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AMD XC6SLX150-L1FGG484I
- Part No.:
- XC6SLX150-L1FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150-L1FGG484I.pdf
- Description:
- IC FPGA 338 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,183
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Product details
Overview
XC6SLX150-L1FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, -1 speed grade, and industrial temperature range (–40°C to +100°C). It integrates embedded block RAM (up to 4,824 Kbits), DSP48A1 slices (180 units), and supports multi-gigabit transceivers (up to 3.2 Gbps) for high-speed serial interfaces in reconfigurable digital systems.
For engineers reviewing the XC6SLX150-L1FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (348 user I/Os), LVDS/PCIe-compatible signaling support, and industrial-grade thermal reliability.
Technical Context
The XC6SLX150-L1FGG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for clock networks, global reset, and configuration interfaces (JTAG, SelectMAP, SPI). It supports dual-boot configuration via internal SPI flash and includes integrated DCI (Digitally Controlled Impedance) for on-die termination calibration.
Configuration is performed through Master Serial, Slave Serial, or JTAG modes; startup time is ≤100 ms at 2.5 V VCCO. The device uses 1.2 V core voltage (VCCINT) and supports mixed-voltage I/O banks (1.2 V to 3.3 V) with programmable drive strength and slew rate control per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total configurable logic resources for implementing combinational and sequential logic functions |
| User I/O Pins | 348 - configurable single-ended and differential I/Os supporting LVCMOS, LVTTL, LVDS, and TMDS standards |
| Block RAM | 4,824 Kbits - distributed across 236 x 18-Kb RAM blocks for data buffering and FIFO implementation |
| DSP Slices | 180 × DSP48A1 - fixed-point arithmetic units supporting multiply-accumulate operations at up to 250 MHz |
| Speed Grade | -1 - guarantees timing closure for designs operating at maximum specified frequencies under industrial conditions |
| Operating Temperature | –40°C to +100°C - qualified for industrial environments without derating |
| Package | 484-pin FGG (Fine-Pitch BGA) - 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant |
Pinout & Package
XC6SLX150-L1FGG484I is housed in a 484-ball Fine-Pitch Ball Grid Array (FGG) package with 23×23 array, 1.0 mm ball pitch, and standard JEDEC MO-251AC footprint. Pin assignment follows Xilinx UG380 v1.11 (Spartan-6 FPGA Packaging and Pinout Specifications).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core power supply input for FPGA logic fabric and internal routing |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry, JTAG, and certain I/O banks |
| A1 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| T1 | INIT_B | Open-drain status output indicating configuration progress and completion |
| R1 | CCLK | Configuration clock input used during Master Serial mode; drives internal configuration logic |
| H1 | IO_L1P_T0_0 | Bank 0 I/O capable of LVDS, LVCMOS, or SSTL signaling with selectable termination |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCI | On-die impedance matching for transmission lines eliminates external resistors and improves signal integrity |
| Dual-Boot Configuration | Supports two independent bitstreams stored in SPI flash for field-upgradable firmware and fallback recovery |
| Mixed-Voltage I/O Banks | Each of 12 I/O banks independently configurable for 1.2 V to 3.3 V signaling, enabling direct interfacing with diverse peripherals |
| Embedded Clock Management | Digital Clock Managers (DCMs) provide jitter reduction, frequency synthesis, phase shifting, and duty-cycle correction |
| ISE Design Suite Support | Fully supported by Xilinx ISE 14.7 toolchain including synthesis, place-and-route, and bitstream generation |
Applications
| Industrial Motor Control | Video Processing Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo control with encoder feedback, PWM generation, and safety monitoring in CNC machines. IC Role / Device Role / Timing Role: Configurable logic platform executing custom motion algorithms, managing high-resolution encoder interfaces, and generating synchronized 100 kHz PWM outputs. Use Value: 348 user I/Os enable parallel interface to multiple encoders and analog front-ends; -1 speed grade ensures deterministic timing for sub-microsecond loop cycles. | Use Scenario: Converting HDMI 1.4 video streams to MIPI CSI-2 for image sensor integration in machine vision systems. IC Role / Device Role / Timing Role: Protocol translation engine performing pixel clock domain crossing, color space conversion, and packetization into MIPI D-PHY frames. Use Value: Embedded DSP48A1 slices accelerate real-time YUV-to-RGB conversion; LVDS-capable I/Os support HDMI receiver and MIPI transmitter signaling simultaneously. |
| Programmable Logic Controller (PLC) | Communications Backplane Interface |
