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AMD XC6SLX100T-N3FGG900I
- Part No.:
- XC6SLX100T-N3FGG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX100T-N3FGG900I.pdf
- Description:
- IC FPGA 498 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,843
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Product details
Overview
XC6SLX100T-N3FGG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,729 Kbits of block RAM, and 204 user I/Os in a 900-pin Fine-Pitch Flip-Chip BGA (FFG900) package. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards.
For engineers reviewing the XC6SLX100T-N3FGG900I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory capacity, and industrial-grade thermal performance for reconfigurable digital systems.
Technical Context
The XC6SLX100T-N3FGG900I implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, shift registers, and dedicated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It integrates dual-clock DDR2/DDR3 memory controllers and supports SelectIO™ technology for multi-standard I/O interfacing.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes, with support for bitstream encryption using AES-256 and device authentication via HMAC-SHA-256. The device includes internal oscillator, power-on reset circuitry, and configurable I/O pull-up/down resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 4,729 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| User I/Os | 204 - supports parallel interfaces, high-speed serial links, and mixed-voltage board-level connectivity |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in critical paths under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for deployment in industrial control cabinets and outdoor telecom equipment |
| I/O Standards | LVCMOS/LVTTL/SSTL/HSTL - allows direct interfacing with FPGAs, microprocessors, DDR memory, and legacy peripherals |
Pinout & Package
Package: 900-pin Fine-Pitch Flip-Chip BGA (FFG900), 31×31 mm body, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies output driver voltage for Bank 0; sets logic threshold and drive strength for associated pins |
| VCCAUX | Auxiliary Power | Provides 2.5 V to configuration circuitry, PLLs, and internal logic interconnect |
| PROGRAM_B | Configuration Control | Active-low input that initiates FPGA reconfiguration and clears internal state |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| CLKIN | Primary Clock Input | Accepts single-ended or differential clock source feeding internal DCM/PLL for clock synthesis and deskew |
| M0–M2 | Mode Selection | Three-pin strap determining boot source (SPI, BPI, JTAG) and configuration mode at power-up |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 180 units enabling fixed-point MAC operations at 500 MHz for real-time filtering and math acceleration |
| Embedded Memory | 4,729 Kbits of true dual-port block RAM with byte-write enable for concurrent read/write access |
| SelectIO™ Technology | Supports 18 I/O standards including SSTL-18 and HSTL-I with programmable slew rate and drive strength |
| DCM/PLL Clock Management | Two DCMs and one PLL per device for jitter reduction, frequency synthesis, and phase alignment across multiple domains |
| Security Features | AES-256 bitstream encryption and HMAC-SHA-256 authentication prevent unauthorized cloning and firmware tampering |
Applications
| Industrial Motor Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time closed-loop servo control with encoder feedback, PWM generation, and safety monitoring in PLC-based drives. IC Role / Device Role / Timing Role: Configurable logic fabric executing position loop algorithms, generating synchronized 100 kHz PWM outputs, and managing functional safety watchdogs. Use Value: Deterministic latency under 200 ns enables sub-microsecond response to fault conditions, meeting SIL-3 requirements. | Use Scenario: High-speed data aggregation from ultrasound transducer arrays and time-aligned transfer to GPU-accelerated image reconstruction engines. IC Role / Device Role / Timing Role: Parallel-to-serial bridging of 64-channel ADC streams into PCIe Gen2 x4 interface with precise timestamping and channel skew correction. Use Value: On-chip DSP48A1 slices perform real-time beamforming coefficient updates at 250 MSPS without external processors. |
| Avionics Data Concentrator | Test & Measurement Pattern Generator |
Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control computers with deterministic latency and EMI-hardened I/O. IC Role / Device Role / Timing Role: Protocol-aware logic implementing dual-redundant bus controllers, CRC generators, and time-triggered scheduling with hardware timestamps. Use Value: Industrial temperature rating and radiation-tolerant design ensure operation at 40,000 ft cabin altitudes without derating. | Use Scenario: Generating multi-channel, multi-rate digital stimulus waveforms for IC validation across automotive and aerospace SoCs. IC Role / Device Role / Timing Role: High-fidelity pattern generator with independent per-channel delay control, jitter < 15 ps RMS, and deep on-chip waveform memory. Use Value: 204 user I/Os support simultaneous 128-bit wide vector generation at 200 MHz, reducing test cycle time by 40% vs. ASIC-based solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-N3FGG900I | 147,443 logic cells, 5,888 Kbits block RAM, same package and speed grade | Higher gate count supports larger state machines and more complex protocol stacks | Select when design requires >120K logic cells or additional DSP slices without changing PCB layout |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 4,915 Kbits block RAM, 250 user I/Os, smaller 324-pin CSPBGA | Lower static power, enhanced DSP48E1 slices, native PCIe Gen2 endpoint support | Choose for new designs prioritizing power efficiency, higher bandwidth interfaces, or migration path to 7-series toolchain |
Compared with XC6SLX100T-N3FGG900I, the XC6SLX150T-N3FGG900I offers headroom for future feature expansion within identical thermal and mechanical constraints, while the XC7A100T-2CSG324I delivers architectural improvements and lower power but requires PCB redesign due to different package and pinout.
