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AMD XC6SLX150-2FGG484I
- Part No.:
- XC6SLX150-2FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150-2FGG484I.pdf
- Description:
- IC FPGA 338 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,547
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Product details
Overview
XC6SLX150-2FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, -2 speed grade, and industrial temperature range (-40°C to +100°C). It integrates Block RAM, DSP48A1 slices, and SelectIO™ technology for high-speed I/O interfacing in embedded vision and industrial control systems.
For engineers reviewing the XC6SLX150-2FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count (348 user I/Os), DCI support, LVDS compatibility, and industrial-grade thermal performance.
Technical Context
The XC6SLX150-2FGG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for clock networks and global reset. It supports multi-standard I/O operation including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and RSDS.
Its embedded memory includes 4,824 Kbits of total Block RAM and 180 DSP48A1 slices capable of 18×18-bit signed multiplication. Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic density for system-on-chip integration |
| User I/O Pins | 348 - supports high-pin-count peripheral interfacing with bank-wise voltage and standard flexibility |
| Block RAM | 4,824 Kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 180 × DSP48A1 - delivers fixed-point arithmetic acceleration for filtering and motor control algorithms |
| Speed Grade | -2 - guarantees timing closure at 595 MHz internal clock frequency under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for deployment in uncontrolled industrial enclosures and outdoor equipment |
| Package | 484-pin FGG (Fine-Pitch BGA) - 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free finish |
Pinout & Package
XC6SLX150-2FGG484I is housed in a 484-ball Fine-Pitch Ball Grid Array (FGG) package with 23×23 array, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation in industrial applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output supply - sets voltage level (1.2–3.3 V) for all outputs in Bank 0 |
| A2 | GCLK1 | Global clock input - low-skew dedicated routing to all clock-capable resources |
| T3 | M0 | Configuration mode select - defines boot source (SPI, BPI, or JTAG) during power-up |
| Y1 | INIT_B | Open-drain status signal - indicates configuration status and error flag to host controller |
| R1 | CCLK | Configuration clock - externally driven or internally generated clock for slave serial configuration |
| P2 | DONE | Open-drain completion indicator - pulled high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| DCI (Digitally Controlled Impedance) | On-die termination calibration for 25–75 Ω matching - eliminates external resistors and improves signal integrity on PCB traces |
| SelectIO™ Technology | Per-bank I/O voltage and standard independence - allows mixed-voltage interfaces (e.g., 3.3 V CPU + 1.8 V sensor) on same device |
| Integrated Memory Controller | Hard-wired interface supporting DDR2/DDR3 SDRAM up to 800 Mbps - reduces FPGA resource usage and timing risk vs. soft controllers |
| ISE Design Suite Support | Full synthesis, place-and-route, and bitstream generation flow - enables deterministic timing closure and legacy project migration |
| Industrial Temperature Rating | Qualified across -40°C to +100°C ambient - ensures reliable operation without derating in factory automation or energy metering hardware |
Applications
| Industrial PLC I/O Module | Machine Vision Preprocessing Unit |
|---|---|
Use Scenario: Real-time digital I/O expansion with analog input conditioning and protocol translation (Modbus RTU to EtherCAT). IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines, timing-critical I/O synchronization, and parallel data acquisition control. Use Value: XC6SLX150-2FGG484I provides 348 user I/Os and integrated DCI to manage impedance-matched fieldbus traces without layout redesign. | Use Scenario: High-speed image capture from dual CMOS sensors, Bayer demosaicing, and edge detection before JPEG compression. IC Role / Device Role / Timing Role: Configurable logic executes pixel-level operations in pipeline stages; DSP48A1 slices accelerate convolution kernels. Use Value: XC6SLX150-2FGG484I delivers deterministic latency and 180 DSP slices - enabling real-time preprocessing at 60 fps with sub-frame jitter. |
| Smart Energy Metering Gateway | Railway Signaling Interface Board |
