My Inquiry
My Account
AMD XC6SLX150-3FGG900C
- Part No.:
- XC6SLX150-3FGG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150-3FGG900C.pdf
- Description:
- IC FPGA 576 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,427
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX150-3FGG900C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 480 DSP48A1 slices, 4.7 Mb of total block RAM, and operates at -3 speed grade (1.2 V core, industrial temperature range). It is used in industrial vision systems requiring real-time image preprocessing and parallel data path control.
For engineers reviewing the XC6SLX150-3FGG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (516 user I/Os), differential signaling support (LVDS, TMDS), embedded memory depth, and configuration interface options (SPI, SelectMAP).
Technical Context
The XC6SLX150-3FGG900C implements a configurable logic fabric based on 6-input LUTs with integrated flip-flops, distributed RAM, and shift registers. It integrates 12 CMT clock management tiles-each containing two DCMs and one PLL-for multi-domain clock synthesis and phase alignment.
Configuration is performed via Master SPI or Slave SelectMAP mode using external PROM or processor. Bitstream security includes optional AES encryption and HMAC authentication to prevent unauthorized programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for HDL implementation |
| DSP Slices | 480 × DSP48A1 - supports 18×25-bit signed multiplication, pipelined accumulation, and wide arithmetic |
| Block RAM | 4.7 Mb - configurable as 18 Kb dual-port RAM or 36 Kb single-port RAM per block |
| User I/O Pins | 516 - supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, and TMDS signaling standards |
| Speed Grade | -3 - guarantees timing closure up to 667 MHz I/O toggle rate and 500 MHz system clock frequency |
| Operating Temp | 0°C to 85°C - qualified for industrial environment operation without derating |
| Core Voltage | 1.2 V ±3% - requires tight-tolerance DC-DC regulation and dedicated power sequencing |
Pinout & Package
The XC6SLX150-3FGG900C is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 35×35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad on underside enables enhanced heat dissipation under sustained logic utilization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - must match connected interface standard (e.g., 3.3 V for LVCMOS33) |
| P2 | IO_L1P_T0_0 | Differential pair positive input - supports LVDS, TMDS, or RSDS with internal termination |
| W19 | M0/M1/M2 | Configuration mode select - sets boot source (SPI vs SelectMAP) and bus width during power-up |
| T14 | CCLK | Configuration clock input - driven externally during SelectMAP or internally by FPGA during SPI mode |
| Y16 | INIT_B | Open-drain status signal - asserted low during configuration error or CRC failure |
| R15 | PROGRAM_B | Active-low asynchronous reset - forces reconfiguration and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Endpoint | Hard IP block supporting x1 Gen1 (2.5 Gbps) - eliminates soft-core resource usage and timing closure risk |
| Embedded Memory Controller | Supports DDR2/DDR3 SDRAM up to 800 Mbps data rate with calibration and refresh logic |
| Dedicated Clock Routing | 12 CMTs with independent PLL/DCM - enables simultaneous multi-frequency domain generation with < ±100 ps skew |
| Configurable I/O Standards | Per-bank voltage support (1.2–3.3 V) and programmable drive strength/slew rate - simplifies mixed-voltage board design |
| AES-256 Bitstream Encryption | On-chip decryption engine with HMAC authentication - prevents cloning and reverse engineering of programmed logic |
Applications
| Industrial Machine Vision | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Real-time pixel-level filtering and ROI extraction on high-speed camera feeds in factory automation lines. IC Role / Device Role / Timing Role: FPGA fabric executes parallel convolution kernels; CMTs generate precise pixel clock and frame sync signals. Use Value: Enables sub-millisecond latency processing without CPU offload, sustaining 120 fps at 2 MP resolution. | Use Scenario: Deterministic I/O scanning and motion control loop execution across 32+ digital and analog channels. IC Role / Device Role / Timing Role: Configurable logic implements cyclic executive scheduler; embedded memory stores ladder logic state tables. Use Value: Achieves 50 µs scan cycle time with jitter < 100 ns, meeting IEC 61131-3 hard real-time requirements. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: High-fidelity digitization and protocol bridging between ultrasound transducer arrays and host PC over PCIe. IC Role / Device Role / Timing Role: FPGA handles LVDS-to-PCIe data aggregation; hard PCIe endpoint manages DMA transfers. Use Value: Delivers sustained 2.0 GB/s throughput with < 1 µs interrupt latency for real-time beamforming feedback. | Use Scenario: Multi-channel synchronized sampling and FFT-based spectral analysis in portable oscilloscopes. IC Role / Device Role / Timing Role: Logic fabric controls ADC sequencers and computes 1024-point FFT in pipeline; block RAM buffers sample streams. Use Value: Supports 1 GS/s aggregate sampling across 4 channels with real-time 100 kHz spectrum update rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 64 GTY transceivers, 1.8 V core - higher density, higher bandwidth, larger footprint | Targets 100 GbE, 400G optical transport, and AI inference acceleration - not cost-optimized for mid-range industrial control | Select when >200k logic cells, PCIe Gen3, or multi-gigabit serial I/O are required; not drop-in compatible |
