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AMD XC6SLX150-3FGG676I
- Part No.:
- XC6SLX150-3FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150-3FGG676I.pdf
- Description:
- IC FPGA 498 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,110
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Product details
Overview
XC6SLX150-3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 576 Kbits of block RAM, and 358 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and supports SelectIO standards up to 1.25 Gbps for high-speed interface design in industrial control systems.
For engineers reviewing the XC6SLX150-3FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count, speed grade timing closure, industrial temperature rating, and compatibility with Xilinx ISE Design Suite v14.7.
Technical Context
The XC6SLX150-3FGG676I implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, shift registers, and dedicated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It integrates dual-clock DLLs and phase-matched digital clock managers (DCMs) for internal clock synthesis and skew control.
Configuration is supported via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces. Built-in configuration monitoring includes CRC error detection and fallback reconfiguration capability for system reliability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic density for complex state machines or protocol stacks |
| Block RAM | 576 Kbits - enables on-chip buffering for video frame stores, FIFOs, or packet buffering without external memory |
| User I/Os | 358 - supports multi-interface connectivity including LVDS, SSTL, HSTL, and PCI Express Gen1 endpoints |
| Speed Grade | -3 - guarantees timing closure at 595 MHz for internal logic and 1.25 Gbps for differential I/O in industrial temp range |
| Operating Temp | -40°C to +100°C - qualified for deployment in uncooled industrial enclosures and outdoor equipment housings |
| Package | 676-pin FGG (Fine-Pitch BGA) - 27×27 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free finish |
Pinout & Package
The XC6SLX150-3FGG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG) package with 27×27 array, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation in high-utilization designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 10 µF per bank for signal integrity |
| P2 | CLK0 | Dedicated global clock input - routed through low-skew network to all clock-capable resources |
| T14 | M0 | Configuration mode select - sets boot source as Master Serial when pulled High during power-up |
| V17 | INIT_B | Open-drain initialization status - driven Low during configuration, High when complete and valid |
| W18 | CCLK | Configuration clock output - provides synchronous timing for external SPI flash read operations |
| Y19 | DONE | Open-drain configuration completion - pulled High externally to indicate successful bitstream load |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 180 units - enable real-time FIR filtering, FFT computation, or motor control loop execution without external processors |
| SelectIO Technology | Supports 21 I/O standards including LVDS, TMDS, and PCI - eliminates level-shifting components in mixed-voltage systems |
| Embedded Memory | 576 Kbits block RAM + 1,824 Kbits distributed RAM - allows dual-port RAM implementation for ping-pong buffering |
| Configuration Security | Bitstream encryption via AES-256 key stored in eFUSE - prevents reverse engineering of proprietary logic design |
| Power Management | Multi-rail operation (VCCINT=1.2 V, VCCAUX=3.3 V, VCCO=1.2–3.3 V) - enables selective I/O voltage domain partitioning |
Applications
| Industrial PLC Controller | Video Surveillance Encoder |
|---|---|
Use Scenario: Real-time motion detection and protocol bridging between analog camera inputs and IP network streams. IC Role / Device Role / Timing Role: FPGA fabric implements pixel processing pipeline, MIPI CSI-2 receiver, and Ethernet MAC+PHY glue logic. Use Value: 358 I/Os support parallel sensor interfaces and Gigabit Ethernet PHY control; -3 speed grade ensures sub-10 µs latency for motion-triggered alerts. | Use Scenario: Multi-channel HD video encoding with simultaneous H.264 compression and metadata injection. IC Role / Device Role / Timing Role: Configurable logic executes custom video pre-processing, DMA controller manages DDR2 buffer transfers, DSP slices accelerate motion estimation. Use Value: 576 Kbits block RAM buffers full HD frames; DSP48A1 slices achieve 120 GOPS peak compute for real-time encoding. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Acquisition and preprocessing of ultrasound echo data before transfer to host CPU. IC Role / Device Role / Timing Role: FPGA captures ADC samples at 80 MSPS, applies beamforming coefficients, and formats data for PCIe endpoint transmission. Use Value: Dedicated clock management ensures <±50 ps jitter on sampling clocks; industrial temp rating supports operation inside sealed imaging chassis. | Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control subsystems. IC Role / Device Role / Timing Role: FPGA implements deterministic time-triggered communication scheduler, error-checking engines, and isolation logic for safety-critical channels. Use Value: Configuration CRC and fallback reconfiguration meet DO-254 Level A requirements; -40°C to +100°C range satisfies airborne environmental qualification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG484I | 484-ball FBGA, 318 user I/Os, reduced package size (23×23 mm) | Limited I/O count restricts multi-interface designs; lower thermal mass affects sustained utilization in fanless enclosures | Choose when board space is constrained and I/O count ≤318 suffices for target interface mix |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 4.9 Mb block RAM, -2 speed grade | Higher logic density but requires Vivado toolchain; lacks native support for legacy ISE-based IP cores | Prefer for new designs requiring higher memory bandwidth or PCIe Gen2 endpoints; avoid if maintaining ISE-based legacy firmware |
Compared with XC6SLX150-3FGG484I, the XC6SLX150-3FGG676I delivers 40 more I/Os and better thermal performance in high-density routing; versus XC7A100T-2CSG324I, it offers proven ISE toolchain compatibility and lower power at equivalent logic utilization but less on-chip memory.
