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AMD XC6SLX150-N3FG900I
- Part No.:
- XC6SLX150-N3FG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150-N3FG900I.pdf
- Description:
- IC FPGA 576 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,887
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Product details
Overview
XC6SLX150-N3FG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 4,729 Kbits of block RAM, and 318 user I/Os in a 900-pin Fine-Pitch BGA (FG900) package. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and supports SelectIO standards up to 1.25 Gbps for high-speed interface design in industrial control systems.
For engineers reviewing the XC6SLX150-N3FG900I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade compliance, industrial temperature support, and compatibility with Spartan-6 configuration interfaces (JTAG, Master SPI, Slave SelectMAP).
Technical Context
The XC6SLX150-N3FG900I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, paired with 18×25 multipliers and integrated clock management using DCM and PLL blocks. It supports dual-register flip-flops per slice and dedicated carry logic for arithmetic acceleration.
Configuration is performed via JTAG, Master SPI, or Slave SelectMAP modes, with bitstream security enabled through AES encryption and HMAC authentication. The device includes 24 transceivers supporting SATA, PCI Express Gen1, and Serial RapidIO protocols at up to 3.2 Gbps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for system-on-chip integration |
| Block RAM | 4,729 Kbits - provides on-chip memory for FIFOs, buffers, and data caching without external SRAM |
| User I/Os | 318 - enables high-pin-count interface consolidation including DDR2/3, Gigabit Ethernet, and video I/O |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequencies defined in Spartan-6 data sheet tables |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating or thermal margin compromise |
| Transceivers | 24 × 3.2 Gbps - supports embedded serial protocols including PCIe Gen1 x1/x2 and SATA 1.5/3.0 Gbps |
| Package | FG900 - 900-ball fine-pitch BGA with 1.0 mm ball pitch, requiring 6-layer PCB routing and controlled impedance layout |
Pinout & Package
XC6SLX150-N3FG900I is housed in a 900-ball Fine-Pitch BGA (FG900) package with 318 user-configurable I/Os, 12 dedicated configuration pins (including INIT_B, PROGRAM_B, CCLK, DIN, DOUT, DONE), 8 global clock inputs, and 4 power supply domains (VCCINT, VCCAUX, VCCO, VREF).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asserting low reloads configuration memory; must be pulled high during normal operation |
| INIT_B | Open-Drain Status Output | Indicates configuration status and internal initialization completion |
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SPI mode |
| DIN | Serial Data Input | Receives configuration bitstream in Master SPI or JTAG programming |
| DONE | Configuration Completion Flag | Signals successful configuration load; used for system reset synchronization |
| VCCINT | Core Logic Supply | 1.2 V ±3% supply powering CLBs, interconnect, and clock networks |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DSP Slices | 18×25-bit multipliers with pre-adders enable real-time filtering and FFT computation without external processors |
| SelectIO Technology | Supports LVCMOS, SSTL, HSTL, and differential standards up to 1.25 Gbps for mixed-voltage board interfacing |
| Embedded Memory | 4,729 Kbits of block RAM + distributed RAM allows implementation of dual-port memory and FIFO structures |
| Security Features | AES-256 bitstream encryption and HMAC authentication prevent unauthorized cloning and reverse engineering |
| Low-Power Architecture | 1.2 V core voltage and dynamic power gating reduce active power consumption in battery-backed or thermally constrained systems |
Applications
| Industrial PLC Controller | Video Surveillance Encoder |
|---|---|
Use Scenario: Real-time motion detection, protocol bridging (Modbus to EtherCAT), and deterministic I/O scanning in factory automation cabinets. IC Role / Device Role / Timing Role: System-on-chip controller managing fieldbus interfaces, safety logic, and FPGA-based soft-core processor execution. Use Value: 318 user I/Os consolidate multiple industrial bus PHYs; -3 speed grade ensures sub-100 ns cycle time for hard real-time tasks. | Use Scenario: Simultaneous encoding of four 1080p@30fps video streams with on-chip motion estimation and H.264 compression. IC Role / Device Role / Timing Role: Video processing accelerator offloading CPU-intensive tasks while maintaining precise pixel clock synchronization. Use Value: Embedded block RAM buffers full-frame video lines; DSP slices accelerate motion vector calculation at 1.2 GHz effective throughput. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: High-integrity acquisition and preprocessing of ultrasound echo data before transmission to host processor over PCIe. IC Role / Device Role / Timing Role: Time-critical signal conditioner and protocol converter between analog front-end and digital backplane. Use Value: Industrial temperature rating ensures reliability in sealed medical enclosures; AES encryption secures patient data in transit. | Use Scenario: Aggregation and format conversion of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control subsystems. IC Role / Device Role / Timing Role: Deterministic data router with hardware timestamping and fault-isolation logic. Use Value: 24 transceivers support concurrent ARINC 429 receive channels; -40°C to +100°C operation meets DO-160E Section 22 environmental requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG900C | Commercial temperature range (0°C to +85°C); identical logic resources, I/O count, and transceiver count | Suitable for non-industrial environments where extended temperature is not required | Select XC6SLX150-3FG900C only if ambient operating conditions remain within commercial limits and no long-term thermal cycling is expected |
