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AMD XC6SLX150-3FGG484I
- Part No.:
- XC6SLX150-3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150-3FGG484I.pdf
- Description:
- IC FPGA 338 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,333
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Product details
Overview
XC6SLX150-3FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18-bit x 36Kb block RAM, and 341 user I/Os in a 484-pin Fine-Pitch BGA package. It operates at -3 speed grade (1.2V core, industrial temperature range -40°C to +100°C) and targets high-reliability embedded control and interface bridging applications.
For engineers reviewing the XC6SLX150-3FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, speed grade timing closure, and industrial-grade thermal performance.
Technical Context
The XC6SLX150-3FGG484I implements a configurable logic fabric with six-input LUTs, dedicated DSP48A1 slices (18×25 multiplier + accumulator), and integrated clock management using DCM and PLL blocks. It supports SelectIO standards including LVCMOS, LVDS, and SSTL up to 1.0 Gbps per differential pair.
Configuration is performed via Master SPI or JTAG, with support for dual-boot from two external flash devices. The device includes internal configuration monitoring and CRC error detection for bitstream integrity verification during power-up and runtime.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 3,096 Kbits (18 × 36 Kb) - enables on-chip data buffering and FIFO implementation without external memory |
| User I/O Pins | 341 - supports wide parallel interfaces, multi-channel ADC/DAC control, and high-pin-count protocol bridging |
| Speed Grade | -3 - guarantees timing closure at 1.2V core supply with worst-case industrial temperature derating |
| Package | 484-pin FGG (Fine-Pitch BGA, 23×23 mm, 1.0 mm pitch) - requires standard PCB reflow profile and 6-layer routing stackup |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded systems |
Pinout & Package
XC6SLX150-3FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FGG) package with 23×23 array, 1.0 mm ball pitch, and 2.0 mm body height. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100nF + 4.7µF near package |
| P2 | CLK0 | Dedicated global clock input - routed through low-skew network to all clock regions |
| T14 | M0 | Configuration mode select - sets boot source (SPI/JTAG) during power-on reset |
| Y16 | INIT_B | Open-drain status output - asserted low during configuration, high when complete and valid |
| R15 | PROGRAM_B | Active-low asynchronous reset - forces reconfiguration and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 180 units - enable real-time FIR filtering, FFT computation, and arithmetic-intensive signal processing |
| SelectIO Standards | LVDS, SSTL-2, LVCMOS33/25/18 - allow direct interfacing to DDR2 memory, camera sensors, and industrial buses |
| DCM & PLL Clock Management | 2 DCMs + 2 PLLs per device - provide jitter reduction, frequency synthesis, and phase alignment across multiple clock domains |
| Configuration Security | Bitstream encryption (AES-128) - prevents reverse engineering and unauthorized cloning of programmed logic |
| Embedded Block RAM | 36 Kb per block - supports dual-port operation with independent read/write clocks for pipeline buffering |
Applications
| Industrial PLC I/O Module | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion and fieldbus protocol translation (PROFIBUS, CANopen) in programmable logic controllers. IC Role / Device Role / Timing Role: FPGA acts as protocol bridge and deterministic I/O scheduler with sub-microsecond latency control. Use Value: 341 user I/Os and industrial temp rating enable direct integration into DIN-rail mounted control cabinets without forced cooling. | Use Scenario: High-speed pixel data aggregation from CMOS image sensors and preprocessing before transmission to host CPU. IC Role / Device Role / Timing Role: FPGA serves as sensor interface controller and real-time image buffer with DDR2 memory controller. Use Value: Integrated 3,096 Kbits block RAM eliminates need for external SRAM, reducing BOM cost and board area in portable diagnostic equipment. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: Aggregation and time-stamping of ARINC 429, MIL-STD-1553, and discrete signals in airborne systems. IC Role / Device Role / Timing Role: FPGA performs deterministic signal routing, synchronization, and health monitoring with CRC-checked configuration. Use Value: -3 speed grade and industrial temperature qualification ensure reliable operation under vibration and thermal cycling in flight environments. | Use Scenario: Flexible digital pattern generation and acquisition for automated test systems requiring multi-protocol stimulus/response. IC Role / Device Role / Timing Role: FPGA implements custom protocol engines (SPI, I²C, UART) and high-speed digital I/O with precise timing control. Use Value: 147,443 logic cells support concurrent execution of multiple test algorithms while maintaining deterministic trigger response <10 ns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FGG484I | Slower -2 speed grade; lower max clock frequency and relaxed timing margins | Suitable for non-critical timing paths or lower-power operation at reduced frequency | Select when design meets timing at lower voltage or ambient temperature |
| XC6SLX150-3CSG484I | Same logic resources and speed grade but in 484-pin CSP (Chip Scale Package) | Requires tighter PCB layout constraints due to smaller 0.8 mm ball pitch and no thermal pad | Choose only if space-constrained form factor outweighs thermal and assembly complexity trade-offs |
Compared with XC6SLX150-2FGG484I and XC6SLX150-3CSG484I, the XC6SLX150-3FGG484I provides optimal balance of timing margin, thermal performance, and manufacturability for industrial and avionics applications requiring robust long-term reliability.
Availability
XC6SLX150-3FGG484I is available at Aetrix Electronics and suitable for industrial automation, medical imaging systems, and avionics data concentrators requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX150-3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications requiring low power, small footprint, and industrial temperature operation - especially in industrial control, video, and automotive subsystems.
FAQ
What is the maximum operating frequency of the XC6SLX150-3FGG484I?
The XC6SLX150-3FGG484I is rated for a maximum system clock frequency of 667 MHz in its fastest internal paths under industrial temperature conditions. This is guaranteed by the -3 speed grade, which defines worst-case timing parameters for setup/hold and propagation delays across the full -40°C to +100°C range. Actual achievable frequency depends on design placement, routing, and resource utilization.
Does the XC6SLX150-3FGG484I support JTAG boundary-scan testing?
Yes, the XC6SLX150-3FGG484I fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. It also enables in-system programming and debug access to internal configuration registers. This capability is integral to production test flows and field diagnostics for systems using the XC6SLX150-3FGG484I.
Can the XC6SLX150-3FGG484I configure from SPI flash memory?
Yes, the XC6SLX150-3FGG484I supports Master SPI configuration mode using standard quad-SPI or single-SPI flash devices. Configuration is initiated automatically on power-up when M0–M2 pins are set appropriately. The XC6SLX150-3FGG484I reads the bitstream directly from flash without external controller intervention.
What is the purpose of the INIT_B pin on the XC6SLX150-3FGG484I?
The INIT_B pin on the XC6SLX150-3FGG484I is an open-drain status indicator that goes low during configuration initialization and remains low until the bitstream is fully loaded and verified. It returns high upon successful completion or asserts low again if CRC error is detected. This signal is used for system-level readiness monitoring and fault detection in designs using the XC6SLX150-3FGG484I.
Is the XC6SLX150-3FGG484I RoHS compliant and lead-free?
Yes, the XC6SLX150-3FGG484I is manufactured as a lead-free, RoHS-compliant device. Its FGG484 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's official product change notices for the XC6SLX150-3FGG484I.
XC6SLX150-3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150-3FGG484I FAQ
1.How can I place an order for XC6SLX150-3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-3FGG484I reliable?
The price and inventory of XC6SLX150-3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-3FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-3FGG484I?
XC6SLX150-3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-3FGG484I?
For technical support, including XC6SLX150-3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-3FGG484I requirements.
6.How does Aetrix verify that XC6SLX150-3FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-3FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-3FGG484I?
All XC6SLX150-3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-3FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX150-3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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