AMD XC6SLX150-2FGG676C

Overview

XC6SLX150-2FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 180 DSP48A1 slices, 4.9 Mb total block RAM, 320 user I/Os, and packaged in a 676-pin Fine-Pitch Flip-Chip BGA (FFG676). It targets high-volume industrial control, video processing, and embedded vision systems requiring deterministic timing and low static power.

For engineers reviewing the XC6SLX150-2FGG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), -2 speed grade timing performance, integrated PCIe® Gen1 endpoint capability, and dual 10-bit ADC subsystem.

Technical Context

The XC6SLX150-2FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports SelectIO™ technology with programmable drive strength, slew rate, and on-chip termination across all I/O banks.

It integrates two hard-wired 10-bit, 1.0 MSPS analog-to-digital converters (XADC), supports DDR2/DDR3 SDRAM interfaces up to 800 Mbps, and includes built-in PCI Express® Gen1 x1 endpoint functionality with integrated PHY and DMA controller logic.

Key Specifications

Pinout & Package

Package: 676-ball Fine-Pitch Flip-Chip BGA (FFG676), 27 × 27 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC6SLX150-3FGG676C and XC6SLX150-2CSG484C, the XC6SLX150-2FGG676C delivers optimal balance of I/O density, memory capacity, and industrial-grade timing margin in a standard FFG676 package-making it the default choice for mid-range embedded vision and control platforms.

Availability

XC6SLX150-2FGG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term manufacturability.

Supply support for XC6SLX150-2FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low power, small footprint, and reliable performance in industrial, automotive, and medical systems.

FAQ

What is the maximum supported memory interface speed for XC6SLX150-2FGG676C?

The XC6SLX150-2FGG676C supports DDR2 and DDR3 SDRAM interfaces up to 800 Mbps data rate per pin. This is achieved using dedicated memory controller logic and I/O timing calibration features. The -2 speed grade ensures reliable operation across the full industrial temperature range (0°C to 85°C) with appropriate PCB layout and termination. Memory interface design must follow Xilinx UG388 guidelines for Spartan-6.

Does XC6SLX150-2FGG676C include built-in analog-to-digital conversion capability?

Yes, the XC6SLX150-2FGG676C integrates two independent 10-bit, 1.0 MSPS analog-to-digital converters (XADC). These support both on-die temperature and supply voltage monitoring, plus up to 17 external analog input channels. The XADC operates independently of the FPGA fabric and can be configured via JTAG or internal control registers.

Can XC6SLX150-2FGG676C be used as a PCI Express endpoint without external components?

Yes, the XC6SLX150-2FGG676C contains a hard PCIe Gen1 x1 endpoint block with integrated PHY and DMA controller. It requires only passive AC-coupling capacitors and proper reference clock routing-no external transceiver or bridge chip is needed. Full compliance with PCIe Base Specification 1.1 is verified in Xilinx documentation UG380.

What configuration modes are supported by XC6SLX150-2FGG676C?

The XC6SLX150-2FGG676C supports master SPI, slave serial, JTAG, and boundary-scan configuration modes. Mode selection is controlled by M0, M1, and M2 pins at power-up. Configuration bitstreams can be loaded from external SPI flash, microcontroller, or JTAG debugger. Multi-boot capability allows dual-image storage for fail-safe updates.

Is XC6SLX150-2FGG676C qualified for extended temperature operation?

No, the XC6SLX150-2FGG676C is rated for the commercial and industrial temperature ranges only (0°C to +85°C). It is not specified or tested for extended temperature operation (-40°C to +100°C or beyond). For extended temperature applications, designers should consider Spartan-6 Q-grade or newer AMD Versal devices with extended qualification.