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AMD XC6SLX150-N3FG484C
- Part No.:
- XC6SLX150-N3FG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150-N3FG484C.pdf
- Description:
- IC FPGA 338 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,036
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Product details
Overview
XC6SLX150-N3FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, -3 speed grade, and commercial temperature range (0°C to 85°C). It integrates block RAM, DSP48A1 slices, and SelectIO™ technology for high-speed I/O interfacing in industrial control and video processing systems.
For engineers reviewing the XC6SLX150-N3FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count (348 user I/Os), embedded memory (4,992 Kbits block RAM), DSP resource availability (180 DSP48A1 slices), and support for LVDS, SSTL, and HSTL I/O standards.
Technical Context
The XC6SLX150-N3FG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for clock networks and global reset. It supports JTAG boundary-scan (IEEE 1149.1) and configuration via SPI, BPI, or SelectMAP interfaces.
Configuration memory is loaded from external serial or parallel PROM/Flash; internal startup sequence includes power-on reset, configuration verification, and optional fallback mode. The device supports partial reconfiguration and dual-boot capability using external configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total programmable logic resources for implementing combinational and sequential logic functions |
| User I/O Pins | 348 - configurable single-ended and differential I/Os supporting multiple voltage standards |
| Block RAM | 4,992 Kbits - distributed as 180 x 36-Kbit blocks for data buffering, FIFOs, or lookup tables |
| DSP Slices | 180 DSP48A1 - each provides 25×18-bit multiplier, accumulator, and pre-adder for signal processing |
| Speed Grade | -3 - highest performance grade in Spartan-6 commercial family, enabling higher clock frequencies |
| Operating Temp | 0°C to +85°C - validated for commercial ambient conditions without extended thermal management |
| Package | 484-pin FBGA (23×23 mm, 1.0 mm pitch) - RoHS-compliant, thermally enhanced for stable thermal dissipation |
Pinout & Package
XC6SLX150-N3FG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array, 1.0 mm ball pitch, and 2.0 mm overall height. Pinout follows Xilinx Spartan-6 FPGA Pin Planning Guide UG381 (v1.11), with dedicated configuration, clock, JTAG, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity |
| P2 | CLK0 | Dedicated global clock input - low-skew routing to all clock regions |
| T13 | TMS | JTAG test mode select - controls IEEE 1149.1 state machine during programming/debug |
| V12 | PROGRAM_B | Active-low configuration initiator - forces reload from external memory on assertion |
| W14 | DONE | Open-drain status output - goes high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| Low-power 45 nm process | Reduces dynamic and static power consumption versus previous 65 nm FPGAs, enabling fanless industrial designs |
| SelectIO™ technology | Supports 18 I/O standards including LVDS, SSTL-2, HSTL-I, and PCI-X, simplifying interface to ADCs, DDR2/DDR3, and legacy peripherals |
| Dual-boot configuration | Enables field-upgradable firmware by storing two bitstreams in external Flash and selecting at power-up |
| Embedded Block RAM | Configurable as true dual-port RAM, ROM, or shift register - eliminates need for external memory in many control applications |
| PCI Express® endpoint (x1) | Integrated hard IP block compliant with PCIe Base Spec 1.1 - reduces logic usage and timing closure effort for host communication |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop execution and multi-axis coordination in CNC machines and robotic arms. IC Role / Device Role / Timing Role: Configurable logic fabric executes custom motion algorithms; embedded DSP slices accelerate position interpolation and PID computation. Use Value: Deterministic latency under 100 ns enables sub-millisecond control cycles without external ASICs. | Use Scenario: High-speed pixel data aggregation from multiple CMOS image sensors in ultrasound and digital radiography systems. IC Role / Device Role / Timing Role: FPGA acts as parallel-to-serial bridge and timing controller, synchronizing sensor clocks and packing data into AXI-Stream format. Use Value: 348 user I/Os support concurrent LVDS inputs from up to 12 sensors, reducing board layer count and interconnect complexity. |
| Video Broadcast Encoder | Avionics Data Concentrator |
Use Scenario: SDI/HDMI video stream encoding, color space conversion, and transport stream multiplexing in portable broadcast equipment. IC Role / Device Role / Timing Role: Implements real-time video pipeline using block RAM for line buffers and DSP slices for chroma subsampling and filtering. Use Value: 4,992 Kbits of block RAM enables full HD line buffering without external SDRAM, lowering BOM cost and EMI risk. | Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control subsystems. IC Role / Device Role / Timing Role: FPGA serves as deterministic time-triggered gateway, managing bus arbitration, error detection, and timestamped message forwarding. Use Value: -3 speed grade ensures worst-case path timing closure at 100 MHz system clock, meeting DO-254 design assurance level A requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG484I | Same logic resources and I/O count, but industrial temperature range (–40°C to +100°C) and higher static power | Suitable for extended-temperature environments such as outdoor base stations or engine-mounted controllers | Select XC6SLX150-3FG484I when operating outside 0°C–85°C range; otherwise XC6SLX150-N3FG484C offers lower cost and power |
| XC7S15-2FTGB196C | Smaller logic capacity (12,800 LUTs), 196-pin FTGB package, Artix-7 architecture with improved DSP efficiency and lower static power | Better suited for cost-sensitive, low-power applications where full Spartan-6 capacity is unnecessary | Choose XC7S15-2FTGB196C for new designs targeting smaller footprint and lower power; XC6SLX150-N3FG484C remains optimal for legacy Spartan-6 migration or high I/O density needs |
Compared with XC6SLX150-3FG484I, the XC6SLX150-N3FG484C trades extended temperature tolerance for lower cost and reduced static power; compared with XC7S15-2FTGB196C, it delivers 11.5× more logic and 1.8× more I/Os at the expense of newer architectural features like integrated transceivers and 28 nm process benefits.
