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AMD XC6SLX150-2FG484I
- Part No.:
- XC6SLX150-2FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150-2FG484I.pdf
- Description:
- IC FPGA 338 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,965
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Product details
Overview
XC6SLX150-2FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, -2 speed grade, and industrial temperature range (–40°C to +100°C). It integrates block RAM, DSP48A1 slices, and SelectIO™ technology for high-speed I/O interfacing in embedded vision and industrial control systems.
For engineers reviewing the XC6SLX150-2FG484I datasheet, pinout, applications, or equivalent options, key selection considerations include logic capacity, I/O voltage support (1.2 V to 3.3 V), configuration interface options (SPI, JTAG, SelectMAP), and industrial-grade thermal performance.
Technical Context
The XC6SLX150-2FG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for clock networks and global reset. It supports multi-standard I/O banks with programmable drive strength, slew rate, and on-chip termination (SSTL, HSTL, LVCMOS, LVDS).
Configuration is performed via Master SPI, Slave SPI, or JTAG; bitstream encryption and readback protection are supported. The device uses internal voltage regulators for core (1.2 V) and auxiliary (2.5 V) supplies, with separate VCCO per I/O bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total configurable logic resources for implementing state machines, data paths, and glue logic |
| Block RAM | 4,032 kbits - distributed memory for FIFOs, buffers, and lookup tables without external SRAM |
| DSP Slices | 180 - fixed-point multiply-accumulate units supporting 18 × 18-bit signed multiplication |
| I/O Pins | 349 - user-configurable single-ended and differential I/O with per-bank voltage assignment |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies defined in Xilinx DS162 |
| Operating Temp | –40°C to +100°C - qualified for industrial environments without derating |
| Package | FG484 - 484-ball fine-pitch BGA, 23 × 23 mm, 1.0 mm ball pitch, RoHS-compliant |
Pinout & Package
XC6SLX150-2FG484I is housed in a 484-ball Fine-Pitch Ball Grid Array (FG484) package with 23 × 23 array, 1.0 mm ball pitch, and standard 0.8 mm ball diameter. Thermal pad is exposed on underside for enhanced heat dissipation in industrial PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply voltage - must be set to match connected interface standard (e.g., 3.3 V for LVCMOS33) |
| P2 | CLK0 | Dedicated global clock input - low-skew routing to all clock-capable resources |
| T14 | M0 | Configuration mode select - sets boot source (e.g., SPI vs. SelectMAP) |
| V17 | PROGRAM_B | Active-low asynchronous reset - initiates reconfiguration and clears configuration memory |
| R15 | DONE | Open-drain status output - goes high when configuration completes successfully |
| Y16 | CCLK | Configuration clock - driven externally during Master SPI mode or internally during JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Up to 12 independent I/O banks, each configurable for 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V signaling |
| SelectIO Technology | Supports SSTL18, SSTL15, HSTL_I, LVCMOS, LVDS, and TMDS standards with programmable termination |
| DSP48A1 Slice | 18 × 18-bit multiplier with pre-adder, accumulator, and pipeline registers for real-time filtering |
| Embedded Block RAM | Configurable as true dual-port RAM, FIFO, or shift register - no external memory required for small buffers |
| Configuration Security | Bitstream encryption using AES-128 and HMAC-SHA-256 prevents unauthorized readback or cloning |
Applications
| Industrial PLC Controller | Machine Vision Preprocessing Unit |
|---|---|
Use Scenario: Real-time logic sequencing and analog/digital I/O handling in programmable logic controllers. IC Role / Device Role / Timing Role: FPGA fabric executes ladder logic and motion control algorithms with deterministic sub-microsecond latency. Use Value: 349 I/O pins enable direct connection to sensors, encoders, and fieldbus transceivers without glue logic. | Use Scenario: Pixel-level image filtering and feature extraction before sending data to host processor. IC Role / Device Role / Timing Role: Configurable logic implements Sobel edge detection and Bayer demosaicing pipelines synchronized to camera sensor clocks. Use Value: 180 DSP48A1 slices accelerate convolution operations at up to 250 MHz, reducing host CPU load. |
| Avionics Data Concentrator | Test & Measurement Signal Generator |
Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and RS-422 subsystems. IC Role / Device Role / Timing Role: FPGA implements multiple serial interface cores with precise timing control and error detection logic. Use Value: Industrial temperature rating ensures reliable operation in uncontrolled avionics bays without active cooling. | Use Scenario: Generation of calibrated analog waveforms and digital stimulus patterns for DUT validation. IC Role / Device Role / Timing Role: FPGA controls DAC update timing, synchronizes trigger events, and manages pattern memory addressing. Use Value: Block RAM (4,032 kbits) stores multi-channel waveform samples for glitch-free playback at 100+ MS/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG484C | Faster speed grade (-3), commercial temperature range (0°C to +85°C), identical logic resources and I/O count | Suitable for lab, test bench, or non-industrial environments where higher timing margin is needed | Select when design requires tighter setup/hold margins but does not require extended temperature operation |
| XCVU9P-2FLGA2104I | UltraScale architecture, 2,586,000 logic cells, 2104-pin FC-BGA, higher power and cost | Targeted at high-throughput video processing or 5G baseband where Spartan-6 lacks bandwidth or density | Choose only when XC6SLX150-2FG484I fails timing closure or resource utilization exceeds 90% |
Compared with XC6SLX150-2FG484I, the -3C variant trades industrial temperature tolerance for improved timing margin, while the VU9P offers orders-of-magnitude more logic and I/O at significantly higher cost, power, and board area-making XC6SLX150-2FG484I optimal for cost-sensitive, thermally constrained industrial FPGA applications.
