AC induction motors using encoder feedback and space-vector PWM. IC Role / Device Role / Timing Role: FPGA fabric implements position loop, current loop, and PWM generator with sub-microsecond latency. Use Value: Deterministic timing ensures ±50 ns jitter on PWM edges, critical for torque ripple reduction. | Use Scenario: Replacement of electromechanical relays in factory automation panels with programmable logic and diagnostics. IC Role / Device Role / Timing Role: Configurable I/O matrix routes sensor inputs to safety logic and drives solid-state outputs with watchdog supervision. Use Value: 200 user I/Os support 32-channel discrete I/O expansion with independent voltage domain control. |
| Machine Vision Preprocessing Unit | Fieldbus Protocol Bridge |
Use Scenario: On-camera image filtering and feature extraction before transmission over GigE Vision link. IC Role / Device Role / Timing Role: Block RAM buffers frame data while DSP slices perform Sobel edge detection in pipeline. Use Value: 2,192 Kbits of distributed RAM enables 1280×720@30fps grayscale frame buffering without external memory. | Use Scenario: Translation between Modbus RTU (RS-485) and EtherCAT slave interfaces in PLC backplanes. IC Role / Device Role / Timing Role: Dual-port BRAM stores protocol state machines; I/O banks handle differential RS-485 and twisted-pair EtherCAT PHY signals. Use Value: LVDS-capable I/Os meet EtherCAT's 100 Mbps electrical requirements without level-shifter components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG484I | 147,440 logic cells, 2,664 Kbits block RAM, same package and speed grade | Higher gate count supports larger motion control algorithms or dual-axis coordination logic | Select when additional CLBs or BRAM required beyond XC6SLX100T-N3FGG484I capacity |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 4,050 Kbits BRAM, -2 speed grade, 324-pin CSPBGA | Lower static power, enhanced DSP48E1 slices, but different pinout and configuration interface | Choose for new designs prioritizing power efficiency and higher DSP throughput, accepting board redesign |
Compared with XC6SLX100T-N3FGG484I, XC6SLX150T-3FGG484I offers scalable logic density in identical footprint, while XC7A100T-2CSG324I delivers architectural improvements at the cost of layout compatibility - both require distinct PCB and toolchain validation.
Availability
XC6SLX100T-N3FGG484I is available at Aetrix Electronics and suitable for industrial motor control, programmable relay modules, and fieldbus protocol bridging requiring stable component supply throughout extended product lifecycles.
Supply support for XC6SLX100T-N3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets following its acquisition of Xilinx in 2022.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power reconfigurable logic with robust I/O flexibility and industrial temperature support.
FAQ
What is the operating temperature range for XC6SLX100T-N3FGG484I?
The XC6SLX100T-N3FGG484I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is validated per Xilinx DS162 and applies to all speed grades within the Spartan-6 LX100T device family. Thermal derating curves and PCB copper pour guidelines are provided in UG381 for sustained operation at maximum ambient conditions.
Does XC6SLX100T-N3FGG484I support JTAG boundary-scan testing?
Yes, XC6SLX100T-N3FGG484I fully supports IEEE 1149.1 JTAG boundary-scan testing. The TAP controller implements mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and optional IDCODE, USERCODE, and HIGHZ. Configuration pins TCK, TMS, TDI, and TDO are dedicated and electrically compliant with JTAG voltage thresholds specified in DS162.
Can XC6SLX100T-N3FGG484I be configured using SPI flash memory?
Yes, XC6SLX100T-N3FGG484I supports Master Serial configuration mode using standard quad-SPI or single-SPI flash devices. Pins M0–M2 configure the mode, and the CCLK signal is generated internally. Configuration bitstream loading occurs automatically after power-up when INIT_B deasserts, per UG380 Section 5.2.
What I/O standards are supported on XC6SLX100T-N3FGG484I banks?
XC6SLX100T-N3FGG484I supports LVCMOS (1.2V–3.3V), LVTTL, SSTL-2/3, HSTL-I/II, and differential standards including LVDS, BLVDS, and RSDS. Each of the 12 I/O banks operates independently, allowing mixed-voltage interfaces. Bank-specific VCCO and VREF requirements are detailed in DS162 Table 13.
Is partial reconfiguration supported on XC6SLX100T-N3FGG484I?
Yes, XC6SLX100T-N3FGG484I supports partial reconfiguration via the Internal Configuration Access Port (ICAP). This enables dynamic logic updates to designated regions without resetting the entire device. Implementation requires PlanAhead or Vivado tools with appropriate floorplanning and checkpointing, as documented in UG702 Chapter 4.
XC6SLX100T-N3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX100T-N3FGG484I FAQ
1.How can I place an order for XC6SLX100T-N3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-N3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-N3FGG484I reliable?
The price and inventory of XC6SLX100T-N3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-N3FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-N3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-N3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-N3FGG484I?
XC6SLX100T-N3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-N3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-N3FGG484I?
For technical support, including XC6SLX100T-N3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-N3FGG484I requirements.
6.How does Aetrix verify that XC6SLX100T-N3FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-N3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-N3FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-N3FGG484I?
All XC6SLX100T-N3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-N3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-N3FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX100T-N3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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