Use Scenario: Secure meter data aggregation, tariff switching logic, and isolated RS-485/PLC communication handling. IC Role / Device Role / Timing Role: FPGA manages time-synchronized sampling, cryptographic acceleration, and multi-protocol physical layer bridging. Use Value: XC6SLX150-2FGG484I supports 1.8 V and 3.3 V I/O banks simultaneously - simplifying interface to metrology ADCs and isolation transceivers. | Use Scenario: Interfacing legacy relay-based signaling logic with modern Ethernet-based train control systems (ETCS Level 2). IC Role / Device Role / Timing Role: FPGA implements fail-safe watchdog timers, contact monitoring, and protocol conversion between 24 V DC inputs and UDP/IP packets. Use Value: XC6SLX150-2FGG484I's industrial temperature rating and -2 speed grade ensure deterministic response within 100 µs safety-critical windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG484I | Faster speed grade (-3) with 15% higher max clock frequency; identical logic count, I/O, and package | Suitable where tighter timing margins are required in high-throughput data paths | Select XC6SLX150-3FGG484I only if design fails timing at -2 grade; higher power consumption and cost |
| XC6SLX100-2FGG484I | Reduced logic capacity (101,280 cells); same I/O count, package, and speed grade | Applicable where logic utilization stays below ~70% and no additional DSP or BRAM is needed | Choose XC6SLX100-2FGG484I for cost-sensitive designs with verified lower resource usage |
Compared with XC6SLX150-2FGG484I, the -3 variant trades higher static/dynamic power for improved timing margin, while the XC6SLX100-2FGG484I reduces logic density without altering I/O or thermal behavior - enabling tiered BOM strategies across product families.
Availability
XC6SLX150-2FGG484I is available at Aetrix Electronics and suitable for industrial automation, machine vision systems, and smart grid infrastructure requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX150-2FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic integration, flexible I/O, and industrial reliability - targeting embedded control, interface bridging, and real-time processing.
FAQ
What is the maximum operating frequency of the XC6SLX150-2FGG484I?
The XC6SLX150-2FGG484I has a -2 speed grade, guaranteeing internal logic operation up to 595 MHz under industrial temperature conditions. This rating applies to critical paths routed through dedicated clock networks and accounts for worst-case voltage and temperature variation. Actual achievable frequency depends on design complexity, placement, and routing; timing analysis must be performed using Xilinx ISE 14.7 or Vivado 2019.2+ with proper constraints.
Does the XC6SLX150-2FGG484I support DDR3 memory interfaces?
Yes, the XC6SLX150-2FGG484I supports DDR3 SDRAM interfaces up to 800 Mbps using its hard memory controller block. It requires external PHY components and precise board-level impedance control. The controller supports single-ended and differential address/control signals, and is validated with specific Micron and Samsung DDR3 modules referenced in Xilinx UG388.
Is the XC6SLX150-2FGG484I pin-compatible with other Spartan-6 devices in the FGG484 package?
XC6SLX150-2FGG484I shares the same 484-ball FGG package footprint and pinout with other Spartan-6 LX devices in the FGG484 variant, including XC6SLX75, XC6SLX100, and XC6SLX150 variants. Power, ground, configuration, and dedicated I/O pins are aligned; however, bank-specific voltage assignments and I/O standard support may differ between densities and speed grades.
What configuration modes does the XC6SLX150-2FGG484I support?
The XC6SLX150-2FGG484I supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI uses an internal oscillator to drive external SPI flash; Slave Serial relies on an external clock (CCLK) from a microcontroller. JTAG is used for programming and debugging via iMPACT or Vivado Hardware Manager.
How many Block RAM blocks are available in the XC6SLX150-2FGG484I?
The XC6SLX150-2FGG484I contains 2,192 Block RAM primitives, each 18 Kbits in size, totaling 4,824 Kbits of distributed on-chip memory. These can be configured as true dual-port RAM, single-port RAM, ROM, or shift registers. Usage is managed automatically by Xilinx ISE or Vivado synthesis tools based on HDL inference or IP core instantiation.
XC6SLX150-2FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150-2FGG484I FAQ
1.How can I place an order for XC6SLX150-2FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-2FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-2FGG484I reliable?
The price and inventory of XC6SLX150-2FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-2FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-2FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-2FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-2FGG484I?
XC6SLX150-2FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-2FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-2FGG484I?
For technical support, including XC6SLX150-2FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-2FGG484I requirements.
6.How does Aetrix verify that XC6SLX150-2FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-2FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-2FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-2FGG484I?
All XC6SLX150-2FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-2FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-2FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX150-2FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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