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AMD XC6SLX150-N3FG484I

Part No.:
XC6SLX150-N3FG484I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC6SLX150-N3FG484I.pdf
Description:
IC FPGA 338 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,708

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Product details

Overview

XC6SLX150-N3FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 180 DSP48A1 slices, 4.9 Mb of total block RAM, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial motor control systems requiring deterministic I/O timing and real-time logic processing.

For engineers reviewing the XC6SLX150-N3FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, configuration interface options (SPI/BPI), and JTAG debug capability.

Technical Context

The XC6SLX150-N3FG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates SelectIO technology supporting single-ended (LVTTL, LVCMOS) and differential (LVDS, RSDS) signaling up to 1,080 Mbps per I/O pair.

Configuration is performed via Master SPI, Slave SPI, or BPI parallel mode using external flash memory; internal startup circuitry supports multi-boot and fallback mechanisms. JTAG boundary-scan (IEEE 1149.1) is embedded for testing and programming.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells147,443 - determines maximum combinational/sequential logic capacity for custom digital functions
User I/O Pins348 - supports high-density peripheral interfacing including multiple ADCs, encoders, and communication buses
Block RAM4.9 Mb - enables local data buffering, FIFOs, and small lookup tables without external memory
DSP Slices180 × DSP48A1 - provides fixed-point multiply-accumulate operations for motor control algorithms and filtering
Speed Grade-3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions
Operating Temp-40°C to +100°C - qualified for use in enclosed industrial drives and factory automation cabinets
Configuration ModeMaster/Slave SPI, BPI - allows flexible boot source selection and field firmware updates

Pinout & Package

XC6SLX150-N3FG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size and 1.0 mm ball pitch. The package supports thermal dissipation up to 5.5 W under typical industrial operating conditions.

Pin/TerminalCircuit RoleDesign Meaning
GND / VCCOPower supply reference / I/O bank voltageEach of 12 I/O banks has independent VCCO (1.2–3.3 V) enabling mixed-voltage interface design
CCLK / INIT_BConfiguration clock / initialization statusActive-low INIT_B signals configuration success/failure; CCLK synchronizes bitstream loading
M0–M2Mode selection pinsSet configuration mode (SPI/BPI/Slave Serial) at power-up; latched during PROG_B assertion
TCK/TMS/TDI/TDOJTAG test access portEnables IEEE 1149.1 boundary-scan testing, device programming, and debug probe attachment
IO_LxxYy_#User-configurable I/O348 pins support programmable drive strength, slew rate, and input termination for signal integrity

Key Features

FeatureDesign Value
Multi-Voltage I/O Banks12 independent banks support simultaneous 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces without level shifters
Dedicated Clock RoutingEight global clock networks with low-skew distribution ensure synchronous timing across large logic regions
Embedded Block RAM180 × 36 Kb blocks configured as true dual-port RAM, ROM, or shift register for pipeline staging
DSP48A1 SliceIntegrated 18×25 multiplier, 48-bit accumulator, and pre-adder enable single-cycle MAC for PID loop acceleration
Configuration SecurityBitstream encryption via AES-256 and HMAC authentication prevent unauthorized cloning or firmware tampering

Applications

Industrial Motor ControlFactory Automation PLC

Use Scenario: Real-time field-oriented control (FOC) of 3-phase AC induction and PMSM motors with encoder feedback.

IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop current/voltage regulation, PWM generation, and safety monitoring in sub-µs latency.

Use Value: 348 I/Os interface directly to gate drivers, analog front-ends, and position sensors; -3 speed grade ensures deterministic timing at 10 kHz PWM switching.

Use Scenario: Modular I/O expansion module handling discrete inputs, analog inputs, and fieldbus protocol bridging (Modbus RTU/TCP, CANopen).

IC Role / Device Role / Timing Role: Configurable logic implements protocol state machines, cyclic redundancy checks, and hot-swap controller sequencing.

Use Value: Multi-bank I/O supports mixed 24 V DC sensor inputs and 3.3 V microcontroller interfaces; embedded RAM buffers protocol payloads without external memory.

Test & Measurement EquipmentMedical Imaging Subsystem

Use Scenario: High-speed digital pattern generator capturing and replaying stimulus waveforms for semiconductor ATE.

IC Role / Device Role / Timing Role: FPGA implements precise timing engines, DDR2/3 memory controllers, and PCIe endpoint logic for host communication.

Use Value: 4.9 Mb block RAM stores multi-gigasample waveform buffers; LVDS I/O achieves 1,080 Mbps data capture rates.

