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AMD XC6SLX100T-N3FGG676I
- Part No.:
- XC6SLX100T-N3FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100T-N3FGG676I.pdf
- Description:
- IC FPGA 376 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,572
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Product details
Overview
XC6SLX100T-N3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,729 Kbits of block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX100T-N3FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), LVDS-compatible banks, SelectIO™ voltage support (1.2V–3.3V), and configuration via SPI/BPI/master serial modes.
Technical Context
The XC6SLX100T-N3FGG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates clock management using DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty cycle correction across up to 16 global clock networks.
I/O banks are organized into eight groups with independent VCCO and VREF settings per bank, enabling mixed-voltage interface operation. Configuration is supported through JTAG, master serial (SPI), slave serial, and BPI parallel modes, with dual-boot capability via fallback address mapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - total configurable logic resources for combinational and sequential logic implementation |
| Block RAM | 4,729 Kbits - distributed as 18-Kbit dual-port RAM blocks usable as FIFOs or data buffers |
| DSP Slices | 220 × DSP48A1 - each supports 18×18-bit multiply, accumulate, and pre-adder functions |
| User I/O Pins | 480 - support LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS |
| Speed Grade | -3 - guarantees timing performance up to 500 MHz system clock with worst-case industrial temp/voltage |
| Operating Temp | –40°C to +100°C - qualified for extended industrial environments without derating |
| Configuration Mode | Master Serial (SPI), Slave Serial, JTAG, BPI - enables flexible boot and field update options |
Pinout & Package
XC6SLX100T-N3FGG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27×27 array, 1.0 mm ball pitch, and 35 mm × 35 mm body size. The package supports thermal dissipation via exposed thermal pad (EP) and provides signal integrity features including ground/power ball shielding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered locally with 10 µF + 0.1 µF decoupling |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration and I/O banks - shared across multiple banks |
| Y1 | VCCO_0 | Bank 0 I/O output voltage - sets logic level for all pins in Bank 0 (pins A1–D18) |
| M14 | PROGRAM_B | Active-low asynchronous reset - initiates configuration reload when pulsed low |
| T15 | INIT_B | Open-drain status output - goes high-Z after successful configuration completion |
| R16 | CCLK | Configuration clock input - driven externally in master serial mode or internally during JTAG |
| W18 | DONE | Open-drain configuration status - pulled high externally to indicate valid configuration lock |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset - critical for runtime protocol adaptation |
| SelectIO™ Technology | Per-bank voltage and standard flexibility - allows concurrent 1.8 V LVCMOS and 3.3 V LVTTL interfaces |
| Dual-Boot Capability | Two independent bitstreams stored in external flash - supports fail-safe firmware rollback |
| DCM-Based Clock Management | Provides jitter < ±100 ps over temperature - sufficient for 100 Mbps parallel bus timing closure |
| ISE Design Suite Compatibility | Full toolchain support through Xilinx ISE 14.7 - no migration required for legacy Spartan-6 designs |
Applications
| Industrial Motion Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time servo loop execution with sub-microsecond latency requirements in CNC machine controllers. IC Role / Device Role / Timing Role: FPGA fabric executes position/velocity PID loops; DCMs synchronize encoder sampling and PWM generation. Use Value: 480 user I/Os enable direct connection to 16-axis encoder interfaces and isolated PWM outputs without glue logic. | Use Scenario: Multi-channel digital pattern generation and acquisition in boundary-scan test platforms. IC Role / Device Role / Timing Role: Configurable I/O banks drive and capture signals at 100+ MHz with precise setup/hold margins. Use Value: LVDS-capable banks support 200 Mbps differential signaling for high-fidelity stimulus/response capture. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of multi-sensor data streams from ultrasound transducer arrays. IC Role / Device Role / Timing Role: Block RAM buffers real-time echo data; DSP slices perform beamforming coefficient multiplication. Use Value: 4,729 Kbits of embedded RAM eliminates need for external frame buffers in compact probe designs. | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control subsystems. IC Role / Device Role / Timing Role: Dedicated logic implements protocol state machines; DCMs generate precise 1 MHz and 2 MHz bus clocks. Use Value: Industrial temperature rating ensures reliable operation in unpressurized avionics bays (-40°C to +100°C). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG676I | 147,440 logic cells, 5,312 Kbits BRAM, same package - higher density but no speed or temp upgrade | Supports larger algorithm implementations (e.g., multi-axis interpolation with lookahead) | Select when design requires >100K logic cells while retaining identical footprint and thermal profile |
| XC7S100-2FTG676I | Artix-7 architecture, 101,440 logic cells, 4,010 Kbits BRAM, -2 speed grade - newer process, lower static power | Lacks native Spartan-6 ISE toolchain support; requires Vivado migration | Choose for new designs prioritizing power efficiency and long-term roadmap continuity over legacy tool compatibility |
Compared with XC6SLX100T-N3FGG676I, the XC6SLX150T-3FGG676I offers headroom for logic expansion without layout change, while the XC7S100-2FTG676I reduces static power by ~35% but mandates toolchain and IP migration.
