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AMD XC6SLX150-N3FGG484C
- Part No.:
- XC6SLX150-N3FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150-N3FGG484C.pdf
- Description:
- IC FPGA 338 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,781
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Product details
Overview
XC6SLX150-N3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 4,032 Kbits of block RAM, 318 I/O pins, and operation at -3 speed grade with commercial temperature range (0°C to 85°C). It serves as a programmable logic fabric for digital signal processing, interface bridging, and embedded control in industrial automation systems.
For engineers reviewing the XC6SLX150-N3FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade compliance, and package thermal performance in space-constrained PCB layouts.
Technical Context
The XC6SLX150-N3FGG484C implements a hierarchical FPGA architecture with six-input LUTs, dedicated carry logic, and integrated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It includes dual-port block RAM configurable as 18 Kbits per block and supports distributed RAM using LUTs.
Configuration is performed via Master Serial or Slave SelectMAP modes using external SPI flash or processor-controlled parallel interface. The device supports JTAG boundary-scan IEEE 1149.1 and includes internal configuration monitoring with CRC error detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total programmable logic capacity for combinatorial and sequential logic implementation |
| Block RAM | 4,032 Kbits - on-chip memory for FIFOs, buffers, or lookup tables without external memory dependency |
| I/O Pins | 318 - user-configurable bidirectional pins supporting LVCMOS, LVTTL, SSTL, HSTL, and differential standards |
| Speed Grade | -3 - guarantees timing closure up to 667 Mbps DDR3 data rate and 500 MHz system clock in worst-case commercial conditions |
| Package | FGG484 - 484-pin Fine-Pitch Ball Grid Array with 23×23 mm body and 1.0 mm ball pitch |
| Operating Temp | 0°C to 85°C - validated thermal performance for industrial control and factory-floor environments |
Pinout & Package
XC6SLX150-N3FGG484C is housed in a 484-ball FCBGA (Fine-Pitch Chip Scale Ball Grid Array) package with 23×23 array, 1.0 mm ball pitch, and 0.8 mm ball diameter. Thermal pad on underside enables efficient heat dissipation in high-utilization designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity in LVCMOS33 interfaces |
| T1 | GCLK1 | Global clock input - low-skew routing to all logic regions; supports single-ended or differential (LVDS) clock sources |
| A1 | M0 | Configuration mode select - sets boot source to Master Serial when pulled High during power-up |
| P2 | PROGRAM_B | Active-Low configuration reset - initiates reconfiguration sequence and clears internal state |
| R1 | DONE | Open-drain status output - goes High-Z after successful configuration; used for system readiness signaling |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 180 slices enabling 18×18-bit signed multiplication with pipelined accumulate for real-time filtering |
| SelectIO Technology | Supports 21 I/O standards including LVDS, RSDS, and differential SSTL-18 with programmable drive strength and slew rate |
| Embedded Memory | 18 Kb block RAM blocks with true dual-port capability for simultaneous read/write in data buffering applications |
| Configuration Security | Bitstream encryption via AES-256 key stored in on-chip eFUSE prevents unauthorized cloning or reverse engineering |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis synchronization in CNC machines. IC Role / Device Role / Timing Role: FPGA fabric executes position loop algorithms, generates PWM waveforms, and manages encoder feedback timing with sub-microsecond jitter. Use Value: 318 I/O pins enable direct connection to multiple encoders, DACs, and gate drivers; -3 speed grade ensures deterministic timing for 20 kHz PWM update rates. | Use Scenario: Conversion between MIPI CSI-2 camera sensor output and parallel RGB interface for FPGA-based vision processors. IC Role / Device Role / Timing Role: Deserializes high-speed MIPI lanes and resynchronizes pixel data into parallel format with precise pixel-clock alignment. Use Value: SelectIO supports MIPI D-PHY-compatible voltage levels and timing; block RAM buffers frame data during format translation without external memory. |
| Programmable Logic Controller | Communications Backplane Interface |
Use Scenario: Replacement for ASIC-based PLC logic in modular I/O chassis requiring field-upgradable control firmware. IC Role / Device Role / Timing Role: Implements ladder logic scan engine, safety watchdog timers, and EtherCAT slave protocol stack in soft-core logic. Use Value: 147K logic cells accommodate full EtherCAT slave stack plus custom motion control extensions; configuration encryption secures proprietary control IP. | Use Scenario: Protocol translation and packet buffering between PCIe Gen2 host and legacy SRIO-based DSP blades in telecom baseband units. IC Role / Device Role / Timing Role: Acts as a bridge controller managing flow control, address mapping, and error correction across heterogeneous interconnect domains. Use Value: Dual-port block RAM enables zero-latency packet buffering; -3 speed grade meets 2.5 Gbps SRIO lane timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic fabric applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG484C | Same logic resources and package, but -3 speed grade lacks guaranteed timing margin for 667 Mbps DDR3 interfaces | Suitable for lower-frequency control logic where DDR3 interface is unused | Select only if design does not require worst-case timing closure at maximum supported data rates |
| XCKU035-2FFVA676E | Kintex UltraScale device with 350K logic cells, higher bandwidth transceivers, and 1.2 V core voltage | Targeted at high-throughput protocols like CPRI or 10G Ethernet where XC6SLX150-N3FGG484C lacks native transceivers | Choose when migrating beyond Spartan-6 capabilities while retaining Xilinx toolchain compatibility |
Compared with XC6SLX150-3FGG484C, the XC6SLX150-N3FGG484C provides tighter timing margins for DDR3 memory interfaces; versus XCKU035-2FFVA676E, it offers lower power and cost for fixed-function industrial logic without high-speed serial I/O requirements.