Availability
XC6SLX150-N3FG484C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and video broadcast encoder applications requiring stable component supply across long production lifecycles.
Supply support for XC6SLX150-N3FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan, Artix, Kintex, and Virtex FPGA families originally created by Xilinx.
The Spartan-6 family, including XC6SLX150-N3FG484C, was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation in industrial and video systems.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150-N3FG484C?
XC6SLX150-N3FG484C supports I/O standards ranging from 1.2 V to 3.3 V, including LVCMOS, LVTTL, SSTL, HSTL, and LVDS. Each I/O bank has independent VCCO voltage, allowing mixed-voltage operation across banks. The device does not support 1.0 V or 0.9 V I/O standards. Configuration I/Os operate at 2.5 V or 3.3 V only.
Does XC6SLX150-N3FG484C support partial reconfiguration?
Yes, XC6SLX150-N3FG484C supports partial reconfiguration through the ICAP (Internal Configuration Access Port) and dedicated reconfiguration logic. This allows dynamic modification of specific logic regions while the rest of the design remains operational. Implementation requires Xilinx ISE Design Suite 14.7 or later and adherence to area constraints and routing isolation rules defined in UG380.
What configuration modes are supported by XC6SLX150-N3FG484C?
XC6SLX150-N3FG484C supports Master Serial (SPI Flash), Slave Serial, Slave Parallel (BPI), and SelectMAP configuration modes. JTAG is used for programming and debugging but not for normal startup. Configuration mode is selected via MODE pins (M0–M2); default is Master Serial. All modes require proper power sequencing and reset timing per DS162 specification.
Is XC6SLX150-N3FG484C pin-compatible with other Spartan-6 devices in the FG484 package?
No, XC6SLX150-N3FG484C is not fully pin-compatible with other Spartan-6 FG484 devices such as XC6SLX9 or XC6SLX25. While the package footprint and ball map are identical, I/O bank assignments, configuration pin locations, and dedicated function pin allocations differ across density grades. Pin compatibility is only guaranteed within the same density and speed grade variant group.
What is the recommended configuration memory size for XC6SLX150-N3FG484C?
The typical uncompressed configuration bitstream for XC6SLX150-N3FG484C is approximately 9.2 Mbits. When using SPI Flash in Master Serial mode, a minimum of 16 Mbit (2 MB) serial Flash is recommended to accommodate bitstream compression, multiple images, and future revisions. Xilinx recommends using Spansion S25FL128P or Micron N25Q128A for reliable operation.
XC6SLX150-N3FG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150-N3FG484C FAQ
1.How can I place an order for XC6SLX150-N3FG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-N3FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-N3FG484C reliable?
The price and inventory of XC6SLX150-N3FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-N3FG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX150-N3FG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-N3FG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-N3FG484C?
XC6SLX150-N3FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-N3FG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-N3FG484C?
For technical support, including XC6SLX150-N3FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-N3FG484C requirements.
6.How does Aetrix verify that XC6SLX150-N3FG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-N3FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-N3FG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX150-N3FG484C?
All XC6SLX150-N3FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-N3FG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-N3FG484C part is unused and in its original packaging.
Return procedure for XC6SLX150-N3FG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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