Availability
XC6SLX100T-N3FGG676I is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-lifecycle support.
Supply support for XC6SLX100T-N3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial and embedded systems.
FAQ
What is the maximum operating frequency of the XC6SLX100T-N3FGG676I?
The XC6SLX100T-N3FGG676I is rated at speed grade -3, guaranteeing functional operation up to 500 MHz for internal logic paths under worst-case industrial conditions (–40°C to +100°C, VCCINT = 1.14 V). Actual achievable frequency depends on design utilization, routing, and clock domain constraints - typical timing-closure results for register-to-register paths range from 320 MHz to 450 MHz in production implementations of the XC6SLX100T-N3FGG676I.
Does the XC6SLX100T-N3FGG676I support partial reconfiguration?
Yes, the XC6SLX100T-N3FGG676I supports partial reconfiguration through its FPGA fabric and configuration logic. This capability allows specific logic modules to be reloaded dynamically without resetting the entire device. Implementation requires Xilinx ISE 14.7 with PlanAhead tools and proper HDL partitioning - confirmed in UG380 v1.8 for the XC6SLX100T-N3FGG676I.
What configuration modes are supported by the XC6SLX100T-N3FGG676I?
The XC6SLX100T-N3FGG676I supports JTAG, master serial (SPI), slave serial, and BPI parallel configuration modes. Dual-boot capability is enabled via address pin strapping, allowing two independent bitstreams to be stored and selected at power-up. All modes are electrically validated and documented in DS160 v3.1 for the XC6SLX100T-N3FGG676I.
Is the XC6SLX100T-N3FGG676I RoHS compliant?
Yes, the XC6SLX100T-N3FGG676I is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's Product Change Notification PCN-2021-001 for the XC6SLX100T-N3FGG676I.
What is the I/O voltage range supported by the XC6SLX100T-N3FGG676I?
The XC6SLX100T-N3FGG676I supports SelectIO™ standards across eight I/O banks, with per-bank VCCO ranging from 1.2 V to 3.3 V. Each bank can be independently configured for LVCMOS, LVTTL, SSTL, HSTL, or differential standards including LVDS and RSDS. VREF inputs are provided for SSTL and HSTL termination - all verified in DS161 v2.2 for the XC6SLX100T-N3FGG676I.
XC6SLX100T-N3FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 376
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100T-N3FGG676I FAQ
1.How can I place an order for XC6SLX100T-N3FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-N3FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-N3FGG676I reliable?
The price and inventory of XC6SLX100T-N3FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-N3FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-N3FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-N3FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-N3FGG676I?
XC6SLX100T-N3FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-N3FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-N3FGG676I?
For technical support, including XC6SLX100T-N3FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-N3FGG676I requirements.
6.How does Aetrix verify that XC6SLX100T-N3FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-N3FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-N3FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-N3FGG676I?
All XC6SLX100T-N3FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-N3FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-N3FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX100T-N3FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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