Availability
XC6SLX150-2FG484I is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and avionics data concentrators requiring stable component supply across long production lifecycles.
Supply support for XC6SLX150-2FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family was originally designed by Xilinx for cost-optimized, low-power, high-I/O-density applications in industrial, automotive, and communications equipment.
FAQ
What is the maximum supported I/O standard for XC6SLX150-2FG484I?
XC6SLX150-2FG484I supports LVDS, LVPECL, SSTL, HSTL, and LVCMOS standards across its 349 user I/O pins. Each of the 12 I/O banks can be independently configured for voltages from 1.2 V to 3.3 V, enabling mixed-voltage system interfacing without level shifters. The device complies with JEDEC specifications for each supported standard as documented in Xilinx UG381.
Does XC6SLX150-2FG484I support JTAG boundary-scan testing?
Yes, XC6SLX150-2FG484I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug. The TDO, TDI, TCK, and TMS pins are dedicated and mapped to balls D19, E19, D18, and E18 respectively in the FG484 package. This enables in-circuit verification of PCB interconnects and configuration integrity checks.
What configuration modes are supported by XC6SLX150-2FG484I?
XC6SLX150-2FG484I supports Master SPI, Slave SPI, JTAG, and SelectMAP configuration modes. Mode selection is controlled by M2:M0 pins at power-up. Master SPI allows standalone boot from serial flash; JTAG enables programming and debugging via standard tools; SelectMAP supports high-speed parallel loading from microcontrollers or processors.
Is XC6SLX150-2FG484I pin-compatible with other Spartan-6 devices in the FG484 package?
XC6SLX150-2FG484I shares the same FG484 footprint and pinout with other Spartan-6 LX/LXT devices in the same package option, including XC6SLX9, XC6SLX16, XC6SLX25, XC6SLX45, XC6SLX75, and XC6SLX100. Power and configuration pins are identical; I/O pin assignments follow consistent bank layout rules defined in Xilinx UG385.
What is the recommended power supply sequencing for XC6SLX150-2FG484I?
XC6SLX150-2FG484I requires monotonic, simultaneous ramping of VCCINT (1.2 V), VCCAUX (2.5 V), and VCCO (per bank) within ±100 ms of each other. VCCINT must reach 90% before VCCAUX rises above 1.0 V. Deviations may cause configuration failure or latch-up. Refer to Xilinx DS162 Section 5 for absolute maximum ratings and sequencing guidance specific to the XC6SLX150-2FG484I.
XC6SLX150-2FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150-2FG484I FAQ
1.How can I place an order for XC6SLX150-2FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-2FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-2FG484I reliable?
The price and inventory of XC6SLX150-2FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-2FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-2FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-2FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-2FG484I?
XC6SLX150-2FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-2FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-2FG484I?
For technical support, including XC6SLX150-2FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-2FG484I requirements.
6.How does Aetrix verify that XC6SLX150-2FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-2FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-2FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-2FG484I?
All XC6SLX150-2FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-2FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-2FG484I part is unused and in its original packaging.
Return procedure for XC6SLX150-2FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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