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AMD XC6SLX150-3FG676C
- Part No.:
- XC6SLX150-3FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150-3FG676C.pdf
- Description:
- IC FPGA 498 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,285
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Product details
Overview
XC6SLX150-3FG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18-bit x 36Kb block RAM, and 350 I/O pins in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -3 speed grade with 1.2V core voltage and supports LVCMOS, LVDS, and SSTL I/O standards for industrial control and embedded vision systems.
For engineers reviewing the XC6SLX150-3FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory capacity, and thermal performance in space-constrained PCB layouts.
Technical Context
The XC6SLX150-3FG676C implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with dedicated DSP48A1 slices supporting 18×18 multipliers and accumulator functions. It integrates dual-clock domain management via Digital Clock Managers (DCMs) and supports configuration through SPI, SelectMAP, or JTAG interfaces.
This device includes 220 user-configurable I/O banks with independent VCCO and VREF per bank, enabling mixed-voltage system interfacing. Its -3 speed grade guarantees timing closure up to 500 MHz for critical paths under worst-case industrial temperature conditions (0°C to 85°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| Block RAM | 3,096 Kbits (18 × 36 Kb blocks) - supports FIFOs, buffers, and data storage without external memory |
| I/O Pins | 350 - user-accessible bidirectional signals with programmable drive strength and slew rate |
| Speed Grade | -3 - highest performance grade in Spartan-6 family, enabling 500 MHz clock domain operation |
| Core Voltage | 1.2 V ±3% - fixed internal supply requiring tight regulation for stable logic operation |
| Operating Temp | 0°C to +85°C - qualified for industrial environments without derating |
| Package | 676-pin FBGA (Fine-Pitch BGA), 27×27 mm, 1.0 mm ball pitch - requires controlled-depth reflow and microvia PCB design |
Pinout & Package
XC6SLX150-3FG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 27×27 array, 1.0 mm ball pitch, and thermal pad. Pinout follows Xilinx DS162 specification: balls are organized into I/O banks (0–4), configuration banks (CONFIG), and dedicated power/ground balls (VCCINT, VCCAUX, GND, VCCO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.2 V core power supply input - must be decoupled within 10 mm of ball with ≥10 µF + 100 nF ceramic stack |
| P17 | VCCAUX | 2.5 V auxiliary supply for configuration logic and DCM - requires separate low-noise regulation |
| A12 | PROGRAM_B | Active-low asynchronous reset for configuration state machine - pulled high via 4.7 kΩ resistor |
| D19 | CCLK | Configuration clock output during master SPI mode - drives external PROM or flash memory |
| T18 | DONE | Open-drain status signal indicating successful bitstream loading - requires external pull-up |
| R15 | INIT_B | Active-low initialization status - asserted low during configuration error or CRC mismatch |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 180 units with 18×18 multiplier, pre-adder, and 48-bit accumulator - enables real-time FIR filtering and motor control algorithms |
| Digital Clock Manager (DCM) | Two DCMs per device providing frequency synthesis, phase shifting, and duty-cycle correction - eliminates need for external clock ICs |
| Embedded Memory | 3,096 Kbits block RAM + distributed RAM - supports dual-port RAM, ROM, and shift register implementations |
| I/O Standards Support | LVCMOS, LVDS, SSTL, HSTL, PCI - allows direct interface to DDR2 memory, image sensors, and industrial buses |
| Configuration Security | Bitstream encryption via AES-256 and HMAC authentication - prevents IP theft and unauthorized reprogramming |
Applications
| Industrial PLC Controller | Machine Vision Camera Interface |
|---|---|
Use Scenario: Real-time motion control and I/O expansion in modular automation cabinets. IC Role / Device Role / Timing Role: Configurable logic fabric executes ladder logic and PID loops; DCMs synchronize encoder feedback and servo drive timing. Use Value: 147K logic cells enable full PLC runtime plus communication stacks (Modbus TCP, EtherCAT) on single chip. | Use Scenario: High-speed CMOS image sensor interface with on-board preprocessing in smart cameras. IC Role / Device Role / Timing Role: FPGA acts as pixel data aggregator and preprocessor; LVDS I/O receives 12-bit parallel video streams at 100 MHz. Use Value: 350 I/O pins support simultaneous sensor interface, DDR2 frame buffer, and GigE MAC - no external glue logic required. |
| Medical Imaging Front-End | Avionics Data Acquisition Unit |
Use Scenario: Ultrasound beamforming and echo digitization in portable diagnostic devices. IC Role / Device Role / Timing Role: DSP48A1 slices perform real-time FIR filtering on ADC samples; block RAM stores delay profiles for phased array steering. Use Value: 180 DSP slices deliver >2 GOPS sustained compute for dynamic beamforming without off-chip processors. | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight test instrumentation. IC Role / Device Role / Timing Role: FPGA implements protocol engines and time-stamped packet buffering; DCMs align timestamps to GPS PPS signal. Use Value: Dual DCMs provide sub-5 ns timestamp resolution across multiple serial buses - meets DO-254 Level A timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FG676C | Lower -2 speed grade; 400 MHz max clock vs. 500 MHz for -3 grade | Suitable for cost-sensitive designs where timing margin is relaxed | Select when meeting timing closure at lower frequency reduces power and simplifies PCB layout |
| XC6SLX150-3FGG676I | Same logic and I/O resources but extended temperature range (-40°C to +100°C) | Required for avionics or outdoor deployed systems with wider thermal cycling | Choose only if industrial temp range is insufficient for target environmental profile |
Compared with XC6SLX150-2FG676C and XC6SLX150-3FGG676I, the XC6SLX150-3FG676C delivers optimal balance of performance, power, and industrial qualification - making it the default choice for volume production in factory automation and embedded vision.