| XCVU9P-2FLGA2104I | UltraScale architecture; 2,586K logic cells, 48.5 Mb BRAM, 64 GTY transceivers at 32.75 Gbps; larger FG2104 package | Targets next-generation radar, 5G baseband, and AI inference acceleration requiring >10× logic density and multi-gigabit SerDes | Choose XCVU9P-2FLGA2104I only when migrating beyond Spartan-6 scalability limits-requires new PCB, toolchain, and verification effort |
Compared with XC6SLX150-N3FG900I, XC6SLX150-3FG900C offers identical functionality at lower cost but lacks industrial temperature qualification, while XCVU9P-2FLGA2104I delivers massive scale-up in logic, memory, and serial bandwidth at significantly higher power, cost, and design complexity.
Availability
XC6SLX150-N3FG900I is available at Aetrix Electronics and suitable for industrial automation, medical imaging, and avionics applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150-N3FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation in industrial and embedded systems.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150-N3FG900I?
The XC6SLX150-N3FG900I supports SelectIO standards including LVCMOS 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V, SSTL15, SSTL18, HSTL_I, and differential standards such as LVDS and RSDS. Maximum I/O bank voltage is 3.3 V, with each bank independently configurable for mixed-voltage operation. All I/Os are 5V-tolerant only when configured as inputs in specific standards like LVCMOS33.
Does XC6SLX150-N3FG900I support partial reconfiguration?
XC6SLX150-N3FG900I does not natively support partial reconfiguration. The Spartan-6 architecture requires full configuration reload for any logic change. Dynamic reconfiguration is limited to readback and verification operations. For true partial reconfiguration, users must migrate to 7-series or newer FPGA families such as Artix-7 or Kintex-7, which include dedicated ICAP and frame-based update mechanisms.
What configuration modes are supported by XC6SLX150-N3FG900I?
XC6SLX150-N3FG900I supports three primary configuration modes: JTAG (for debugging and programming), Master SPI (using on-chip oscillator to drive external SPI flash), and Slave SelectMAP (parallel loading via microprocessor or FPGA). Configuration can also be initiated via PROGRAM_B pin assertion, and status monitored via INIT_B and DONE pins.
Is XC6SLX150-N3FG900I RoHS compliant and lead-free?
Yes, XC6SLX150-N3FG900I is RoHS-compliant and lead-free per EU Directive 2011/65/EU. The FG900 package uses matte tin finish on solder balls, and the device meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation, including substance declarations and test reports, is available through AMD's Product Change Notification system.
Can XC6SLX150-N3FG900I interface directly with DDR3 SDRAM?
XC6SLX150-N3FG900I does not include hard DDR3 memory controller IP. However, it supports DDR3 SDRAM interfacing via Xilinx-provided soft IP (MIG v3.7) targeting Spartan-6, which implements phase-aligned clocking, write leveling, and calibration logic. Successful operation requires careful PCB layout, matched trace lengths, and adherence to MIG-generated constraints for 800 Mbps data rates.
XC6SLX150-N3FG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150-N3FG900I FAQ
1.How can I place an order for XC6SLX150-N3FG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-N3FG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-N3FG900I reliable?
The price and inventory of XC6SLX150-N3FG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-N3FG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-N3FG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-N3FG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-N3FG900I?
XC6SLX150-N3FG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-N3FG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-N3FG900I?
For technical support, including XC6SLX150-N3FG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-N3FG900I requirements.
6.How does Aetrix verify that XC6SLX150-N3FG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-N3FG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-N3FG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-N3FG900I?
All XC6SLX150-N3FG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-N3FG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-N3FG900I part is unused and in its original packaging.
Return procedure for XC6SLX150-N3FG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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