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AMD XC6SLX150-3FG900I
- Part No.:
- XC6SLX150-3FG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150-3FG900I.pdf
- Description:
- IC FPGA 576 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,829
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Product details
Overview
XC6SLX150-3FG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 180 DSP48A1 slices, 4.2 MB of total block RAM, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial motor control systems requiring deterministic real-time I/O processing and embedded vision preprocessing.
For engineers reviewing the XC6SLX150-3FG900I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (544 user I/Os), LVDS support, configuration interface options (SPI/BPI/Slave SelectMAP), and JTAG boundary-scan compliance for production testability.
Technical Context
The XC6SLX150-3FG900I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates clock management tiles (CMT) containing DCMs and PLLs supporting input frequencies from 10 MHz to 500 MHz and output jitter < 150 ps RMS.
Configuration is supported via Master SPI, Slave SPI, BPI, or SelectMAP modes using external flash or processor. The device includes 128 Kbits of internal startup ROM and supports bitstream encryption with AES-128 for secure configuration loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 4.2 MB - enables local data buffering, FIFOs, and small-frame image storage without external memory |
| DSP Slices | 180 × DSP48A1 - supports fixed-point multiply-accumulate operations up to 25×18-bit per slice |
| User I/O Pins | 544 - provides high-density parallel interface capability for sensors, displays, and FMC mezzanine connectivity |
| Speed Grade | -3 - guarantees timing closure at 500 MHz system clock with worst-case industrial temperature derating |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and transportation environments |
| Config Interface | Master/Slave SPI, BPI, SelectMAP - enables flexible boot source selection and field-upgradable firmware |
Pinout & Package
XC6SLX150-3FG900I is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 31×31 ball array, 1.0 mm pitch, and 27.0 mm × 27.0 mm body size. Thermal pad exposed on underside supports conduction cooling in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND / VCCO | Power supply reference / I/O bank voltage | Each of 12 I/O banks supports independent VCCO (1.2–3.3 V) for mixed-voltage interface design |
| CCLK / INIT_B | Configuration clock / initialization status | Active-low INIT_B signals configuration error or incomplete bitstream load during power-up |
| TCK / TMS / TDI / TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant in-circuit testing, debug, and programming without dedicated debug probes |
| M0–M2 | Configuration mode select | Three-pin encoding selects among SPI, BPI, SelectMAP, or JTAG configuration methods at power-on |
| IO_LxxN / IO_LxxP | Differential I/O pair | Supports LVDS, RSDS, and BLVDS signaling with internal 100 Ω differential termination |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two CMTs each with two DCMs and one PLL - enables multi-domain clock synthesis and phase alignment for video pixel clocks and ADC sampling |
| Secure Configuration | AES-128 bitstream encryption with HMAC authentication - prevents unauthorized cloning and ensures configuration integrity in deployed systems |
| Low-Power Architecture | Multi-voltage I/O banks and partial reconfiguration support - reduces dynamic power by >30% vs. Virtex-5 in comparable logic density applications |
| Embedded Memory | 4.2 MB distributed and block RAM - eliminates need for external SRAM in protocol bridging and packet buffering designs |
| Configurable I/O Standards | Support for LVCMOS, LVTTL, PCI, HSTL, SSTL, and differential standards - simplifies interface to legacy and modern peripherals without level shifters |
Applications
| Industrial Motor Control | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) loop execution with synchronized PWM generation and current sensing. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop control logic, encoder interpolation, and 16-channel PWM with < 100 ns jitter. Use Value: Deterministic latency enables sub-μs current loop response time, improving torque ripple suppression by 40% over microcontroller-based solutions. | Use Scenario: On-camera preprocessing of 720p@60fps Bayer sensor data before transmission to host processor. IC Role / Device Role / Timing Role: XC6SLX150-3FG900I performs demosaicing, gamma correction, and histogram equalization in pipeline stages. Use Value: Offloads 2.1 GOPS of compute from host CPU, reducing system power by 1.8 W while maintaining real-time throughput. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Modular I/O expansion module handling 64-channel isolated digital I/O and 16-channel analog input with timestamping. IC Role / Device Role / Timing Role: Configurable logic manages isolation interface timing, cyclic redundancy calculation, and EtherCAT slave stack execution. Use Value: Enables single-chip EtherCAT slave implementation with < 1 μs cycle jitter, meeting IEC 61158-2 Class A requirements. | Use Scenario: High-speed digital pattern generator with 200 MHz vector rate and 1 Mvector deep memory. IC Role / Device Role / Timing Role: XC6SLX150-3FG900I generates precise stimulus waveforms and captures response timing with picosecond-level resolution via IDELAY/ODELAY primitives. Use Value: Achieves 12-bit effective resolution in time-interval measurement without external TDC ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGB2104I | UltraScale architecture, 2.5× higher logic density, 4× more DSP slices, supports PCIe Gen3 x16 and DDR4 | Targeted at high-throughput data acquisition and AI edge inference where XC6SLX150-3FG900I lacks bandwidth | Select when >1 Gbps serial I/O or >100 k logic cells required; not drop-in compatible due to package and toolchain differences |
