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AMD XC6SLX150-2FG900I
- Part No.:
- XC6SLX150-2FG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150-2FG900I.pdf
- Description:
- IC FPGA 576 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,214
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Product details
Overview
XC6SLX150-2FG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 5,760 Kbits of block RAM, and 318 user I/Os in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and supports SelectIO standards up to 1.25 Gbps.
For engineers reviewing the XC6SLX150-2FG900I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, embedded memory capacity, speed grade timing closure, and industrial-grade thermal reliability.
Technical Context
The XC6SLX150-2FG900I implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated carry logic. It integrates 220 DSP48A1 slices for arithmetic-intensive tasks and supports dual-register flip-flops per CLB for high-performance synchronous design.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces. Built-in clock management includes two DCMs (Digital Clock Managers) supporting phase shifting, frequency synthesis, and duty cycle correction across multiple output clocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total configurable logic resources for implementing combinational and sequential logic functions |
| Block RAM | 5,760 Kbits - on-chip memory for data buffering, FIFOs, or lookup tables without external memory |
| User I/Os | 318 - configurable single-ended or differential I/O pins supporting LVCMOS, SSTL, HSTL, and differential standards |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock frequency under industrial temperature conditions |
| DCMs | 2 - digital clock managers enabling precise clock phase alignment, multiplication/division, and jitter reduction |
| DSP Slices | 220 - dedicated 18×18 multipliers with pre-adders for high-throughput filtering and math operations |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating or thermal throttling |
Pinout & Package
XC6SLX150-2FG900I is housed in a 900-ball Fine-Pitch BGA (FG900) package with 318 user-configurable I/Os distributed across 12 banks. Power and ground balls are arranged per bank to minimize noise coupling and support simultaneous switching noise (SSN) mitigation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally to maintain signal integrity for LVCMOS33/LVDS interfaces |
| A2 | IO_L0N_0 | Differential pair negative input for Bank 0 - used with A1 (IO_L0P_0) for LVDS or TMDS signaling |
| P4 | CLKIN1 | Primary global clock input - routed to DCM0 for low-skew clock distribution and frequency synthesis |
| T12 | M0 | Configuration mode select - sets Master Serial mode when pulled High during power-up |
| V17 | PROGRAM_B | Active-Low configuration reset - initiates reconfiguration sequence when pulsed Low after power stabilization |
| Y18 | INIT_B | Open-drain status indicator - goes High-Z after successful bitstream loading, Low during configuration error |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two fully independent digital clock managers enable multi-clock domain synchronization and jitter cleanup without external PLL ICs |
| SelectIO Technology | Supports 18 I/O standards including LVDS, RSDS, and SSTL-2/3 with programmable drive strength and slew rate control per pin |
| Embedded Memory | 5,760 Kbits of true dual-port block RAM allows concurrent read/write access for video frame buffers or protocol stacks |
| Configurable Logic | Six-input LUTs with optional shift register or distributed RAM mode increase logic utilization efficiency for state machines and counters |
| Industrial Temp Rating | Qualified over -40°C to +100°C ambient ensures reliable operation in base stations, motor drives, and factory automation systems |
Applications
| Industrial Motor Control | Video Processing Bridge |
|---|---|
Use Scenario: Real-time PWM generation, encoder feedback decoding, and safety monitoring in servo drives and PLC-based motion controllers. IC Role / Device Role / Timing Role: XC6SLX150-2FG900I serves as the deterministic real-time controller core with sub-microsecond interrupt latency and synchronized I/O timing. Use Value: 318 user I/Os allow direct connection to multiple encoder channels, analog front-ends, and isolated gate drivers without glue logic. | Use Scenario: Converting between HDMI 1.4 and MIPI CSI-2 for camera-to-processor bridging in machine vision inspection systems. IC Role / Device Role / Timing Role: XC6SLX150-2FG900I implements parallel pixel processing pipelines and protocol translation logic with precise clock domain crossing. Use Value: Dual DCMs generate synchronized 148.5 MHz (HDMI) and 500 MHz (MIPI) clocks while maintaining phase alignment for zero-frame-drop conversion. |
| Communications Baseband | Test & Measurement Equipment |
