AMD XC6SLX150-N3CSG484I
- Part No.:
- XC6SLX150-N3CSG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX150-N3CSG484I.pdf
- Description:
- IC FPGA 338 I/O 484CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6SLX150-N3CSG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 484-pin CSGA package, -3 speed grade, and industrial temperature range (–40°C to +100°C); used in high-reliability industrial control and embedded vision systems requiring deterministic timing and low-power reconfigurable logic.
For engineers reviewing the XC6SLX150-N3CSG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), embedded block RAM (4,824 kbits), DSP48E1 slices (216), and compliance with JESD78 Class II latch-up immunity.
Technical Context
The XC6SLX150-N3CSG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic for arithmetic functions. It supports SelectIO™ standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling (LVDS, TMDS, RSDS) across its 348 user I/O pins.
It integrates dual 18×18 multipliers per DSP48E1 slice, 64-bit wide block RAM primitives, and clock management tiles with DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty cycle correction - all operating within the –40°C to +100°C industrial temperature envelope.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total available LUT-based programmable logic resources for combinatorial and sequential logic implementation |
| User I/O Pins | 348 - configurable single-ended and differential I/Os supporting multiple voltage standards and termination options |
| Block RAM | 4,824 kbits - distributed across 1,824 x 36-bit RAM primitives usable as memory, FIFO, or shift register |
| DSP48E1 Slices | 216 - hardwired multiplier-accumulator units enabling high-throughput arithmetic at up to 250 MHz |
| Speed Grade | -3 - highest performance grade in Spartan-6 family, specifying maximum clock frequencies for CLB and I/O paths |
| Operating Temp | –40°C to +100°C - qualified for industrial environments without derating or thermal throttling |
| Latch-up Immunity | JESD78 Class II - withstands ±500 mA transient current injection without functional interruption |
Pinout & Package
XC6SLX150-N3CSG484I is housed in a 484-ball fine-pitch CSP (Chip Scale Package) with 1.0 mm ball pitch and RoHS-compliant matte tin finish. The package supports standard PCB assembly processes and provides thermal and electrical performance suitable for industrial applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, JTAG, and select I/O banks |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank; defines signal voltage level and drive strength |
| CONFIG_IO | Configuration interface | Supports Master SPI, Slave Serial, and JTAG modes; pins are dedicated during startup |
| CLKIN | Primary clock input | Accepts single-ended or differential clocks up to 500 MHz into DCM for system timing generation |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device provide jitter-tolerant clock synthesis, phase alignment, and frequency multiplication/division without external PLL components |
| SelectIO Technology | Supports 19 I/O standards across 12 banks with programmable slew rate, drive strength, and on-die termination - simplifies interface to ADCs, sensors, and FPD-Link devices |
| Low-Power Architecture | 1.2 V core voltage and dynamic power gating reduce active power consumption by up to 50% versus prior Spartan families at equivalent logic density |
| ISE Design Suite Support | Fully supported in Xilinx ISE 14.7 with place-and-route, timing analysis, and bitstream generation - no migration required for legacy Spartan-6 designs |
| Configurable Startup Sequence | Adjustable power-on reset timing, configuration watchdog timeout, and fallback mode enable robust field deployment in unattended systems |
Applications
| Industrial Motor Control | Embedded Vision Processing |
|---|---|
Use Scenario: Real-time servo loop execution and encoder interface in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, PWM generators, and quadrature decoder logic with sub-microsecond latency. Use Value: Deterministic timing and 348 I/Os allow simultaneous connection to multiple axes, safety I/O, and fieldbus interfaces (e.g., CANopen, EtherCAT PHY bridging). | Use Scenario: Pre-processing pipeline for HD image capture in factory automation cameras and optical inspection systems. IC Role / Device Role / Timing Role: Configurable logic handles pixel-level filtering, Bayer demosaicing, and frame buffering using embedded block RAM and DSP48E1 slices. Use Value: 4,824 kbits of block RAM enables dual-frame buffering at 60 fps; LVDS I/O supports direct connection to CMOS image sensors. |
| Communications Backplane Interface | Test & Measurement Equipment |
