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AMD XC6SLX150-3FGG484C
- Part No.:
- XC6SLX150-3FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150-3FGG484C.pdf
- Description:
- IC FPGA 338 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,107
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Product details
Overview
XC6SLX150-3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, -3 speed grade, and commercial temperature range (0°C to 85°C). It integrates block RAM, DSP48A1 slices, and SelectIO™ technology for high-speed I/O interfacing in industrial control and communications infrastructure.
For engineers reviewing the XC6SLX150-3FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count (348 user I/Os), embedded memory (4,824 Kbits block RAM), DSP slice count (180), and supported I/O standards including LVCMOS, LVDS, and SSTL.
Technical Context
The XC6SLX150-3FGG484C implements a fully programmable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for clock networks and global reset. It supports configuration via SPI, BPI, or JTAG interfaces and includes internal oscillator and startup circuitry.
It delivers deterministic timing performance at 333 MHz system clock frequency with -3 speed grade, and supports partial reconfiguration through ICAP interface. The device uses 40 nm CMOS process technology and operates at core voltage of 1.2 V ±3%.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total configurable logic resources for implementing digital logic functions |
| User I/O Pins | 348 - supports multi-standard I/O banks with programmable drive strength and slew rate |
| Block RAM | 4,824 Kbits - distributed across 2,193 blocks for data buffering and FIFO implementation |
| DSP48A1 Slices | 180 - fixed-point arithmetic units supporting multiply-accumulate operations at up to 250 MHz |
| Speed Grade | -3 - guarantees timing closure up to 333 MHz system clock frequency under commercial conditions |
| Core Voltage | 1.2 V ±3% - requires tight regulation; impacts power consumption and thermal design |
| Operating Temp | 0°C to +85°C - defines ambient thermal envelope for reliable operation without derating |
Pinout & Package
XC6SLX150-3FGG484C is housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated balls provide low-inductance return paths for core and I/O power domains |
| VCCO_0 | I/O bank supply | Supplies 1.2–3.3 V to Bank 0; sets compatible I/O standard (e.g., LVCMOS25, SSTL18) |
| VCCAUX | Auxiliary supply | Provides 2.5 V to configuration circuitry, JTAG, and certain I/O features |
| CONFIG_IO | Configuration I/O | Multi-function pins used during startup for mode selection and configuration data loading |
| CLK_IN | Primary clock input | Dedicated global clock input capable of driving multiple clock regions with low skew |
| PROGRAM_B | Reset control | Active-low asynchronous reset that initiates configuration reload from external source |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards including LVDS, RSDS, and differential HSTL - enables direct interface to ADCs, FPGAs, and memory without level-shifting |
| DSP48A1 Slice | 180 dedicated arithmetic units with 25×18-bit multiplier and 48-bit accumulator - accelerates filtering, FFT, and motor control algorithms |
| Block RAM | 2,193 × 2,193-bit dual-port RAM blocks - allows simultaneous read/write access for pipelined data flow in video processing |
| Partial Reconfiguration | Enables dynamic logic replacement via ICAP port - reduces system downtime during field updates in telecom baseband modules |
| Embedded Security | Bitstream encryption using AES-128 and HMAC-SHA-256 - protects intellectual property against unauthorized cloning or reverse engineering |
Applications
| Industrial Motor Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time closed-loop servo control with position feedback from encoders and current sensing. IC Role / Device Role / Timing Role: FPGA acts as deterministic real-time controller coordinating PWM generation, ADC sampling, and safety monitoring. Use Value: 348 user I/Os support parallel encoder inputs and isolated gate drivers; DSP48A1 slices execute PID loops at ≤1 µs latency. | Use Scenario: High-speed data aggregation from multiple CT/MRI sensor channels before transmission to host processor. IC Role / Device Role / Timing Role: Data concentrator and protocol bridge between analog front-end ASICs and PCIe or GigE interface. Use Value: Block RAM buffers burst sensor data; SelectIO™ supports LVDS inputs at 800 Mbps per lane for noise-immune signal capture. |
| Wireless Baseband Processing | Avionics Data Acquisition |
Use Scenario: Channelization, filtering, and modulation/demodulation in LTE small-cell radio units. IC Role / Device Role / Timing Role: Programmable baseband processor handling physical layer functions with adaptive algorithm updates. Use Value: 180 DSP48A1 slices implement parallel FIR filters and FFT engines; -3 speed grade ensures timing closure for 30.72 MHz LTE sampling clocks. | Use Scenario: ARINC 429 and MIL-STD-1553 bus monitoring and data logging in flight test instrumentation systems. IC Role / Device Role / Timing Role: Protocol-aware interface controller managing time-stamped message capture and error detection. Use Value: Configurable I/O banks support both 1553 differential signaling and ARINC 429 unidirectional levels; embedded security prevents tampering with logged telemetry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FGG484C | Slower -2 speed grade (max 250 MHz system clock); lower static power consumption | Suitable for cost-sensitive designs where timing margin is relaxed | Select when full -3 timing performance is not required and BOM cost reduction is prioritized |
| XC7K160T-2FFG676C | Kintex-7 architecture: higher logic density (162,240 LUTs), 28 nm process, built-in transceivers (6.6 Gbps) | Required for designs needing high-speed serial I/O or >300 MHz clock domains | Choose when migrating from Spartan-6 to higher bandwidth or integrating PCIe/SGMII without external PHY |
Compared with XC6SLX150-3FGG484C, the -2 variant trades speed for lower cost and power, while the Kintex-7 alternative adds transceivers and process node advantages but increases complexity and footprint - selection depends on whether serial connectivity or legacy pin compatibility is critical.
