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AMD XC6SLX150-3FGG676C
- Part No.:
- XC6SLX150-3FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150-3FGG676C.pdf
- Description:
- IC FPGA 498 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,745
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Product details
Overview
XC6SLX150-3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18-bit x 36Kb block RAM, 576 DSP48A1 slices, and operates at -3 speed grade with 1.2V core voltage. It is used in industrial video processing systems requiring deterministic latency and multi-channel I/O interfacing.
For engineers reviewing the XC6SLX150-3FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), differential signaling support (LVDS, SSTL), configuration interface options (SPI, SelectMAP), and thermal performance in compact industrial enclosures.
Technical Context
The XC6SLX150-3FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated carry chains, and distributed RAM. It supports dual-register flip-flops per LUT, shift register functionality, and built-in clock management via DCMs (Digital Clock Managers) with phase shifting and frequency synthesis.
Configuration is performed via Master SPI or Slave SelectMAP mode using external flash or processor control. The device includes JTAG boundary-scan support (IEEE 1149.1) and supports partial reconfiguration for dynamic function swapping without full system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 500 - supports high-density parallel bus interfaces and multi-channel sensor/data acquisition |
| Block RAM | 3,004 Kbits (18 × 36 Kb) - enables local buffering for video frame storage or protocol stack memory |
| DSP Slices | 576 × DSP48A1 - delivers 18×25-bit multiply-accumulate operations per slice for real-time filtering |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz I/O toggle rate and 333 MHz system clock in worst-case conditions |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| Package | FGG676 - 27×27 mm fine-pitch BGA with 1.0 mm ball pitch and thermal pad for industrial thermal dissipation |
Pinout & Package
XC6SLX150-3FGG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with exposed thermal pad, designed for conduction-cooled industrial PCBs. Pin assignment follows Xilinx Spartan-6 FPGA pinout conventions with dedicated configuration, clock, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity in LVDS/SSTL interfaces |
| P2 | CCLK | Configuration clock input - drives internal configuration logic during SPI or SelectMAP startup |
| R1 | DONE | Open-drain status output - signals successful configuration completion to system controller |
| T1 | INIT_B | Active-low initialization indicator - asserts low during configuration error or CRC mismatch |
| Y1 | TCK | JTAG test clock - enables boundary-scan testing and in-system programming via IEEE 1149.1 interface |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Register LUTs | Enables time-multiplexed logic implementation and pipelined datapaths without additional CLB overhead |
| DCM Clock Management | Provides jitter-tolerant clock synthesis, phase alignment, and frequency division for synchronous subsystems |
| SelectIO Technology | Supports 21 I/O standards including LVDS, SSTL-2, HSTL, and PCI-X on same bank with programmable drive strength |
| Partial Reconfiguration | Allows runtime replacement of logic modules while preserving active state in other regions of the FPGA fabric |
| Embedded Block RAM | Configurable as true dual-port RAM, FIFO, or shift register - eliminates need for external memory in buffer-critical paths |
Applications
| Industrial Machine Vision | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Real-time image preprocessing on factory-floor cameras with sub-millisecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering, edge detection, and ROI extraction before CPU handoff. Use Value: 500 user I/Os enable direct CMOS sensor interface; -3 speed grade ensures deterministic timing across temperature ranges. | Use Scenario: Deterministic I/O scanning and safety-critical logic execution in modular PLC backplanes. IC Role / Device Role / Timing Role: Configurable logic replaces fixed ASICs for field-upgradable control algorithms and protocol translation. Use Value: Block RAM stores ladder logic state tables; SelectIO supports 24V digital I/O level translation via external buffers. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: High-speed data aggregation from ultrasound transducer arrays with precise channel synchronization. IC Role / Device Role / Timing Role: FPGA implements time-aligned ADC sampling, digital beamforming, and PCIe endpoint interface. Use Value: 576 DSP48A1 slices perform real-time FIR filtering; LVDS I/O supports 800 Mbps serial links to ADCs. | Use Scenario: Flexible signal generation and analysis in automated test systems with multi-protocol support. IC Role / Device Role / Timing Role: FPGA serves as pattern generator, protocol analyzer, and timing controller for DUT stimulus/response. Use Value: Partial reconfiguration allows switching between SPI, I²C, and UART test modes without hardware change. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FGG676C | Slower -2 speed grade; lower maximum I/O toggle rate (400 MHz) and system clock (250 MHz) | Suitable for cost-sensitive designs where timing margin exceeds requirement | Select when thermal budget or power envelope restricts use of -3 grade |
| XC6SLX150-3FGG900C | Larger 900-ball FGG900 package; adds 100+ user I/Os and enhanced thermal dissipation capability | Required for designs needing >500 I/Os or higher sustained power operation | Choose when board layout accommodates larger footprint and higher I/O density is mandatory |
Compared with XC6SLX150-2FGG676C and XC6SLX150-3FGG900C, the XC6SLX150-3FGG676C balances performance, I/O count, and thermal profile for space-constrained industrial controllers - offering full -3 timing margin without package size penalty.
