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AMD XC6SLX150-N3FG900C
- Part No.:
- XC6SLX150-N3FG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150-N3FG900C.pdf
- Description:
- IC FPGA 576 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,459
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Product details
Overview
XC6SLX150-N3FG900C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 147,443 logic cells, 480 DSP48A1 slices, and 4,723,200 total RAM bits. It features 532 user I/Os in a 900-pin Fine-Pitch BGA (FG900) package and operates at -3 speed grade (1.2 V core, industrial temperature range). It is used in industrial imaging systems requiring high I/O count and deterministic timing.
For engineers reviewing the XC6SLX150-N3FG900C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, DSP resource availability, thermal performance in FG900 packaging, and support for LVDS, SSTL, and HSTL I/O standards.
Technical Context
The XC6SLX150-N3FG900C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates block RAM (18 Kb dual-port), distributed RAM, and shift registers for flexible memory mapping.
It supports SelectIO™ technology with programmable drive strength (2–24 mA), slew rate control, and on-die termination (ODT) for 13 I/O standards including LVCMOS, LVDS, and SSTL-2. Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for HDL synthesis |
| DSP Slices | 480 × DSP48A1 - enables parallel multiply-accumulate operations up to 25×18-bit precision |
| Block RAM | 4,723,200 bits (262 × 18 Kb blocks) - supports dual-port FIFOs, frame buffers, or coefficient storage |
| User I/O Pins | 532 - provides high-density interface routing for multi-sensor or multi-interface systems |
| Speed Grade | -3 - guarantees timing closure at 1.2 V core supply with industrial temperature range (−40°C to +100°C) |
| I/O Standards | LVDS, SSTL-2, HSTL, LVCMOS - enables direct interfacing with ADCs, DDR2 memory, and image sensors |
Pinout & Package
XC6SLX150-N3FG900C is housed in a 900-ball Fine-Pitch Ball Grid Array (FG900) package with 31 × 31 ball array, 1.0 mm pitch, and 0.55 mm ball diameter. Thermal pad on underside requires PCB thermal via array per Xilinx UG382.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 10 µF near ball |
| P2 | GCLK1 | Global clock input - low-skew routing to all logic regions; supports 0–375 MHz operation |
| T14 | M0 | Configuration mode select - sets boot source (SPI vs. slave serial) during power-up |
| V17 | INIT_B | Open-drain status signal - indicates configuration status and error detection |
| Y18 | CCLK | Configuration clock - drives internal config logic; can be internally generated or externally supplied |
Key Features
| Feature | Design Value |
|---|---|
| ISE Design Suite Support | Fully supported in Xilinx ISE 14.7 - includes place-and-route, timing analysis, and bitstream generation |
| Low-Power Architecture | 1.2 V core voltage with dynamic power gating - reduces active power in burst-mode imaging applications |
| SelectIO™ Technology | Programmable I/O standards per bank - allows mixed-voltage interfaces (e.g., 3.3 V camera link + 1.8 V DDR2) |
| Embedded Memory | 18 Kb block RAM with parity - enables ECC-capable buffers for mission-critical data paths |
| Multi-Boot Capability | Supports dual-bitstream fallback - enables field-upgradable firmware with safe rollback on corruption |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time preprocessing of high-resolution CMOS sensor streams in automated optical inspection systems. IC Role / Device Role / Timing Role: FPGA acts as pixel-level pipeline processor and serializer, synchronizing multiple camera inputs with sub-cycle jitter. Use Value: 532 I/Os enable direct connection to 4+ GigaVision cameras; DSP48A1 slices accelerate Sobel edge detection in hardware. | Use Scenario: Interfacing ultrasound transducer arrays with digital beamforming ASICs in portable diagnostic devices. IC Role / Device Role / Timing Role: Timing controller and protocol bridge between analog front-end and ARM-based host processor. Use Value: LVDS I/O supports 800 Mbps differential links to ADCs; block RAM stores calibration lookup tables with <1 ns access latency. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: Aggregating ARINC 429, discrete I/O, and CAN FD signals in flight control subsystems. IC Role / Device Role / Timing Role: Deterministic I/O hub with time-triggered scheduling and fault-isolation logic. Use Value: -3 speed grade ensures timing margin across −40°C to +100°C; 18 Kb RAM blocks implement dual-buffered message queues. | Use Scenario: High-speed pattern generation and response capture in automated circuit testers. IC Role / Device Role / Timing Role: Vector generator and comparator with real-time pass/fail decision logic. Use Value: 147K logic cells implement 128-channel parallel test engines; SelectIO™ supports 1.5 V HSTL for memory test interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG900I | Same logic resources and I/O count, but -3I speed grade rated for extended industrial range (−40°C to +100°C) with tighter timing margins | Preferred for designs requiring guaranteed timing at max junction temperature without derating | Select XC6SLX150-3FG900I when operating ambient exceeds 85°C or when worst-case static timing analysis fails on -N3 variant |
