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AMD XC6SLX150-3FG676I
- Part No.:
- XC6SLX150-3FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150-3FG676I.pdf
- Description:
- IC FPGA 498 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,223
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Product details
Overview
XC6SLX150-3FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18-bit × 36-kbit block RAM, and 324 user I/Os in a 676-pin Fine-Pitch BGA (FG676) package. It operates at -3 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and targets high-volume embedded control and interface bridging applications.
For engineers reviewing the XC6SLX150-3FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, DSP48E slice availability, speed grade timing closure, and industrial-grade thermal reliability.
Technical Context
The XC6SLX150-3FG676I implements a configurable logic fabric with six-input LUTs and integrated shift registers. It includes 180 DSP48E slices for arithmetic-intensive tasks and supports SelectIO standards including LVCMOS, LVDS, and SSTL up to 1.0 Gbps per differential pair.
Configuration is performed via Master SPI or JTAG, with support for fallback configuration and multi-boot. The device integrates dedicated clock management tiles (CMT) containing DCMs and PLLs for internal clock synthesis and jitter reduction across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| Block RAM | 4,032 kbits - distributed as 324 × 18-kbit dual-port blocks enabling FIFOs, buffers, and data storage |
| DSP Slices | 180 DSP48E - fixed-point multiply-accumulate units supporting 25 × 18-bit multiplication with pipeline options |
| User I/O Pins | 324 - configurable single-ended or differential I/Os compliant with 14+ I/O standards including LVDS and SSTL_18 |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequencies defined in Xilinx DS162 for industrial temp range |
| Core Voltage | 1.2 V ±3% - required supply for logic fabric and block RAM; separate 2.5 V/3.3 V for I/O banks |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
Pinout & Package
XC6SLX150-3FG676I is housed in a 27 × 27 mm, 676-ball Fine-Pitch BGA (FG676) package with 1.0 mm ball pitch and standard I/O, power, and configuration pin assignments per Xilinx UG382 v1.11.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply (configurable 1.2–3.3 V) |
| A2 | IO_L0N_0 | Differential input pair negative for Bank 0 (LVDS-capable) |
| B2 | IO_L0P_0 | Differential input pair positive for Bank 0 (LVDS-capable) |
| T1 | M0 | Configuration mode select bit 0 (Master SPI mode when low) |
| T2 | M1 | Configuration mode select bit 1 (Master SPI mode when low) |
| R1 | M2 | Configuration mode select bit 2 (Master SPI mode when high) |
| P1 | CCLK | Configuration clock input/output during Master SPI programming |
| P2 | DIN | Serial configuration data input for Master SPI mode |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two CMTs each with two DCMs and one PLL - enables multi-domain clock synthesis and phase alignment |
| SelectIO Technology | Support for 14 I/O standards including LVDS, SSTL, HSTL, and PCI - simplifies interface to memory, ADCs, and FPGAs |
| Configurable Logic Blocks | Six-input LUTs with optional shift register and carry chain - improves logic density and arithmetic efficiency |
| System Monitor | On-chip analog-to-digital converter for real-time monitoring of on-die temperature and supply voltage |
| ISE Design Suite Support | Fully supported by Xilinx ISE 14.7 - includes place-and-route, timing analysis, and bitstream generation tools |
Applications
| Industrial PLC I/O Module | Medical Imaging Interface Bridge |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between fieldbus sensors and host controller. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and parallel I/O expansion logic with deterministic latency. Use Value: 324 user I/Os enable direct connection to 48-channel analog input modules while maintaining sub-100 ns timing resolution. | Use Scenario: High-speed data aggregation from multiple CT/MRI sensor front-ends into a unified PCIe stream. IC Role / Device Role / Timing Role: Protocol bridge converting LVDS camera links to AXI-Stream for downstream processing. Use Value: 180 DSP48E slices accelerate pixel-level filtering; LVDS I/O supports 1.0 Gbps per lane for raw sensor throughput. |
| Avionics Data Concentrator | Test Equipment Digital Pattern Generator |
Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals onto a common Ethernet backbone. IC Role / Device Role / Timing Role: Deterministic packet assembly engine with time-stamped event capture and error correction. Use Value: Industrial temperature rating (-40°C to +100°C) ensures operation in uncooled avionics bays; dual CMTs maintain synchronized timestamping. | Use Scenario: Generating precise, multi-channel digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: High-speed pattern sequencer with programmable timing skew and loop control. Use Value: -3 speed grade guarantees 200 MHz system clock timing closure; block RAM stores 128k-depth waveform sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FG676C | Slower -2 speed grade; commercial temperature range (0°C to +85°C); identical logic resources and I/O count | Limited to non-industrial environments; lower static power but reduced timing margin | Select when cost sensitivity outweighs extended temperature or timing headroom requirements |
| XC7A100T-2CSG324I | Artix-7 architecture; higher logic density (101,440 LUTs), 28 nm process, no native support for legacy ISE toolchain | Requires Vivado design flow; better DSP and transceiver integration but longer migration path | Choose for new designs needing higher performance or future-proofing, not drop-in replacement |
Compared with XC6SLX150-3FG676I, the -2FG676C offers cost savings in benign environments, while the XC7A100T-2CSG324I provides architectural advancement at the expense of toolchain and IP migration effort.
