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AMD XC6SLX150-3FG900C
- Part No.:
- XC6SLX150-3FG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150-3FG900C.pdf
- Description:
- IC FPGA 576 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,428
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Product details
Overview
XC6SLX150-3FG900C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 147,443 logic cells, 480 I/O pins, and a -3 speed grade supporting 1.2 GHz internal clocking. It integrates 4.9 Mbits of block RAM, 576 DSP48A1 slices, and operates at 1.2 V core voltage in commercial temperature range (0°C to 85°C). Used in industrial video processing and reconfigurable I/O bridging.
For engineers reviewing the XC6SLX150-3FG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, DSP slice availability, speed grade timing closure, and FG900 package thermal performance.
Technical Context
The XC6SLX150-3FG900C implements a fully programmable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It supports SelectIO standards including LVCMOS, LVDS, and SSTL up to 1.0 Gbps per differential pair.
Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces; startup time is 40–100 ms depending on mode and configuration source. Built-in DCI (Digitally Controlled Impedance) enables on-die termination for select I/O standards without external resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total configurable logic resources for state machines, data paths, and glue logic |
| I/O Pins | 480 - user-accessible bidirectional pins with bank-wise voltage and standard assignment |
| Block RAM | 4.9 Mbits - distributed across 232 blocks, each configurable as 18 Kb dual-port RAM or FIFO |
| DSP Slices | 576 - 18×25 signed multiplier + accumulator units supporting pipelined math operations |
| Speed Grade | -3 - fastest timing bin for Spartan-6, enabling 1.2 GHz internal clock domain operation |
| Core Voltage | 1.2 V ±3% - fixed supply requirement for logic fabric and CLB operation |
| Operating Temp | 0°C to +85°C - commercial-grade thermal range verified per JEDEC JESD22-A104 |
Pinout & Package
XC6SLX150-3FG900C is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 31×31 array, 1.0 mm ball pitch, and 35 mm × 35 mm body size. Thermal pad exposed on underside improves power dissipation for sustained 2.5 W typical operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated balls provide low-inductance return paths for I/O and core domains |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V supply per bank; sets voltage for all I/O standards in Bank 0 |
| VCCAUX | Auxiliary supply | 2.5 V supply powering configuration logic, JTAG, and transceivers |
| PROGRAM_B | Active-low reset | Asynchronous global reset that clears configuration memory and initiates reload sequence |
| CCLK | Configuration clock | Input clock for Master SPI configuration mode; frequency ≤ 50 MHz |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream load or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Hard IP block supporting Gen1 x1 link with full DMA engine and TLP parsing |
| Digitally Controlled Impedance (DCI) | On-die series/parallel termination for LVDS and SSTL, eliminating 24+ external resistors |
| MultiBoot Configuration | Support for up to 4 independent bitstreams stored in SPI flash with fail-safe fallback |
| ISE Design Suite Support | Fully compatible with Xilinx ISE 14.7 toolchain for synthesis, place-and-route, and timing analysis |
| Low-Power Advanced Sleep Mode | Reduces static current to <100 µA while retaining configuration state and I/O hold |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time preprocessing of high-resolution camera sensor streams (e.g., 4K @ 60 fps) before GPU offload. IC Role / Device Role / Timing Role: FPGA acts as pixel-level pipeline accelerator with sub-cycle latency control over image buffers and DMA engines. Use Value: Enables deterministic 12-bit pixel alignment and Bayer demosaicing using 576 DSP48A1 slices and 4.9 Mbits block RAM. | Use Scenario: Bridging legacy analog video (PAL/NTSC) and digital ultrasound front-end signals to PCIe-based host processors. IC Role / Device Role / Timing Role: Reconfigurable I/O interface handling mixed-voltage signaling and protocol translation between ADCs, DACs, and PCIe endpoint. Use Value: Supports simultaneous 16-channel 12-bit ADC sampling at 40 MSPS using 480 I/O pins and on-chip clock management. |