Availability
XC6SLX150-N3FGG484C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and programmable logic controller applications requiring stable component supply and long-term manufacturing support.
Supply support for XC6SLX150-N3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable programmable logic with low static power and flexible I/O, targeting industrial, automotive, and consumer markets.
FAQ
What is the maximum supported DDR3 data rate for XC6SLX150-N3FGG484C?
The XC6SLX150-N3FGG484C supports DDR3 interfaces up to 667 Mbps per pin under worst-case commercial conditions, enabled by its -3 speed grade qualification and calibrated I/O delay chains. This rating is verified in Xilinx UG382 and applies to banks configured for SSTL15 I/O standard. XC6SLX150-N3FGG484C requires proper board-level termination and layout adherence to JEDEC specifications to achieve this performance.
Does XC6SLX150-N3FGG484C support JTAG boundary-scan testing?
Yes, XC6SLX150-N3FGG484C fully complies with IEEE 1149.1 JTAG boundary-scan standard. It includes dedicated TDI, TDO, TMS, and TCK pins, and supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions. XC6SLX150-N3FGG484C also provides internal BSCAN primitives for visibility into configuration logic and I/O states during production test.
Can XC6SLX150-N3FGG484C be configured via SPI flash memory?
Yes, XC6SLX150-N3FGG484C supports Master Serial configuration mode using industry-standard SPI flash devices such as Micron MT25QL series. Configuration occurs automatically on power-up when M0–M2 pins are set to 101, and XC6SLX150-N3FGG484C drives the SPI clock and data lines directly without external controller intervention.
What thermal management considerations apply to XC6SLX150-N3FGG484C in continuous operation?
XC6SLX150-N3FGG484C requires a minimum 4×4 mm exposed thermal pad soldered to a solid copper plane for effective heat dissipation. Under full utilization at 85°C ambient, junction temperature must remain below 100°C, achievable with ≥2 oz copper layers and ≥4 thermal vias under the package. XC6SLX150-N3FGG484C thermal characteristics are documented in Xilinx UG381 Table 2-12.
Is bitstream encryption supported on XC6SLX150-N3FGG484C?
Yes, XC6SLX150-N3FGG484C supports AES-256 bitstream encryption using a 256-bit key stored in one-time-programmable eFUSE. Encryption is enabled during bitstream generation in Vivado, and XC6SLX150-N3FGG484C verifies the key before loading configuration data. This prevents unauthorized access to proprietary logic design and intellectual property embedded in the XC6SLX150-N3FGG484C configuration.
XC6SLX150-N3FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150-N3FGG484C FAQ
1.How can I place an order for XC6SLX150-N3FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-N3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-N3FGG484C reliable?
The price and inventory of XC6SLX150-N3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-N3FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX150-N3FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-N3FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-N3FGG484C?
XC6SLX150-N3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-N3FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-N3FGG484C?
For technical support, including XC6SLX150-N3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-N3FGG484C requirements.
6.How does Aetrix verify that XC6SLX150-N3FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-N3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-N3FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX150-N3FGG484C?
All XC6SLX150-N3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-N3FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-N3FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX150-N3FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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