Availability
XC6SLX150-3FGG676I is available at Aetrix Electronics and suitable for industrial automation, medical imaging, and avionics applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150-3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family for cost-sensitive, high-reliability applications.
The Spartan-6 family targets industrial, automotive, and medical systems where predictable timing, long-term availability, and ISE toolchain compatibility are prioritized over cutting-edge process nodes.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150-3FGG676I?
The XC6SLX150-3FGG676I supports I/O standards from 1.2 V to 3.3 V, including LVCMOS, LVTTL, SSTL, HSTL, and differential standards like LVDS and TMDS. Each I/O bank is independently configurable, allowing mixed-voltage operation across the device. VCCO per bank must match the selected I/O standard's required voltage, and all banks share a common VCCAUX supply of 3.3 V.
Does XC6SLX150-3FGG676I support partial reconfiguration?
No, the XC6SLX150-3FGG676I does not support partial reconfiguration. It uses a monolithic configuration architecture where the entire bitstream must be loaded during startup or system reset. Dynamic reconfiguration requires full reconfiguration cycles, and no hardware resources or configuration ports are allocated for runtime module swapping. This limitation is inherent to the Spartan-6 architecture and documented in UG382.
What configuration modes are supported by XC6SLX150-3FGG676I?
The XC6SLX150-3FGG676I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial mode uses internal oscillator to drive external SPI flash; Slave modes allow processor-controlled loading; JTAG enables boundary-scan testing and programming. Mode selection is determined by M2:M0 pin states at power-up, with specific pull-up/pull-down resistor configurations defining each mode.
Is XC6SLX150-3FGG676I qualified for automotive applications?
The XC6SLX150-3FGG676I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While its operating range overlaps with some automotive under-hood environments, it lacks automotive-specific reliability testing, failure rate reporting, and PPAP documentation. For automotive applications, Xilinx recommends the Spartan-6Q family variants explicitly qualified to AEC-Q100 Grade 3.
What is the total number of DSP48A1 slices in XC6SLX150-3FGG676I?
The XC6SLX150-3FGG676I contains 180 DSP48A1 slices. Each slice provides 18×18-bit signed multiplication, 48-bit accumulator, and optional pipeline registers. These resources are distributed across the FPGA fabric and support cascading for wider arithmetic operations. Their fixed placement enables predictable timing for filter and control algorithm implementations without placement-dependent delays.
XC6SLX150-3FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150-3FGG676I FAQ
1.How can I place an order for XC6SLX150-3FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-3FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-3FGG676I reliable?
The price and inventory of XC6SLX150-3FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-3FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-3FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-3FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-3FGG676I?
XC6SLX150-3FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-3FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-3FGG676I?
For technical support, including XC6SLX150-3FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-3FGG676I requirements.
6.How does Aetrix verify that XC6SLX150-3FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-3FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-3FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-3FGG676I?
All XC6SLX150-3FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-3FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-3FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX150-3FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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