| Avionics Data Concentrator | Programmable Logic Controller (PLC) |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals into unified Ethernet/IP frames for flight control systems. IC Role / Device Role / Timing Role: Deterministic real-time protocol engine with hardware-timed response windows and fault-isolated bus controllers. Use Value: Meets DO-254 Level A timing requirements using -3 speed grade and built-in PLL jitter specs of <150 ps RMS. | Use Scenario: Replacing ASIC-based motion control logic in modular PLC backplanes requiring field-upgradable logic functions. IC Role / Device Role / Timing Role: Configurable state machine executing ladder logic scan cycles with microsecond-level I/O update resolution. Use Value: Delivers 200 ns input-to-output propagation delay across 480 I/O pins with DCI-controlled signal integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FG900C | Slower -2 speed grade; 15–20% longer path delays; lower max internal clock frequency (≤1.0 GHz) | Suitable for non-critical timing paths; reduced power consumption at same I/O loading | Select when timing closure is achievable without -3 margin and thermal budget is constrained |
| XC7A200T-2FBG676C | Artix-7 architecture; higher logic density (215,360 LUTs); 2.5x more DSP slices; 1.8 V core; no native PCI Express Gen1 endpoint | Requires ISE-to-Vivado migration; supports DDR3/DDR4 memory interfaces not available in Spartan-6 | Choose for new designs needing higher bandwidth, lower static power, or DDR3 controller integration |
Compared with XC6SLX150-2FG900C and XC7A200T-2FBG676C, the XC6SLX150-3FG900C delivers optimal balance of proven timing closure, mature toolchain support, and integrated PCIe Gen1 - critical for sustaining legacy industrial and avionics platforms where requalification cost outweighs raw performance gain.
Availability
XC6SLX150-3FG900C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XC6SLX150-3FG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family under its Adaptive SoC portfolio. The company specializes in adaptive computing solutions for aerospace, industrial, and communications infrastructure.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable reconfigurable logic with integrated peripherals - especially where long-lifecycle support and mature design tools are essential.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150-3FG900C?
The XC6SLX150-3FG900C supports I/O voltages from 1.2 V to 3.3 V per bank, with individual banks configurable for LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, and SSTL18. Each bank's VCCO must match the selected standard's nominal voltage, and DCI termination requires VCCO ≥ 1.5 V.
Does XC6SLX150-3FG900C support partial reconfiguration?
No, the XC6SLX150-3FG900C does not support partial reconfiguration. It uses a monolithic configuration architecture where the entire bitstream must be loaded to initialize or update logic. Dynamic reconfiguration requires external controller coordination and full reload cycles, unlike later 7-series FPGAs with dedicated ICAP interfaces.
What configuration modes are supported by XC6SLX150-3FG900C?
The XC6SLX150-3FG900C supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Master SPI uses an internal oscillator and CCLK to read bitstream from external SPI flash; Slave Serial relies on external clock; JTAG enables programming and debugging via standard IEEE 1149.1 interface.
Is XC6SLX150-3FG900C RoHS compliant and lead-free?
Yes, XC6SLX150-3FG900C is RoHS-compliant and lead-free per EU Directive 2011/65/EU and IPC/JEDEC J-STD-609A Class 3. The FG900 package uses matte tin finish on solder balls, and the device meets halogen-free requirements per IEC 61249-2-21.
What is the recommended operating junction temperature range for XC6SLX150-3FG900C?
The XC6SLX150-3FG900C is rated for a junction temperature range of –40°C to +100°C under continuous operation. Its commercial-grade ambient rating (0°C to +85°C) assumes proper PCB thermal design with ≥2 oz copper planes and ≥4 thermal vias under the thermal pad to maintain junction limits during 2.5 W typical power dissipation.
XC6SLX150-3FG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150-3FG900C FAQ
1.How can I place an order for XC6SLX150-3FG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-3FG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-3FG900C reliable?
The price and inventory of XC6SLX150-3FG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-3FG900C is usually 5 days.
3.What payment methods are accepted for XC6SLX150-3FG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-3FG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-3FG900C?
XC6SLX150-3FG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-3FG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-3FG900C?
For technical support, including XC6SLX150-3FG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-3FG900C requirements.
6.How does Aetrix verify that XC6SLX150-3FG900C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-3FG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-3FG900C meets industry standards.
7.What is the process for return or replacement of XC6SLX150-3FG900C?
All XC6SLX150-3FG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-3FG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-3FG900C part is unused and in its original packaging.
Return procedure for XC6SLX150-3FG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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