My Inquiry
My Account
AMD XC6SLX150-2FGG676I
- Part No.:
- XC6SLX150-2FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150-2FGG676I.pdf
- Description:
- IC FPGA 498 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,345
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX150-2FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 480 DSP48A1 slices, and 4,795 kbits of block RAM. It operates at -2 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) in a 676-pin Fine-Pitch Flip-Chip BGA (FGG) package. Used in industrial motor control and embedded vision preprocessing.
For engineers reviewing the XC6SLX150-2FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (516 user I/Os), LVDS support, SelectIO™ voltage flexibility (1.2–3.3 V), and compatibility with Xilinx ISE Design Suite v14.7.
Technical Context
The XC6SLX150-2FGG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports multi-standard SelectIO™ interfaces including LVCMOS, LVTTL, HSTL, SSTL, and differential standards such as LVDS and TMDS.
It integrates dual 18×18 multipliers per DSP48A1 slice, supports DDR2/DDR3 memory interfaces up to 800 Mbps, and includes integrated clock management via DCMs (Digital Clock Managers) - not PLLs - for phase shifting, frequency synthesis, and duty cycle correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational and sequential logic capacity for custom digital functions |
| User I/O Pins | 516 - supports high-density interface routing across multiple voltage standards and protocols |
| Block RAM | 4,795 kbits - enables on-chip buffering for video frame stores, FIFOs, or protocol stacks |
| DSP Slices | 480 × DSP48A1 - provides fixed-point arithmetic acceleration for filtering, FFT, and motor control algorithms |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core supply with worst-case industrial temperature operation |
| Package | 676-pin FGG (Fine-Pitch Flip-Chip BGA) - 27×27 mm body, 1.0 mm pitch, RoHS-compliant |
| DCM Units | 8 - delivers clock deskew, frequency multiplication/division, and phase alignment without external PLL ICs |
Pinout & Package
The XC6SLX150-2FGG676I is housed in a 676-pin Fine-Pitch Flip-Chip BGA (FGG) package with 27×27 array, 1.0 mm pitch, and thermal pad. Pinout follows Xilinx Spartan-6 FPGA Pin Planning Guide (UG381 v1.11), with dedicated configuration, clock, JTAG, and I/O banks grouped by voltage and I/O standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be set to match connected interface voltage (e.g., 3.3 V or 1.8 V) |
| P2 | CLKIN_1 | Dedicated single-ended clock input to DCM - used for system clock injection or reference synchronization |
| T12 | M0/M1/M2 | Configuration mode select - sets boot source (SPI, NOR, NAND, or JTAG) during power-up |
| W19 | TCK | JTAG test clock - required for boundary scan, programming, and debug access via Xilinx iMPACT or Vivado |
| Y20 | PROGRAM_B | Active-low asynchronous reset - forces reconfiguration and clears internal state on assertion |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 17 I/O standards across 12 banks - enables mixed-voltage board design without level shifters |
| Digital Clock Manager (DCM) | 8 independent DCMs - provide jitter-tolerant clock synthesis and phase alignment for synchronous subsystems |
| Embedded Memory | 4,795 kbits distributed and block RAM - eliminates need for external SRAM in moderate-depth buffering applications |
| Configurable Logic | 147,443 logic cells with fast carry chain - achieves sub-10 ns path delays for real-time control loops |
| PCI Express® Endpoint | Integrated PCIe® Gen1 x1 endpoint (via LogiCORE IP) - reduces host interface latency and FPGA resource overhead |
Applications
| Industrial Motor Control | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase AC induction and BLDC motors with current/voltage feedback sampling at ≥20 kHz. IC Role / Device Role / Timing Role: FPGA fabric executes PWM generation, encoder interpolation, and PID loop computation; DCMs synchronize ADC sampling and gate driver timing. Use Value: XC6SLX150-2FGG676I delivers deterministic sub-microsecond interrupt response and parallel I/O handling for multi-axis coordination. | Use Scenario: On-camera image enhancement prior to compression - including Bayer demosaicing, white balance, and gamma correction for HD sensors. IC Role / Device Role / Timing Role: Configurable logic implements pixel pipeline processing; block RAM buffers line data; SelectIO™ interfaces directly to CMOS image sensor and video encoder. Use Value: XC6SLX150-2FGG676I enables low-latency, power-efficient preprocessing without offloading to CPU or GPU. |
| Programmable Logic Controller (PLC) | Communications Backplane Interface |