Use Scenario: Channel bonding, packet classification, and forward error correction in LTE small cell baseband units. IC Role / Device Role / Timing Role: XC6SLX150-2FG900I executes custom PHY-layer algorithms with deterministic latency and parallelized CRC computation. Use Value: 220 DSP48A1 slices accelerate Viterbi decoding and FFT operations at 100+ MSPS throughput without offloading to host CPU. | Use Scenario: High-speed digital pattern generation and acquisition in automated test equipment (ATE) for semiconductor wafer probing. IC Role / Device Role / Timing Role: XC6SLX150-2FG900I acts as the timing engine and stimulus sequencer with nanosecond-level pin timing resolution. Use Value: -2 speed grade guarantees 2 ns input setup/hold margins at 500 MHz, enabling reliable capture of DDR3 signals at 800 Mbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG900I | Faster -3 speed grade enables tighter timing closure at higher clock frequencies; requires more stringent PCB layout and power delivery | Better suited for designs requiring >500 MHz system clocks or lower latency critical paths | Select XC6SLX150-3FG900I only if timing analysis confirms margin improvement justifies increased cost and layout complexity |
| XC7K160T-2FFG676I | Kintex-7 architecture offers 2x logic density, integrated transceivers, and PCIe Gen2 hard IP - not pin-compatible | Required for designs needing serial connectivity, higher bandwidth memory interfaces, or advanced DSP capabilities | XC6SLX150-2FG900I remains optimal for cost-sensitive industrial control where transceivers or DDR3 controllers are unnecessary |
Compared with XC6SLX150-3FG900I and XC7K160T-2FFG676I, the XC6SLX150-2FG900I delivers balanced logic density, I/O count, and industrial temperature rating at lower BOM cost and simpler power sequencing - ideal for deterministic real-time control without serial I/O.
Availability
XC6SLX150-2FG900I is available at Aetrix Electronics and suitable for industrial motor control, video bridge systems, communications baseband units, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150-2FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated applications.
The Spartan-6 family was designed for cost-optimized, high-volume applications demanding reliable performance, low power, and industrial temperature operation - especially in industrial automation and embedded vision.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150-2FG900I?
The XC6SLX150-2FG900I supports I/O standards operating at 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V levels depending on bank configuration. Each of the 12 I/O banks has independent VCCO supplies, allowing mixed-voltage operation across banks. For example, Bank 0 can run SSTL-2 at 2.5 V while Bank 1 simultaneously handles LVCMOS18 at 1.8 V - all within the same XC6SLX150-2FG900I device.
Does XC6SLX150-2FG900I include built-in configuration memory?
No, the XC6SLX150-2FG900I does not include on-chip nonvolatile configuration memory. It requires an external serial PROM (e.g., XCFxx series) or microcontroller-driven configuration interface. Configuration bitstream is loaded at power-up via Master Serial mode using the dedicated CONFIG_IO pins, and the XC6SLX150-2FG900I retains its programmed state only while powered.
Can XC6SLX150-2FG900I support DDR2 or DDR3 memory interfaces?
Yes, the XC6SLX150-2FG900I supports source-synchronous DDR2 interfaces up to 400 Mbps using its SelectIO and DCM resources. It does not include hard DDR3 memory controller IP, but soft DDR3 controllers implemented in logic can achieve up to 800 Mbps with careful timing closure - verified in Xilinx UG382 for XC6SLX150-2FG900I with proper PCB layout and termination.
What debug interfaces are available on XC6SLX150-2FG900I?
The XC6SLX150-2FG900I supports JTAG (IEEE 1149.1) for boundary-scan testing, programming, and runtime debugging via ChipScope Pro or Vivado Hardware Manager. It also supports ICAP (Internal Configuration Access Port) for partial reconfiguration and dynamic logic updates during operation - accessible through dedicated configuration logic inside the XC6SLX150-2FG900I fabric.
Is XC6SLX150-2FG900I RoHS compliant and lead-free?
Yes, the XC6SLX150-2FG900I is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The FG900 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation, including substance declarations and test reports, is available from AMD's official product change notifications for XC6SLX150-2FG900I.
XC6SLX150-2FG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150-2FG900I FAQ
1.How can I place an order for XC6SLX150-2FG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-2FG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-2FG900I reliable?
The price and inventory of XC6SLX150-2FG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-2FG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-2FG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-2FG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-2FG900I?
XC6SLX150-2FG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-2FG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-2FG900I?
For technical support, including XC6SLX150-2FG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-2FG900I requirements.
6.How does Aetrix verify that XC6SLX150-2FG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-2FG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-2FG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-2FG900I?
All XC6SLX150-2FG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-2FG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-2FG900I part is unused and in its original packaging.
Return procedure for XC6SLX150-2FG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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