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AMD XC6SLX150-2FGG484C
- Part No.:
- XC6SLX150-2FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150-2FGG484C.pdf
- Description:
- IC FPGA 338 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,376
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Product details
Overview
XC6SLX150-2FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, -2 speed grade, and commercial temperature range (0°C to 85°C). It integrates block RAM, DSP48A1 slices, and SelectIO™ technology for high-speed I/O interfacing in industrial control and communications infrastructure.
For engineers reviewing the XC6SLX150-2FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include logic capacity, I/O count (348 user I/Os), LVDS/PCIe-compatible signaling support, and thermal performance in compact PCB layouts.
Technical Context
The XC6SLX150-2FGG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for clock networks and global reset. It supports multi-standard I/O banks operating at 1.2 V to 3.3 V, enabling interface flexibility across memory, sensors, and serial protocols.
Its embedded resources include 4,824 Kbits of block RAM, 180 DSP48A1 slices for arithmetic-intensive tasks, and integrated clock management using DCM and PLL blocks-each supporting frequency synthesis, phase shifting, and duty cycle correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational and sequential logic density for system-on-chip integration |
| User I/O Pins | 348 - supports parallel bus interfaces, multi-channel ADC/DAC, and high-pin-count peripheral expansion |
| Block RAM | 4,824 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 180 × DSP48A1 - delivers 18-bit × 18-bit multiply-accumulate operations per slice for filtering and math acceleration |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz internal clocking with standard static timing analysis constraints |
| Operating Temp | 0°C to +85°C - validated for commercial-grade industrial equipment and non-automotive embedded systems |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, LVDS - allows direct connection to DDR2/DDR3 memory, FPGAs, and analog front-ends |
Pinout & Package
XC6SLX150-2FGG484C is housed in a 484-ball Fine-Pitch BGA (FGG) package with 23 × 23 mm body size, 1.0 mm ball pitch, and thermal pad for enhanced heat dissipation in sustained logic operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally to maintain signal integrity for 3.3 V or 2.5 V interfaces |
| P2 | CLKIN_1 | Dedicated single-ended clock input - connects to external crystal or oscillator for primary clock domain generation |
| T12 | IO_L1P_0 | Differential I/O pair positive - used with T11 (IO_L1N_0) for LVDS or RSDS signaling at up to 1.0 Gbps |
| W19 | GND | Ground reference - part of 4×4 central ground array ensuring low-inductance return path for core and I/O domains |
| V17 | VCCINT | Core voltage supply (1.2 V) - requires tight regulation and low-noise filtering to meet static/dynamic IR-drop targets |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Independent VCCO per bank (1.2 V–3.3 V) enables mixed-voltage system interfacing without level shifters |
| Integrated Clock Management | DCM and PLL blocks provide jitter < 150 ps RMS for synchronous design across multiple clock domains |
| SelectIO Technology | Programmable drive strength (2–24 mA) and slew rate control reduce EMI and improve signal fidelity on long traces |
| Configurable Logic Blocks | Each CLB contains four 6-LUTs + eight FFs - optimized for high-density register-rich designs like protocol state machines |
| Partial Reconfiguration Support | Enables dynamic logic swapping during runtime - critical for adaptive radio or real-time fault-tolerant systems |
Applications
| Industrial PLC Controller | Video Surveillance Encoder |
|---|---|
Use Scenario: Real-time motion detection and H.264 encoding pipeline in edge-based security cameras. IC Role / Device Role / Timing Role: FPGA fabric implements pixel processing, frame buffering, and PCIe interface to host SoC. Use Value: 348 I/Os support parallel CMOS image sensor interface and DDR3 memory controller; DSP slices accelerate motion estimation. | Use Scenario: Multi-channel video aggregation and metadata tagging in network DVR chassis. IC Role / Device Role / Timing Role: Configurable logic handles camera synchronization, timestamp injection, and Gigabit Ethernet MAC offload. Use Value: LVDS I/Os enable low-skew clock distribution to multiple image sensors; block RAM stores frame headers and compression context. