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AMD XC6SLX150-2FG676I
- Part No.:
- XC6SLX150-2FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150-2FG676I.pdf
- Description:
- IC FPGA 498 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,499
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Product details
Overview
XC6SLX150-2FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 147,443 logic cells, 6 MB of block RAM, and 320 DSP48E1 slices, configured in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with -2 speed grade and Industrial temperature range (-40°C to +100°C). It serves as a reconfigurable logic fabric for high-throughput industrial control and video processing systems.
For engineers reviewing the XC6SLX150-2FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (516 user I/Os), LVDS support (up to 288 differential pairs), embedded memory depth, and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and place-and-route.
Technical Context
The XC6SLX150-2FG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports multi-standard I/O including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS, Mini-LVDS, and RSDS.
It integrates six CMT clock management tiles-each containing two DCMs and one PLL-for low-jitter clock synthesis, phase shifting, and frequency multiplication. Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG interfaces using external SPI flash or PROM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total available LUT-based logic resources for combinatorial and sequential logic implementation |
| Block RAM | 6,082 kbits - distributed across 232 x 28-kbit RAMB16BWER blocks for on-chip data buffering and FIFOs |
| DSP Slices | 320 DSP48E1 - fixed-point multiply-accumulate units supporting 25×18-bit multiplication with pipeline registers |
| User I/O Pins | 516 - configurable single-ended and differential I/Os compliant with multiple voltage standards |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies per device-specific timing tables |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| Package | FG676 - 676-ball fine-pitch BGA with 1.0 mm pitch and 27×27 array |
Pinout & Package
XC6SLX150-2FG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FG676) package with 1.0 mm ball pitch, thermal pad, and standard JEDEC MO-251AC footprint. Pin functions are defined by configuration mode, bank voltage, and I/O standard assignment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF ceramic capacitor near ball |
| H2 | VCCAUX | Auxiliary analog supply for configuration circuitry and PLLs - requires clean 2.5 V ±3% |
| K3 | VCCINT | Core logic supply - 1.2 V ±3% with low-noise regulation and ≥10 µF bulk capacitance |
| M4 | PROGRAM_B | Active-low asynchronous reset - pulls device into configuration reload state when asserted |
| P5 | CCLK | Configuration clock output - generated during Master SelectMAP mode for synchronous data capture |
| R6 | DONE | Open-drain status signal - goes high-Z after successful configuration and release of internal reset |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Memory | 6 MB total block RAM enables large on-die buffers for video frame storage or protocol stack state retention |
| DSP Performance | 320 DSP48E1 slices deliver up to 12.8 GOPS at 100 MHz for real-time filtering and correlation tasks |
| Multi-Standard I/O | Supports 1.2–3.3 V I/O banks with programmable drive strength and slew rate for noise-controlled interface design |
| Clock Management | Six CMTs provide independent clock domain generation, enabling simultaneous operation of multiple high-speed peripherals |
| Configuration Security | Bitstream encryption via AES-256 key stored in on-chip eFUSE prevents unauthorized cloning or reverse engineering |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time closed-loop servo control with sub-microsecond jitter tolerance across 16-axis motor drives. IC Role / Device Role / Timing Role: FPGA fabric executes position loop computation, PWM generation, and encoder feedback decoding in hardware. Use Value: Deterministic latency (<50 ns path delay) and 516 I/Os enable direct connection to resolver-to-digital converters and isolated gate drivers. | Use Scenario: High-bandwidth acquisition and preprocessing of ultrasound echo data before transfer to host CPU. IC Role / Device Role / Timing Role: Configurable logic synchronizes ADC sampling, applies beamforming coefficients, and compresses raw channel data. Use Value: 6 MB block RAM stores full-frame echo buffers; LVDS I/O supports 1 Gbps serial links to 128-channel ADC arrays. |
| Avionics Data Concentrator | Test & Measurement Instrumentation |
Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers. IC Role / Device Role / Timing Role: Reconfigurable logic implements dual-redundant bus controllers and deterministic time-triggered scheduling logic. Use Value: -40°C to +100°C rating and radiation-tolerant design meet DO-254 Level A requirements for critical avionics functions. | Use Scenario: High-resolution waveform generation and analysis in automated test equipment for semiconductor validation. IC Role / Device Role / Timing Role: FPGA generates precise stimulus patterns while capturing response data with timestamped triggers. Use Value: 320 DSP48E1 slices perform real-time FFT and spectral analysis; 288 LVDS pairs support parallel 16-bit DAC/ADC interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG676I | Faster -3 speed grade with tighter timing margins; higher static power consumption | Better suited for designs requiring >150 MHz system clocks or deeper pipelining | Select only if timing closure fails with XC6SLX150-2FG676I under worst-case voltage/temperature conditions |
| XC7A100T-2CSG324I | Artix-7 architecture with 101K logic cells, 285 DSP slices, and 4.9 Mb BRAM; supports PCIe Gen2 and DDR3 | Enables migration to higher bandwidth interfaces and more complex IP integration | Choose when upgrading legacy Spartan-6 designs needing enhanced connectivity or lower power per logic cell |
Compared with XC6SLX150-2FG676I, the -3 variant improves maximum clock frequency but increases power and cost, while the Artix-7 alternative offers architectural upgrades at the expense of toolchain migration effort and board redesign.
Availability
XC6SLX150-2FG676I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentrators, and test & measurement instrumentation requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX150-2FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - particularly in industrial automation and video infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150-2FG676I?
The XC6SLX150-2FG676I supports I/O voltages from 1.2 V to 3.3 V across its 12 I/O banks, with each bank independently configurable for standards including LVCMOS, LVTTL, SSTL, HSTL, and differential protocols like LVDS. Bank-specific VCCO must match the selected I/O standard's required voltage level, and all VCCO supplies require proper decoupling per Xilinx UG381.
Does XC6SLX150-2FG676I support JTAG boundary-scan testing?
Yes, XC6SLX150-2FG676I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TDI, TDO, TMS, TCK, and TCK pins are dedicated and electrically compatible with standard JTAG adapters. Boundary-scan capability is enabled by default after power-up and does not require configuration bitstream loading.
What configuration modes are supported by XC6SLX150-2FG676I?
XC6SLX150-2FG676I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) flash configuration modes. Master SelectMAP uses internal oscillator to drive CCLK and load bitstream from external parallel PROM; SPI mode reads configuration data from standard quad-SPI flash devices. Mode selection is controlled by M[2:0] pins at power-up.
Is XC6SLX150-2FG676I qualified for automotive applications?
No, XC6SLX150-2FG676I is rated for Industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably within automotive under-hood ambient extremes, it lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation required for Tier 1 automotive ECUs.
Can XC6SLX150-2FG676I implement PCI Express endpoints?
No, XC6SLX150-2FG676I does not include native PCI Express hard IP blocks. It lacks integrated PCIe PHY and endpoint logic; any PCIe interface must be implemented using soft-core solutions with significant resource overhead and limited performance. For PCIe Gen1/Gen2 support, AMD recommends Artix-7 or Kintex-7 families instead of XC6SLX150-2FG676I.
XC6SLX150-2FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150-2FG676I FAQ
1.How can I place an order for XC6SLX150-2FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-2FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-2FG676I reliable?
The price and inventory of XC6SLX150-2FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-2FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-2FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-2FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-2FG676I?
XC6SLX150-2FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-2FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-2FG676I?
For technical support, including XC6SLX150-2FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-2FG676I requirements.
6.How does Aetrix verify that XC6SLX150-2FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-2FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-2FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-2FG676I?
All XC6SLX150-2FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-2FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-2FG676I part is unused and in its original packaging.
Return procedure for XC6SLX150-2FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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