| XC7A100T-2CSG324C | Artix-7 architecture: higher logic density (101,440 LUTs), 2.5x more DSP slices, but only 210 user I/Os in smaller CSG324 package | Better for compute-intensive tasks with lower I/O count; not suitable for high-pin-count sensor aggregation | Choose XC7A100T-2CSG324C when migrating to 28 nm process for lower power or higher DSP throughput, accepting I/O reduction |
Compared with XC6SLX150-N3FG900C, the -3FG900I offers identical functionality with enhanced timing robustness, while the XC7A100T-2CSG324C trades I/O scalability for architectural efficiency and process node advantage-selection depends on whether pin count or computational density dominates system constraints.
Availability
XC6SLX150-N3FG900C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX150-N3FG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic, I/O, and DSP resources - especially in industrial automation, embedded vision, and communications infrastructure.
FAQ
What is the maximum operating frequency of the XC6SLX150-N3FG900C?
The XC6SLX150-N3FG900C supports global clock inputs up to 375 MHz under industrial conditions. Actual achievable system frequency depends on design complexity, routing, and I/O standard selection. The -3 speed grade guarantees timing closure for synchronous logic paths meeting specified setup/hold requirements at 1.2 V core voltage and −40°C to +100°C ambient.
Does the XC6SLX150-N3FG900C support JTAG boundary-scan testing?
Yes, the XC6SLX150-N3FG900C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug. Pins TCK, TMS, TDI, and TDO are dedicated for this function and support In-System Programming (ISP) without requiring external configuration PROMs.
Can the XC6SLX150-N3FG900C interface directly with DDR2 SDRAM?
Yes, the XC6SLX150-N3FG900C supports DDR2 SDRAM interfaces using its SelectIO™ I/O banks configured for SSTL-18 Class I. It provides dedicated DQS groups and phase-matched strobes, enabling reliable 400 Mbps data rates. Xilinx UG381 documents timing constraints and PCB layout guidelines for compliant DDR2 implementations.
What configuration modes does the XC6SLX150-N3FG900C support?
The XC6SLX150-N3FG900C supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Mode selection is controlled by M2:M0 pins at power-up. Master SPI mode uses internal oscillator to load bitstream from external SPI flash; Slave Serial mode accepts configuration data from external microcontroller or processor.
Is the XC6SLX150-N3FG900C RoHS compliant and lead-free?
Yes, the XC6SLX150-N3FG900C is manufactured in a lead-free, RoHS-compliant process. The FG900 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's Product Change Notification (PCN) #X-2019-001.
XC6SLX150-N3FG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150-N3FG900C FAQ
1.How can I place an order for XC6SLX150-N3FG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-N3FG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-N3FG900C reliable?
The price and inventory of XC6SLX150-N3FG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-N3FG900C is usually 5 days.
3.What payment methods are accepted for XC6SLX150-N3FG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-N3FG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-N3FG900C?
XC6SLX150-N3FG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-N3FG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-N3FG900C?
For technical support, including XC6SLX150-N3FG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-N3FG900C requirements.
6.How does Aetrix verify that XC6SLX150-N3FG900C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-N3FG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-N3FG900C meets industry standards.
7.What is the process for return or replacement of XC6SLX150-N3FG900C?
All XC6SLX150-N3FG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-N3FG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-N3FG900C part is unused and in its original packaging.
Return procedure for XC6SLX150-N3FG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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