Use Scenario: Modular I/O expansion in DIN-rail mounted PLCs supporting analog input, digital I/O, and fieldbus co-processing (e.g., Profibus DP slave). IC Role / Device Role / Timing Role: XC6SLX150-2FGG676I serves as central logic engine managing cyclic I/O scanning, safety monitoring, and protocol state machines. Use Value: XC6SLX150-2FGG676I provides certified functional safety-ready logic resources and deterministic scan cycle timing under IEC 61508 SIL2. | Use Scenario: Protocol bridging between legacy TDM backplanes and modern packet-based interconnects in telecom line cards. IC Role / Device Role / Timing Role: FPGA implements T1/E1 framer, HDLC controller, and SerDes-to-parallel conversion using LVDS I/O and DCM-synchronized clocks. Use Value: XC6SLX150-2FGG676I supports 2.048 Mbps T1 and 8.192 Mbps E3 rates with <1 ppm clock stability via DCM lock. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface consolidation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG676I | Faster speed grade (-3) with tighter timing margins; same logic resources, package, and I/O count | Better suited for designs requiring >150 MHz system clocks or higher DDR3 interface speeds | Select when timing closure fails at -2 grade or when future-proofing for higher clock domains |
| XC6SLX100-2FGG676I | Reduced logic cells (101,280), fewer DSP slices (396), and lower block RAM (3,520 kbits); identical package and I/O count | Targeted at cost-sensitive applications with less complex control or signal processing requirements | Choose when design fits within smaller resource budget and avoids over-provisioning |
Compared with XC6SLX150-2FGG676I, the -3 variant offers improved timing headroom without layout changes, while the XC6SLX100-2FGG676I trades logic density for lower unit cost - both share pinout and toolchain compatibility but differ in performance ceiling and resource scalability.
Availability
XC6SLX150-2FGG676I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision preprocessing, and programmable logic controller (PLC) applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150-2FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance, low-latency applications.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and seamless integration with legacy interfaces - especially in industrial automation and embedded vision.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150-2FGG676I?
The XC6SLX150-2FGG676I supports SelectIO™ standards across 1.2 V to 3.3 V, including LVCMOS12/15/18/25/33, LVTTL, HSTL_I/II, SSTL18_I/II, and differential standards like LVDS and TMDS. Each I/O bank is independently configurable, allowing mixed-voltage operation on a single device. The XC6SLX150-2FGG676I requires proper VCCO assignment per bank and adherence to Xilinx UG381 for voltage domain isolation.
Does XC6SLX150-2FGG676I include built-in transceivers for high-speed serial communication?
No, the XC6SLX150-2FGG676I does not integrate multi-gigabit transceivers (MGTs). It relies on its SelectIO™ infrastructure and DCMs to implement lower-speed serial protocols (e.g., UART, SPI, I²C, LVDS links up to ~1 Gbps aggregate) using programmable logic. For PCIe Gen1 x1, it uses LogiCORE IP with external PHY or integrated endpoint capability via hard IP - not native transceivers. This distinguishes XC6SLX150-2FGG676I from Virtex or Kintex families.
What configuration modes are supported by XC6SLX150-2FGG676I?
The XC6SLX150-2FGG676I supports master SPI, slave SPI, master BPI, JTAG, and fallback configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be loaded from external SPI flash (e.g., Micron N25Q series), parallel NOR/NAND flash, or via JTAG using Xilinx iMPACT. The XC6SLX150-2FGG676I also supports dual configuration images for fail-safe updates.
Is XC6SLX150-2FGG676I qualified for automotive applications?
No, the XC6SLX150-2FGG676I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and enhanced ESD/latch-up immunity required for automotive ECUs. While used in some transportation-adjacent industrial systems, XC6SLX150-2FGG676I is not approved for safety-critical automotive functions per ISO 26262.
Which software tools support XC6SLX150-2FGG676I design and implementation?
The XC6SLX150-2FGG676I is fully supported by Xilinx ISE Design Suite v14.7 - the final and only officially supported toolchain. It is not compatible with Vivado, which targets 7-series and newer devices. Synthesis, place-and-route, timing analysis, and bitstream generation for XC6SLX150-2FGG676I require ISE 14.7 with appropriate service packs and device libraries installed.
XC6SLX150-2FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150-2FGG676I FAQ
1.How can I place an order for XC6SLX150-2FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-2FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-2FGG676I reliable?
The price and inventory of XC6SLX150-2FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-2FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-2FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-2FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-2FGG676I?
XC6SLX150-2FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-2FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-2FGG676I?
For technical support, including XC6SLX150-2FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-2FGG676I requirements.
6.How does Aetrix verify that XC6SLX150-2FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-2FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-2FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-2FGG676I?
All XC6SLX150-2FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-2FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-2FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX150-2FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX150-2FGG676I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