Use Scenario: Modular PLC base unit handling discrete I/O expansion, fieldbus protocol stacks (Modbus TCP, EtherNet/IP), and safety logic execution. IC Role / Device Role / Timing Role: System-on-chip controller integrating soft-core processor (MicroBlaze), protocol accelerators, and deterministic I/O timing engines. Use Value: 4,824 Kbits of block RAM buffers protocol packets and maintains real-time state tables; industrial temperature rating ensures operation in uncooled control cabinets. | Use Scenario: Interfacing between legacy parallel backplane (VMEbus) and modern PCIe-based host controllers in test instrumentation racks. IC Role / Device Role / Timing Role: High-speed bridge translating parallel address/data strobes into PCIe TLPs with DMA arbitration and error reporting. Use Value: 147,443 logic cells implement full PCIe endpoint logic plus VME timing state machines; 348 I/Os accommodate wide parallel bus widths and PCIe lane signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG484C | Faster -3 speed grade, commercial temperature range (0°C to +85°C), higher static power consumption | Suitable for lab prototypes and non-industrial deployments where timing margin exceeds requirements | Select when design requires maximum clock frequency headroom and operates in controlled environments |
| XC7A100T-2CSG324I | Artix-7 architecture, 101K logic cells, 2.5 V VCCO only, no VCCAUX, higher DSP density (240 slices) | Better suited for new designs requiring PCIe Gen2 endpoints or higher DSP throughput, but requires PCB redesign | Choose for next-generation upgrades needing improved transceiver performance or lower power per logic cell |
Compared with XC6SLX150-3FGG484C, the XC6SLX150-L1FGG484I trades speed margin for industrial thermal robustness; compared with XC7A100T-2CSG324I, it retains legacy toolchain compatibility and avoids migration risk but lacks native PCIe Gen2 support.
Availability
XC6SLX150-L1FGG484I is available at Aetrix Electronics and suitable for industrial motor control, video processing bridges, programmable logic controllers, and communications backplane interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC6SLX150-L1FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and markets adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications requiring low-power, reliable reconfigurable logic with mature toolchain support and industrial qualification.
FAQ
What is the maximum operating frequency of the XC6SLX150-L1FGG484I?
The XC6SLX150-L1FGG484I is rated at speed grade -1, supporting maximum clock frequencies up to 667 MHz for internal logic paths and 1,080 Mbps for LVDS I/O under industrial temperature conditions. Actual achievable frequency depends on design complexity, placement, and routing; timing analysis must be performed using Xilinx ISE 14.7 with the -1 speed model.
Does the XC6SLX150-L1FGG484I support JTAG boundary-scan testing?
Yes, the XC6SLX150-L1FGG484I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing. Dedicated TCK, TMS, TDI, and TDO pins are assigned in Bank 0, and the device implements mandatory boundary-scan instructions including SAMPLE/PRELOAD, EXTEST, and BYPASS.
Can the XC6SLX150-L1FGG484I be configured using SPI flash memory?
Yes, the XC6SLX150-L1FGG484I supports Master SPI configuration mode using standard quad-SPI or standard SPI flash devices. Configuration bitstream is loaded automatically on power-up when M[2:0] pins are set to 001, and the device supports dual-bitstream storage for fail-safe updates.
What I/O standards are supported by the XC6SLX150-L1FGG484I?
The XC6SLX150-L1FGG484I supports LVCMOS, LVTTL, PCI, HSTL, SSTL, and LVDS I/O standards across its 12 configurable I/O banks. Each bank can be independently set to 1.2 V, 1.8 V, 2.5 V, or 3.3 V VCCO, and includes programmable drive strength, slew rate, and on-die termination (DCI) calibration.
Is the XC6SLX150-L1FGG484I compatible with Xilinx ISE 14.7?
Yes, the XC6SLX150-L1FGG484I is fully supported by Xilinx ISE Design Suite 14.7, including synthesis with XST, implementation with MAP/PAR, and bitstream generation. Device-specific libraries, simulation models, and timing constraints are included in the ISE 14.7 installation for this part.
XC6SLX150-L1FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150-L1FGG484I FAQ
1.How can I place an order for XC6SLX150-L1FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-L1FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-L1FGG484I reliable?
The price and inventory of XC6SLX150-L1FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-L1FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-L1FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-L1FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-L1FGG484I?
XC6SLX150-L1FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-L1FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-L1FGG484I?
For technical support, including XC6SLX150-L1FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-L1FGG484I requirements.
6.How does Aetrix verify that XC6SLX150-L1FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-L1FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-L1FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-L1FGG484I?
All XC6SLX150-L1FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-L1FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-L1FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX150-L1FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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