| XC7A200T-2FBG676I | Artix-7 architecture, 215,360 logic cells, 740 DSP slices, 13.1 Mb BRAM, 1.0 V core - newer process node, higher efficiency, different pinout | Preferred for new designs needing lower static power, higher DSP density, and DDR3/DDR4 memory controller support | Offers better performance-per-watt and longer roadmap support; requires PCB redesign and toolchain migration |
Compared with XC6SLX150-3FGG900C, the XC7A200T-2FBG676I delivers 45% more logic and 2.8× more DSP resources at lower static power, while the XCVU9P-2FLGA2104I targets next-generation infrastructure where serial bandwidth and logic scale exceed Spartan-6 capabilities.
Availability
XC6SLX150-3FGG900C is available at Aetrix Electronics and suitable for industrial automation, medical imaging interfaces, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150-3FGG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, moderate logic density, and industrial-grade reliability - especially in machine vision, motor control, and communications infrastructure.
FAQ
What is the configuration method supported by XC6SLX150-3FGG900C?
The XC6SLX150-3FGG900C supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI uses an external serial PROM; SelectMAP allows parallel loading via microprocessor bus; JTAG is used for debugging and boundary-scan testing. All methods load the same bitstream format, and configuration pins (M0–M2) determine the active mode at power-up.
Does XC6SLX150-3FGG900C include built-in memory controllers?
Yes, XC6SLX150-3FGG900C includes hardened memory controller logic supporting DDR2 and DDR3 SDRAM up to 800 Mbps data rate. It provides automatic calibration, refresh management, and burst-length configuration. External PHY is required, but the controller handles command scheduling, address mapping, and error handling within the FPGA fabric.
What is the maximum differential I/O standard supported by XC6SLX150-3FGG900C?
The XC6SLX150-3FGG900C supports LVDS, RSDS, BLVDS, and TMDS at data rates up to 1.0 Gbps per lane. LVDS I/O can be configured with internal 100 Ω differential termination and programmable current output (2–16 mA), enabling direct connection to camera sensors and display interfaces without external components.
Is XC6SLX150-3FGG900C qualified for industrial temperature operation?
Yes, the 'C' suffix in XC6SLX150-3FGG900C denotes industrial temperature grade (0°C to +85°C ambient). It is fully characterized and tested across this range for timing, voltage, and signal integrity - including setup/hold margins and I/O drive strength - with no derating required for operation at maximum junction temperature.
Can XC6SLX150-3FGG900C implement a PCIe endpoint without external logic?
Yes, XC6SLX150-3FGG900C contains a hard PCIe Gen1 x1 endpoint block compliant with PCI Express Base Specification v1.1. It handles link training, transaction layer packet (TLP) generation, and DMA arbitration internally. No external bridge chip or soft-core IP is needed to achieve basic endpoint functionality with host enumeration.
XC6SLX150-3FGG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150-3FGG900C FAQ
1.How can I place an order for XC6SLX150-3FGG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-3FGG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-3FGG900C reliable?
The price and inventory of XC6SLX150-3FGG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-3FGG900C is usually 5 days.
3.What payment methods are accepted for XC6SLX150-3FGG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-3FGG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-3FGG900C?
XC6SLX150-3FGG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-3FGG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-3FGG900C?
For technical support, including XC6SLX150-3FGG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-3FGG900C requirements.
6.How does Aetrix verify that XC6SLX150-3FGG900C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-3FGG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-3FGG900C meets industry standards.
7.What is the process for return or replacement of XC6SLX150-3FGG900C?
All XC6SLX150-3FGG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-3FGG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-3FGG900C part is unused and in its original packaging.
Return procedure for XC6SLX150-3FGG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX150-3FGG900C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