Use Scenario: Protocol translation and packet routing between legacy parallel bus subsystems and PCIe-based host processors. IC Role / Device Role / Timing Role: Implements custom bridge logic with DDR2/DDR3 controller, DMA engine, and PCIe endpoint wrapper (via soft IP). Use Value: 216 DSP48E1 slices accelerate CRC computation and packet header parsing; -3 speed grade ensures <5 ns path delay for backplane timing budgets. | Use Scenario: High-precision waveform generation and acquisition in automated test equipment (ATE) platforms. IC Role / Device Role / Timing Role: Generates synchronized multi-channel analog stimulus using DAC interface logic and captures digitized responses via ADC control state machines. Use Value: JESD78 Class II latch-up immunity ensures operational stability during ESD-prone probe contact events; industrial temp rating supports extended bench operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG484I | Same logic capacity and I/O count but in 484-pin FBGA package with 2.0 mm ball pitch; higher thermal resistance and larger footprint | Preferred for prototyping and manual rework due to larger pad spacing; less suitable for high-density industrial PCBs | Select when board layout allows larger package and thermal margin exceeds requirements |
| XC7A100T-2CSG324I | Artix-7 successor with 101K logic cells, 2.5x DSP slice count, and native PCIe Gen2 support; requires Vivado toolflow and different power sequencing | Enables higher-bandwidth protocols and more complex algorithms but increases design effort and BOM cost | Choose for new designs needing scalability beyond Spartan-6 lifecycle; not drop-in compatible |
Compared with XC6SLX150-3FGG484I, the XC6SLX150-N3CSG484I offers superior board-level density and thermal performance in compact industrial enclosures; versus XC7A100T-2CSG324I, it delivers proven reliability and lower toolchain overhead for maintenance of existing Spartan-6 deployments.
Availability
XC6SLX150-N3CSG484I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision processing, and communications backplane interface applications requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX150-N3CSG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the full portfolio of adaptive computing products, including FPGAs, ACAPs, and related software tools.
The Spartan-6 family was originally designed for cost-sensitive, high-volume applications demanding low power, small footprint, and industrial-grade reliability - especially in motor control, vision, and communications infrastructure.
FAQ
What is the maximum operating frequency of the XC6SLX150-N3CSG484I?
The XC6SLX150-N3CSG484I has a -3 speed grade, meaning its internal logic paths support maximum clock frequencies up to 560 MHz for register-to-register timing and 400 MHz for I/O timing under industrial temperature conditions. Actual achievable frequency depends on design placement, routing, and resource utilization - verified via static timing analysis in Xilinx ISE 14.7.
Does the XC6SLX150-N3CSG484I support JTAG boundary-scan testing?
Yes, the XC6SLX150-N3CSG484I fully supports IEEE 1149.1 JTAG boundary-scan testing through dedicated TCK, TMS, TDI, and TDO pins. This capability enables in-circuit verification of solder joints and interconnect integrity during PCB assembly and field diagnostics - critical for high-reliability industrial deployments of the XC6SLX150-N3CSG484I.
What configuration modes are supported by the XC6SLX150-N3CSG484I?
The XC6SLX150-N3CSG484I supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Configuration is initiated automatically on power-up using external flash memory or controlled via JTAG for debugging and programming. All modes are fully documented in UG380 and validated for use with the XC6SLX150-N3CSG484I's specific CSGA package pinout.
Is the XC6SLX150-N3CSG484I RoHS compliant?
Yes, the XC6SLX150-N3CSG484I is RoHS compliant and features a matte tin finish on its 484-ball CSP package. It meets Directive 2011/65/EU requirements, including lead content ≤1000 ppm, and is suitable for environmentally regulated industrial and medical applications where the XC6SLX150-N3CSG484I is deployed.
Can the XC6SLX150-N3CSG484I operate reliably at +100°C junction temperature?
Yes, the XC6SLX150-N3CSG484I is rated for industrial temperature operation from –40°C to +100°C ambient, with validated performance across this full range. Thermal design must ensure junction temperature remains within specification - confirmed via thermal simulation and board-level testing using the XC6SLX150-N3CSG484I's published θJA of 22.5°C/W in typical PCB layouts.
XC6SLX150-N3CSG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX150-N3CSG484I FAQ
1.How can I place an order for XC6SLX150-N3CSG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-N3CSG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-N3CSG484I reliable?
The price and inventory of XC6SLX150-N3CSG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-N3CSG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-N3CSG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-N3CSG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-N3CSG484I?
XC6SLX150-N3CSG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-N3CSG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-N3CSG484I?
For technical support, including XC6SLX150-N3CSG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-N3CSG484I requirements.
6.How does Aetrix verify that XC6SLX150-N3CSG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-N3CSG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-N3CSG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-N3CSG484I?
All XC6SLX150-N3CSG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-N3CSG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-N3CSG484I part is unused and in its original packaging.
Return procedure for XC6SLX150-N3CSG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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