Use Scenario: Ultrasound beamforming subsystem synchronizing 64+ transducer channels with sub-nanosecond skew.

IC Role / Device Role / Timing Role: FPGA performs time-of-flight delay calculation, echo digitization control, and channel multiplexing before ADC aggregation.

Use Value: Dedicated clock routing minimizes inter-channel skew; DSP48A1 slices accelerate FIR filter coefficients for real-time envelope detection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX150-3FG484CCommercial temperature range (0°C to +85°C); identical logic resources and I/O countNot rated for industrial ambient extremes; unsuitable for sealed cabinet deployments above 85°CSelect only for lab-grade or indoor non-industrial environments with controlled cooling
XCVU9P-FLGA2104-2LVirtex UltraScale device with 1,182,240 logic cells, 6.5 Tb/s transceiver bandwidth, and HBM2 integrationTargets high-end radar and AI inference; over-spec'd for deterministic motor control with excessive cost and powerConsider only when migrating to multi-GHz sampling, PCIe Gen4, or real-time ML inference at edge

Compared with XC6SLX150-3FG484C, the XC6SLX150-N3FG484I delivers guaranteed operation at 100°C ambient-critical for fanless industrial enclosures-while matching all logic, memory, and I/O capabilities. Against XCVU9P-FLGA2104-2L, it offers proven reliability and lower power for deterministic control tasks without transceiver or HBM overhead.

Availability

XC6SLX150-N3FG484I is available at Aetrix Electronics and suitable for industrial motor control, factory automation PLC modules, and test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX150-N3FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for embedded, data center, and edge applications.

The Spartan-6 family was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable logic density, low static power, and robust configuration security-exemplified by the XC6SLX150-N3FG484I.

FAQ

What is the maximum supported I/O standard for XC6SLX150-N3FG484I?

The XC6SLX150-N3FG484I supports LVDS, RSDS, BLVDS, and differential SSTL at up to 1,080 Mbps per differential pair. Single-ended standards include LVCMOS, LVTTL, and PCI up to 200 MHz. Each of its 12 I/O banks is independently configurable for voltage and termination.

Does XC6SLX150-N3FG484I support partial reconfiguration?

No, the XC6SLX150-N3FG484I does not support partial reconfiguration. It uses full configuration bitstream loading via SPI, BPI, or JTAG. Partial reconfiguration is available only in Virtex-6 and later families-not implemented in Spartan-6 architecture.

What configuration memory options are compatible with XC6SLX150-N3FG484I?

XC6SLX150-N3FG484I supports serial (x1/x2/x4) and parallel (x16) NOR flash devices, including Spansion, Macronix, and Micron parts with densities from 16 Mb to 128 Mb. Configuration mode is selected via M0–M2 pins at power-up.

Is XC6SLX150-N3FG484I RoHS compliant and lead-free?

Yes, XC6SLX150-N3FG484I is RoHS 2011/65/EU compliant and manufactured with lead-free (Pb-free) terminations. The FG484 package uses matte tin plating over copper substrate and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).

Can XC6SLX150-N3FG484I be programmed via JTAG in-system?

Yes, XC6SLX150-N3FG484I supports full in-system programming and debugging via its 4-pin JTAG TAP (TCK/TMS/TDI/TDO). Xilinx iMPACT and Vivado tools can configure, verify, and perform boundary-scan testing without removing the device from the PCB.

XC6SLX150-N3FG484I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
11519
Number of Logic Elements/Cells:
147443
Total RAM Bits:
4939776
Number of I/O:
338
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC6SLX150-N3FG484I FAQ

1.How can I place an order for XC6SLX150-N3FG484I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX150-N3FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX150-N3FG484I reliable?

The price and inventory of XC6SLX150-N3FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-N3FG484I is usually 5 days.

3.What payment methods are accepted for XC6SLX150-N3FG484I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-N3FG484I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX150-N3FG484I?

XC6SLX150-N3FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX150-N3FG484I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX150-N3FG484I?

For technical support, including XC6SLX150-N3FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-N3FG484I requirements.

6.How does Aetrix verify that XC6SLX150-N3FG484I is sourced from the original manufacturer or authorized distributors?

All XC6SLX150-N3FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-N3FG484I meets industry standards.

7.What is the process for return or replacement of XC6SLX150-N3FG484I?

All XC6SLX150-N3FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-N3FG484I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX150-N3FG484I part is unused and in its original packaging.

Return procedure for XC6SLX150-N3FG484I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX150-N3FG484I Tags

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