Availability
XC6SLX150-3FG676I is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and avionics data concentrators requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX150-3FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for long-lifecycle industrial and aerospace applications.
The Spartan-6 family was designed for cost-sensitive, high-volume embedded systems requiring predictable timing, low static power, and broad I/O flexibility - especially where legacy toolchain compatibility remains critical.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150-3FG676I?
The XC6SLX150-3FG676I supports I/O voltages from 1.2 V to 3.3 V per bank, with individual bank configuration. LVDS operation requires VCCO = 2.5 V, while SSTL_18 requires 1.8 V. All settings must comply with Xilinx DS162 Table 11 for simultaneous switching noise limits. XC6SLX150-3FG676I does not support 1.0 V I/O standards.
Does XC6SLX150-3FG676I support JTAG boundary-scan testing?
Yes, XC6SLX150-3FG676I includes IEEE 1149.1-compliant TAP controller and boundary-scan logic. All user I/Os and configuration pins are accessible via JTAG, and BSDL files are provided in Xilinx UG382. XC6SLX150-3FG676I supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions for board-level test coverage.
Can XC6SLX150-3FG676I be configured using a microcontroller over SPI?
Yes, XC6SLX150-3FG676I supports Master SPI configuration mode, allowing an external microcontroller to drive CCLK and DIN pins directly. Configuration bitstream must be stored in external SPI flash, and M[2:0] pins must be set to 001. XC6SLX150-3FG676I does not support slave serial or BPI modes in this context.
What thermal management guidance applies to XC6SLX150-3FG676I in industrial applications?
XC6SLX150-3FG676I requires a minimum 4-layer PCB with internal ground/power planes and thermal vias under the package. Xilinx UG382 specifies 2.5 W typical power dissipation at full utilization; junction temperature must remain ≤125°C. XC6SLX150-3FG676I includes System Monitor ADC for real-time die temperature readback via I2C.
Is XC6SLX150-3FG676I compatible with Xilinx ISE 13.4 or later?
XC6SLX150-3FG676I is fully supported starting with Xilinx ISE 12.4 and all subsequent versions through ISE 14.7. ISE 13.4 provides complete synthesis, place-and-route, and bitstream generation capability for XC6SLX150-3FG676I. Later versions do not extend functionality beyond ISE 14.7, which remains the final supported release.
XC6SLX150-3FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150-3FG676I FAQ
1.How can I place an order for XC6SLX150-3FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-3FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-3FG676I reliable?
The price and inventory of XC6SLX150-3FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-3FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-3FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-3FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-3FG676I?
XC6SLX150-3FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-3FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-3FG676I?
For technical support, including XC6SLX150-3FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-3FG676I requirements.
6.How does Aetrix verify that XC6SLX150-3FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-3FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-3FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-3FG676I?
All XC6SLX150-3FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-3FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-3FG676I part is unused and in its original packaging.
Return procedure for XC6SLX150-3FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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