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: High-speed data acquisition from ultrasound transducer arrays with real-time beamforming. IC Role / Device Role / Timing Role: FPGA performs time-aligned sampling, FIR filtering, and JESD204B-to-PCIe bridging. Use Value: DSP48A1 slices execute 128-tap beamformer kernels; 4,824 Kbits block RAM buffers raw channel data before transfer. | Use Scenario: Modular signal generator with arbitrary waveform synthesis and trigger synchronization. IC Role / Device Role / Timing Role: Logic fabric generates precise timing sequences, manages DAC control registers, and routes trigger signals across modules. Use Value: -2 speed grade ensures sub-nanosecond timing resolution; SelectIO supports differential trigger inputs (LVDS) and analog output control (SSTL). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG484C | Faster -3 speed grade; higher static power consumption; identical pinout and logic resources | Better suited for designs requiring >500 MHz clock domains or tighter setup/hold margins | Select when timing closure fails at -2 grade or when over-provisioning for future firmware upgrades |
| XC7A100T-2CSG324C | Artix-7 architecture; 101,440 logic cells; 2.5x higher DSP density; 324-pin CSPBGA package | Supports PCIe Gen2, AXI interconnect, and more advanced transceivers - not drop-in compatible | Choose for new designs needing higher throughput, lower latency, or migration path beyond Spartan-6 lifecycle |
Compared with XC6SLX150-3FGG484C and XC7A100T-2CSG324C, the XC6SLX150-2FGG484C offers optimal balance of logic density, I/O flexibility, and cost for legacy-compliant industrial and video systems where timing margin and footprint compatibility are prioritized over next-gen features.
Availability
XC6SLX150-2FGG484C is available at Aetrix Electronics and suitable for industrial automation, video processing, and medical imaging systems requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX150-2FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable logic density, flexible I/O, and low-power operation - especially in industrial control, video, and connectivity markets.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150-2FGG484C?
The XC6SLX150-2FGG484C supports I/O standards from 1.2 V to 3.3 V across independent banks. Each bank's VCCO can be set individually, allowing simultaneous use of LVCMOS33, SSTL18, and HSTL_I within one device. This eliminates external level-shifting components in mixed-voltage systems.
Does XC6SLX150-2FGG484C support configuration via SPI flash?
Yes, XC6SLX150-2FGG484C supports master SPI configuration mode using industry-standard serial NOR flash devices. The FPGA boots automatically on power-up when connected to a compliant SPI flash with proper address mapping and mode pins (M[2:0]) set to 001. Configuration bitstream size is ~8.2 MB for full utilization.
What thermal considerations apply to XC6SLX150-2FGG484C in continuous operation?
XC6SLX150-2FGG484C has a θJA of 16.5°C/W in typical PCB layout (2 oz copper, 4-layer board, 10 cm² exposed pad). At full utilization and 85°C ambient, junction temperature remains below 105°C with standard airflow. Thermal pad soldering and 6+ vias under the package are mandatory for reliable operation above 70% resource usage.
Can XC6SLX150-2FGG484C implement a PCIe endpoint without external bridge chips?
No, XC6SLX150-2FGG484C does not include native PCIe hard IP. It can implement PCIe Gen1 x1 endpoint logic using user-defined soft-core solutions (e.g., OpenCores PCI Express) with careful timing closure, but lacks integrated PHY or transaction layer hard blocks required for full compliance and certification.
Is XC6SLX150-2FGG484C RoHS compliant and lead-free?
Yes, XC6SLX150-2FGG484C is RoHS 2015/863 compliant and manufactured with lead-free (Pb-free) solderable terminations. The FGG484 package uses matte tin finish on all 484 balls, and the device meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements.
XC6SLX150-2FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150-2FGG484C FAQ
1.How can I place an order for XC6SLX150-2FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-2FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-2FGG484C reliable?
The price and inventory of XC6SLX150-2FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-2FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX150-2FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-2FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-2FGG484C?
XC6SLX150-2FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-2FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-2FGG484C?
For technical support, including XC6SLX150-2FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-2FGG484C requirements.
6.How does Aetrix verify that XC6SLX150-2FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-2FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-2FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX150-2FGG484C?
All XC6SLX150-2FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-2FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-2FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX150-2FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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