Availability
XC6SLX150-3FGG484C is available at Aetrix Electronics and suitable for industrial motor control, medical imaging interface, wireless baseband processing, and avionics data acquisition requiring stable component supply across long-lifecycle programs.
Supply support for XC6SLX150-3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O count, and power efficiency - targeting industrial, automotive, and communications edge systems.
FAQ
What is the maximum operating frequency supported by XC6SLX150-3FGG484C?
The XC6SLX150-3FGG484C has a -3 speed grade, guaranteeing timing closure for system clock frequencies up to 333 MHz under commercial temperature and voltage conditions. This rating applies to internal logic paths and is validated using Xilinx ISE timing analysis tools. Actual achievable frequency depends on design complexity, placement, and routing. The XC6SLX150-3FGG484C datasheet specifies setup/hold times and clock-to-out delays consistent with this speed grade.
Does XC6SLX150-3FGG484C support JTAG programming?
Yes, XC6SLX150-3FGG484C supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and verification. The TCK, TMS, TDI, and TDO pins are dedicated and electrically compatible with standard JTAG adapters. JTAG enables in-system programming and hardware validation without requiring external configuration memory. The XC6SLX150-3FGG484C also supports fallback configuration modes via SPI or BPI flash.
What I/O standards are supported by XC6SLX150-3FGG484C?
XC6SLX150-3FGG484C supports 18 I/O standards across its 12 I/O banks, including LVCMOS (1.2V–3.3V), LVDS, RSDS, Differential SSTL, and HSTL. Each bank is independently configurable for voltage and standard. The XC6SLX150-3FGG484C SelectIO™ technology allows mixing standards within a single bank only when voltage-compatible, and provides programmable drive strength and slew rate control per pin group.
Is XC6SLX150-3FGG484C suitable for automotive applications?
No, XC6SLX150-3FGG484C is rated for commercial temperature range (0°C to +85°C) and is not qualified to AEC-Q100. It lacks automotive-grade screening, extended temperature support, or enhanced reliability testing. For automotive use, Xilinx offers the Spartan-6Q family (e.g., XC6SLX150Q-3FGG484I) with industrial (-40°C to +100°C) or automotive (-40°C to +125°C) qualification. The XC6SLX150-3FGG484C is intended for industrial and communications equipment.
How much block RAM does XC6SLX150-3FGG484C provide?
XC6SLX150-3FGG484C contains 2,193 block RAM primitives, each 18 Kbits in size, totaling 4,824 Kbits (4.71 Mbits) of true dual-port RAM. These blocks support synchronous read/write, byte-write enable, and programmable parity. They are distributed throughout the FPGA fabric to minimize routing congestion. The XC6SLX150-3FGG484C documentation confirms this capacity is available for data buffering, FIFOs, and lookup tables without consuming logic cell resources.
XC6SLX150-3FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150-3FGG484C FAQ
1.How can I place an order for XC6SLX150-3FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-3FGG484C reliable?
The price and inventory of XC6SLX150-3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-3FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX150-3FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-3FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-3FGG484C?
XC6SLX150-3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-3FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-3FGG484C?
For technical support, including XC6SLX150-3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-3FGG484C requirements.
6.How does Aetrix verify that XC6SLX150-3FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-3FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX150-3FGG484C?
All XC6SLX150-3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-3FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-3FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX150-3FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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