Availability
XC6SLX100T-N3FGG900I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging interface, avionics data concentration, and test & measurement pattern generation requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX100T-N3FGG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low-power, reliable reconfigurable logic with flexible I/O and embedded memory - targeting industrial automation, medical devices, and communications infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100T-N3FGG900I?
The XC6SLX100T-N3FGG900I supports I/O bank voltages from 1.2 V to 3.3 V, with individual banks configurable for LVCMOS, LVTTL, SSTL, or HSTL standards. Each VCCO supply must match the selected I/O standard's required voltage level, and bank-specific termination resistors are programmable in hardware. This enables mixed-voltage board designs without level-shifting components.
Does XC6SLX100T-N3FGG900I support JTAG boundary-scan testing?
Yes, XC6SLX100T-N3FGG900I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TAP controller is integrated and accessible via TCK, TMS, TDI, and TDO pins. Boundary-scan instructions include SAMPLE/PRELOAD, EXTEST, and BYPASS, and the device provides full visibility into I/O pin states during manufacturing test.
What configuration modes are supported by XC6SLX100T-N3FGG900I?
XC6SLX100T-N3FGG900I supports Master SPI, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI uses internal oscillator and supports quad-SPI for faster loading; Slave Serial enables microcontroller-driven configuration; JTAG allows debugging and partial reconfiguration without full device reset.
Is XC6SLX100T-N3FGG900I qualified for extended temperature operation?
Yes, XC6SLX100T-N3FGG900I is rated for industrial temperature range (-40°C to +100°C) and undergoes full characterization across this range. Electrical parameters including setup/hold times, I/O drive strength, and configuration memory retention are guaranteed at both extremes. Thermal derating is not required for operation within this specification.
Can XC6SLX100T-N3FGG900I implement a PCIe endpoint interface?
No, XC6SLX100T-N3FGG900I does not include native PCI Express hard IP blocks. It can implement PCIe Gen1 x1 logical layer using soft-core protocols and SelectIO™ pins, but lacks dedicated transceivers and PHY logic required for compliance. For certified PCIe endpoints, AMD recommends Artix-7 or later families such as XC7A100T-2CSG324I which integrate PCIe Gen2 hard IP.
XC6SLX100T-N3FGG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX100T-N3FGG900I FAQ
1.How can I place an order for XC6SLX100T-N3FGG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-N3FGG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-N3FGG900I reliable?
The price and inventory of XC6SLX100T-N3FGG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-N3FGG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-N3FGG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-N3FGG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-N3FGG900I?
XC6SLX100T-N3FGG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-N3FGG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-N3FGG900I?
For technical support, including XC6SLX100T-N3FGG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-N3FGG900I requirements.
6.How does Aetrix verify that XC6SLX100T-N3FGG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-N3FGG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-N3FGG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-N3FGG900I?
All XC6SLX100T-N3FGG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-N3FGG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-N3FGG900I part is unused and in its original packaging.
Return procedure for XC6SLX100T-N3FGG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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