| XC7A200T-2FBG484I | Artix-7 architecture, 195k logic cells, lower static power, native support for transceivers up to 6.6 Gbps | Better suited for cost-sensitive, low-power applications with moderate serial connectivity needs | Choose for new designs needing transceiver integration and reduced thermal footprint; requires HDL and constraints migration |
Compared with XC6SLX150-3FG900I, the XC7A200T-2FBG484I offers superior transceiver performance and lower static power but lacks industrial-grade qualification at full speed grade; the XCVU9P-2FLGB2104I delivers massive scalability but incurs significantly higher BOM and toolchain licensing costs.
Availability
XC6SLX150-3FG900I is available at Aetrix Electronics and suitable for industrial automation, embedded vision, programmable logic controller (PLC), and test equipment applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150-3FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families for adaptive computing solutions.
The Spartan-6 family, including XC6SLX150-3FG900I, was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, deterministic timing, and long-term industrial availability.
FAQ
What is the maximum operating frequency of the XC6SLX150-3FG900I?
The XC6SLX150-3FG900I is rated at speed grade -3, guaranteeing timing closure for system clocks up to 500 MHz under worst-case industrial temperature conditions (-40°C to +100°C). Actual achievable frequency depends on design utilization, routing congestion, and I/O standard selection, but internal clock networks support 560 MHz in typical lab conditions with optimized placement.
Does the XC6SLX150-3FG900I support JTAG boundary-scan testing?
Yes, the XC6SLX150-3FG900I fully complies with IEEE 1149.1 (JTAG) standards. Its TCK, TMS, TDI, and TDO pins enable in-system programming, configuration verification, and structural testing without requiring additional debug hardware. Boundary-scan testing covers all user I/Os and internal logic resources as defined in the BSDL file.
Can the XC6SLX150-3FG900I be configured via SPI flash memory?
Yes, the XC6SLX150-3FG900I supports Master SPI configuration mode, allowing direct boot from standard quad-SPI or dual-SPI flash devices such as Micron MT25QL or Winbond W25Q series. Configuration occurs automatically on power-up when M0–M2 pins are set to 001, and the device reads the bitstream sequentially from address 0x000000.
What I/O standards are supported by the XC6SLX150-3FG900I?
The XC6SLX150-3FG900I supports 17 I/O standards including LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, PCI, HSTL Class I/II, SSTL2 Class I/II, and differential standards like LVDS, RSDS, and BLVDS. Each of its 12 I/O banks can be independently powered, enabling mixed-voltage board designs without external level shifters.
Is the XC6SLX150-3FG900I qualified for industrial temperature operation?
Yes, the XC6SLX150-3FG900I carries the 'I' suffix denoting industrial temperature qualification, with guaranteed operation from -40°C to +100°C ambient. This includes full functionality of all logic resources, I/O banks, clock management tiles, and configuration circuitry across the entire range, validated per Xilinx DS162 specification.
XC6SLX150-3FG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150-3FG900I FAQ
1.How can I place an order for XC6SLX150-3FG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-3FG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-3FG900I reliable?
The price and inventory of XC6SLX150-3FG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-3FG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-3FG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-3FG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-3FG900I?
XC6SLX150-3FG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-3FG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-3FG900I?
For technical support, including XC6SLX150-3FG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-3FG900I requirements.
6.How does Aetrix verify that XC6SLX150-3FG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-3FG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-3FG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-3FG900I?
All XC6SLX150-3FG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-3FG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-3FG900I part is unused and in its original packaging.
Return procedure for XC6SLX150-3FG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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