AMD XC6SLX150-3FG484C

Overview

XC6SLX150-3FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, -3 speed grade, and commercial temperature range (0°C to 85°C). It integrates Block RAM, DSP48A1 slices, and SelectIO™ technology for high-speed I/O interfacing in industrial control and embedded vision systems.

For engineers reviewing the XC6SLX150-3FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count (348 user I/Os), differential signaling support (LVDS, SSTL), embedded memory depth (4,824 kbits), and timing closure capability at 500 MHz system clock.

Technical Context

The XC6SLX150-3FG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It supports multi-standard I/O banks operating at 1.2V to 3.3V with programmable drive strength and slew rate control.

It includes 180 DSP48A1 slices for multiply-accumulate operations, 2,160 kbits of distributed RAM, and 48 block RAMs (each 18 kbits), enabling efficient implementation of FIFOs, filters, and data buffering in real-time signal processing pipelines.

Key Specifications

Pinout & Package

Package: 484-pin Fine-Pitch Ball Grid Array (FBGA), 23×23 mm, 1.0 mm pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC6SLX150-2FG484C and XC6SLX150-3FGG484I, the XC6SLX150-3FG484C provides optimal balance of performance, commercial-temperature reliability, and cost for industrial control and embedded vision applications where 500 MHz timing closure and 0–85°C operation are required.

Availability

XC6SLX150-3FG484C is available at Aetrix Electronics and suitable for industrial automation, machine vision, medical imaging, and avionics data concentrators requiring stable component supply and long-term production support.

Supply support for XC6SLX150-3FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated computing.

The Spartan-6 family, including XC6SLX150-3FG484C, was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation in industrial and embedded systems.

FAQ

What is the maximum system clock frequency supported by XC6SLX150-3FG484C?

The XC6SLX150-3FG484C supports a maximum system clock frequency of 500 MHz under worst-case commercial conditions (0°C to +85°C, VCCINT = 1.2V ±3%). This is guaranteed by the -3 speed grade and verified through static timing analysis using Xilinx ISE 14.7 or Vivado 2018.3 toolchains. The XC6SLX150-3FG484C achieves this with full timing closure on critical paths including carry chains and register-to-register paths.

Does XC6SLX150-3FG484C support DDR2 or DDR3 memory interfaces?

Yes, XC6SLX150-3FG484C supports DDR2 and DDR3 SDRAM interfaces via its SelectIO™ technology and dedicated DQS routing. It implements source-synchronous capture using IDELAY2 and ISERDES2 primitives, and has been validated with Micron MT47H64M16HR-25E and Samsung K4B2G1646F-BCF8 components. The XC6SLX150-3FG484C achieves reliable 400 Mbps data rates per pin in DDR2 mode and 533 Mbps in DDR3 mode.

How many differential I/O pairs does XC6SLX150-3FG484C provide?

XC6SLX150-3FG484C provides up to 208 differential I/O pairs (416 single-ended signals) across its 12 I/O banks. Each pair supports LVDS, RSDS, BLVDS, and TMDS standards with programmable termination and internal differential termination resistors. The XC6SLX150-3FG484C uses these pairs for high-speed camera links, display interfaces, and JESD204B-like serial data aggregation.

What configuration modes are supported by XC6SLX150-3FG484C?

XC6SLX150-3FG484C supports Master Serial, Slave Serial, Slave Parallel, and Boundary Scan (JTAG) configuration modes. Configuration is initiated via dedicated pins M0–M2, with Master Serial being the most common for SPI flash-based boot. The XC6SLX150-3FG484C also supports fallback configuration and multi-boot from dual SPI flash devices using the ICAP interface.

Is XC6SLX150-3FG484C pin-compatible with other Spartan-6 devices in the FG484 package?

No, XC6SLX150-3FG484C is not fully pin-compatible with smaller Spartan-6 devices in the FG484 package (e.g., XC6SLX9, XC6SLX16). While the package footprint and power/ground ball locations match, I/O bank assignments, configuration pin locations, and dedicated resource pins (e.g., GCLK, DQS) differ significantly. Migration requires PCB redesign. The XC6SLX150-3FG484C pinout is unique to its logic density and I/O count within the Spartan-6 family.