Availability
XC6SLX150-3FGG676C is available at Aetrix Electronics and suitable for industrial automation, medical imaging interfaces, and test equipment requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX150-3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic implementation, embedded processing, and flexible I/O interfacing - especially in industrial and automotive subsystems.
FAQ
What is the maximum operating junction temperature for XC6SLX150-3FGG676C?
The XC6SLX150-3FGG676C has a maximum operating junction temperature of 100°C, validated under industrial temperature grade (-40°C to +100°C ambient). This rating applies when using the FGG676 package with proper PCB thermal vias and copper pour under the thermal pad. Thermal design must account for dynamic power dissipation across all configured logic and I/O banks to maintain reliability within this limit. The XC6SLX150-3FGG676C datasheet specifies derating curves for sustained operation above 85°C ambient.
Does XC6SLX150-3FGG676C support JTAG boundary-scan testing?
Yes, XC6SLX150-3FGG676C fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TCK, TMS, TDI, TDO, and TRST_B pins. This enables in-circuit verification of solder joints, interconnect integrity, and pre-configuration diagnostics. The XC6SLX150-3FGG676C implements full boundary-scan architecture compliant with Xilinx's BSCAN_SPARTAN6 primitive, allowing visibility into I/O pin states and internal configuration registers during test.
Can XC6SLX150-3FGG676C be configured via SPI flash memory?
Yes, XC6SLX150-3FGG676C supports Master SPI configuration mode, enabling automatic boot from standard quad-SPI or single-SPI flash devices. Configuration bitstream is loaded on power-up using internal oscillator and dedicated CONFIG_IO pins. The XC6SLX150-3FGG676C requires no external controller for this mode, making it ideal for standalone industrial modules where firmware persistence and cold-start reliability are critical.
What I/O standards are supported by XC6SLX150-3FGG676C?
XC6SLX150-3FGG676C supports 21 SelectIO standards including LVDS, SSTL-2 Class I/II, HSTL-I/II, PCI-X, and LVCMOS across multiple I/O banks. Each bank is independently configurable for voltage (1.2V–3.3V) and standard. The XC6SLX150-3FGG676C does not support DDR3 or MIPI directly but can interface via external PHYs or custom logic. Drive strength and slew rate are programmable per pin group.
Is partial reconfiguration supported on XC6SLX150-3FGG676C?
Yes, XC6SLX150-3FGG676C supports partial reconfiguration through Xilinx ISE Design Suite tools and documented floorplanning constraints. This allows dynamic loading of new logic modules into designated regions while preserving state in other areas. The XC6SLX150-3FGG676C requires specific bitstream generation flow and configuration port access, and is commonly used in protocol-agnostic test equipment and adaptive signal processing systems.
XC6SLX150-3FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150-3FGG676C FAQ
1.How can I place an order for XC6SLX150-3FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-3FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-3FGG676C reliable?
The price and inventory of XC6SLX150-3FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-3FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX150-3FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-3FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-3FGG676C?
XC6SLX150-3FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-3FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-3FGG676C?
For technical support, including XC6SLX150-3FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-3FGG676C requirements.
6.How does Aetrix verify that XC6SLX150-3FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-3FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-3FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX150-3FGG676C?
All XC6SLX150-3FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-3FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-3FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX150-3FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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