Availability
XC6SLX150-3FG676C is available at Aetrix Electronics and suitable for industrial control, embedded vision, and medical imaging applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX150-3FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.
The Spartan-6 family was originally designed by Xilinx for cost-optimized, low-power FPGA applications in industrial, automotive, and consumer systems - with emphasis on I/O flexibility and ease of migration from ASICs.
FAQ
What is the maximum operating frequency supported by XC6SLX150-3FG676C?
The XC6SLX150-3FG676C has a -3 speed grade, guaranteeing timing closure up to 500 MHz for critical paths under worst-case industrial conditions (0°C to +85°C). Actual achievable frequency depends on design complexity, routing, and I/O standard selection - verified using Xilinx ISE or Vivado timing analysis tools. The XC6SLX150-3FG676C DCMs support output frequencies up to 500 MHz with jitter below 200 ps RMS.
Does XC6SLX150-3FG676C support configuration via JTAG?
Yes, XC6SLX150-3FG676C supports JTAG boundary-scan configuration and debugging per IEEE 1149.1. It uses TCK, TMS, TDI, and TDO pins for programming and verification. JTAG mode is enabled by pulling PROGRAM_B high and setting M[2:0] = 111. The XC6SLX150-3FG676C also supports fallback to slave serial or master SPI modes depending on configuration pin states.
What I/O standards are supported by XC6SLX150-3FG676C?
XC6SLX150-3FG676C supports LVCMOS (1.2V to 3.3V), LVDS, SSTL, HSTL, and PCI I/O standards across its 220 configurable I/O banks. Each bank has independent VCCO and VREF settings, enabling mixed-voltage interfaces such as DDR2 memory (SSTL_18) and camera sensors (LVDS). The XC6SLX150-3FG676C does not support differential standards beyond LVDS and TMDS.
Is XC6SLX150-3FG676C pin-compatible with other Spartan-6 devices?
No, XC6SLX150-3FG676C is not pin-compatible with smaller Spartan-6 devices like XC6SLX9 or XC6SLX45 due to differing ball counts and I/O bank allocations. However, it shares the same 676-pin FBGA footprint with XC6SLX150 variants (-2FG676C, -3FGG676I), allowing PCB reuse across speed and temperature grades. The XC6SLX150-3FG676C pinout is defined in Xilinx DS162 and must be followed exactly for signal integrity.
What thermal management is required for XC6SLX150-3FG676C?
XC6SLX150-3FG676C requires a thermal pad on the underside of the 676-pin FBGA package connected to an internal copper plane or external heatsink. Typical power dissipation ranges from 1.8 W (static) to 4.2 W (full utilization at 500 MHz). The XC6SLX150-3FG676C datasheet specifies θJA = 22.5°C/W for 4-layer board reference design - thermal vias under the thermal pad and 2 oz copper improve performance by 30%.
XC6SLX150-3FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150-3FG676C FAQ
1.How can I place an order for XC6SLX150-3FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-3FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-3FG676C reliable?
The price and inventory of XC6SLX150-3FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-3FG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX150-3FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-3FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-3FG676C?
XC6SLX150-3FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-3FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-3FG676C?
For technical support, including XC6SLX150-3FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-3FG676C requirements.
6.How does Aetrix verify that XC6SLX150-3FG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-3FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-3FG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX150-3FG676C?
All XC6SLX150-3FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-3FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-3FG676C part is unused and in its original packaging.
Return procedure for XC6SLX150-3FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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