My Inquiry
My Account
AMD XC6SLX100T-N3FGG676C
- Part No.:
- XC6SLX100T-N3FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100T-N3FGG676C.pdf
- Description:
- IC FPGA 376 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,813
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX100T-N3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,795 Kbits of block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with 1.2 V core voltage. It is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX100T-N3FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2 V to 3.3 V), LVDS/BLVDS differential signaling support, and integrated clock management with DCM and PLL resources.
Technical Context
The XC6SLX100T-N3FGG676C implements a configurable logic fabric based on 6-input LUTs and flip-flops per CLB, with dedicated carry logic for arithmetic functions. It integrates dual-register 18 Kb block RAM with byte-write enable and true dual-port capability.
Its clocking architecture includes two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL), supporting frequency synthesis, phase shifting, and duty-cycle correction across up to eight user clocks per DCM and four per PLL.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - provides gate count equivalent to ~600K ASIC gates for medium-complexity digital logic implementation |
| Block RAM | 4,795 Kbits - supports large FIFOs, data buffering, or small on-chip memory arrays without external SRAM |
| DSP Slices | 220 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz for filtering or motor control |
| I/O Pins | 480 user I/Os - configurable as single-ended or differential standards including LVCMOS, LVTTL, LVDS, and BLVDS |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequencies specified in the data sheet for worst-case junction temperature |
| Core Voltage | 1.2 V ±3% - requires tight regulation; compatible with standard DC-DC converters for FPGA power domains |
Pinout & Package
XC6SLX100T-N3FGG676C is housed in a 676-ball Fine-Pitch BGA (FGG676) package with 1.0 mm ball pitch, 27 × 27 array, and thermal pad. Pin assignments follow Xilinx's standardized bank-based I/O architecture with dedicated configuration, clock, and JTAG pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | PROGRAM_B | Active-low asynchronous reset input that initiates configuration reload from external SPI flash or master serial mode |
| H17 | INIT_B | Open-drain status output indicating configuration memory readiness; pulled high externally during valid bitstream load |
| K19 | CCLK | Configuration clock input/output - drives internal configuration logic or outputs clock during master serial programming |
| T18 | TCK | JTAG test clock input for boundary-scan and debug access via IEEE 1149.1 interface |
| R18 | TMS | JTAG test mode select controlling state transitions in TAP controller during programming or debugging |
| P18 | TDO | JTAG test data output carrying scan-out results from device boundary-scan register or debug logic |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two DCMs + one PLL per device - enables precise clock synthesis, skew control, and jitter reduction for synchronous system design |
| Multi-Voltage I/O Banks | Eight independent I/O banks supporting 1.2 V to 3.3 V - allows direct interfacing with mixed-voltage peripherals without level shifters |
| Partial Reconfiguration Support | Hardware-accelerated dynamic module swapping - permits runtime logic updates without full device reset or system interruption |
| Embedded Block RAM | True dual-port 18 Kb blocks with byte-enable - supports concurrent read/write operations for pipelined data paths or ping-pong buffering |
| Configurable Logic Blocks | 6-input LUTs with distributed RAM and shift register modes - delivers flexible logic implementation and efficient small-memory structures |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution with sub-microsecond latency for multi-axis CNC machines. IC Role / Device Role / Timing Role: FPGA fabric implements PID controllers, encoder interpolation, and PWM generation with deterministic timing. Use Value: 220 DSP48A1 slices enable simultaneous 32-bit multiply-accumulate at 200+ MHz, meeting hard real-time cycle budget. | Use Scenario: High-speed digital pattern generation and response capture in semiconductor wafer testing. IC Role / Device Role / Timing Role: Configurable I/O banks drive and sample signals at 200+ Mbps using LVDS, synchronized to internal DCM-generated clocks. Use Value: 480 user I/Os support parallel 128-channel vector I/O with per-pin delay calibration and programmable slew rate. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of ultrasound transducer channel data before transfer to host processor. IC Role / Device Role / Timing Role: Block RAM buffers raw ADC streams while DSP slices perform beamforming correlation in real time. Use Value: 4,795 Kbits of embedded RAM eliminates need for external DDR2/3, reducing board area and EMI emissions. | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control subsystems with deterministic latency. IC Role / Device Role / Timing Role: Dedicated I/O banks isolate legacy avionics buses; DCMs generate precise 1 MHz and 4 MHz ARINC clocks. Use Value: Dual DCMs provide independent clock domains for receive/transmit paths, ensuring <50 ns jitter for time-critical bus arbitration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG676C | 147,443 logic cells, 5,292 Kbits BRAM, same package - higher density and memory capacity | Suitable for larger state machines or additional protocol stacks (e.g., PCIe endpoint logic) | Select when design exceeds XC6SLX100T resource utilization by >15% and requires identical pinout compatibility |
| XC7S100-2FTG256I | Artix-7 family, 100K logic cells, 4.9 Mb BRAM, 2.5 V/3.3 V I/O, smaller 256-pin FTBGA - no DCM, only PLL-based clocking | Better suited for low-power, cost-sensitive designs where partial reconfiguration is not required | Choose for new designs prioritizing lower static power and simplified clock tree, accepting loss of DCM-based fine-grained phase control |
Compared with XC6SLX100T-N3FGG676C, the XC6SLX150T offers headroom for feature expansion within the same footprint, while the XC7S100 trades DCM flexibility and legacy toolchain support for reduced power and modern synthesis flow compatibility.
Availability
XC6SLX100T-N3FGG676C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX100T-N3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. Xilinx pioneered programmable logic architecture and system-level integration for embedded applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - targeting industrial, automotive, and medical end equipment.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100T-N3FGG676C?
The XC6SLX100T-N3FGG676C supports I/O voltages from 1.2 V to 3.3 V across its eight independent I/O banks. Each bank must be configured with a single VCCO voltage, and bank-specific VREF is required for certain standards like SSTL or HSTL. This allows direct interfacing with mixed-voltage peripherals without external level-shifting circuitry.
Does XC6SLX100T-N3FGG676C support partial reconfiguration?
Yes, XC6SLX100T-N3FGG676C supports hardware-accelerated partial reconfiguration through Xilinx ISE Design Suite tools. This enables dynamic replacement of logic modules during operation without resetting the entire device, critical for applications such as adaptive signal processing or field-upgradable protocol stacks.
What clock resources are integrated into XC6SLX100T-N3FGG676C?
XC6SLX100T-N3FGG676C integrates two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL). The DCMs provide fine-grained phase shifting, frequency synthesis, and duty-cycle correction, while the PLL supports wider multiplication/division ranges and lower jitter for high-frequency clock generation.
Is XC6SLX100T-N3FGG676C RoHS compliant and lead-free?
Yes, XC6SLX100T-N3FGG676C is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The FGG676 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for standard surface-mount assembly processes.
What configuration modes does XC6SLX100T-N3FGG676C support?
XC6SLX100T-N3FGG676C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Configuration bitstreams can be loaded from external SPI flash (Master Serial), microcontroller (Slave modes), or boundary-scan chain (JTAG), enabling flexible boot architectures and in-system programming.
XC6SLX100T-N3FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 376
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100T-N3FGG676C FAQ
1.How can I place an order for XC6SLX100T-N3FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-N3FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-N3FGG676C reliable?
The price and inventory of XC6SLX100T-N3FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-N3FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-N3FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-N3FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-N3FGG676C?
XC6SLX100T-N3FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-N3FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-N3FGG676C?
For technical support, including XC6SLX100T-N3FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-N3FGG676C requirements.
6.How does Aetrix verify that XC6SLX100T-N3FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-N3FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-N3FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-N3FGG676C?
All XC6SLX100T-N3FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-N3FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-N3FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX100T-N3FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX100T-N3FGG676C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
