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AMD XC6SLX150-N3FGG676C
- Part No.:
- XC6SLX150-N3FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150-N3FGG676C.pdf
- Description:
- IC FPGA 498 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,174
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Product details
Overview
XC6SLX150-N3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 576 DSP48A1 slices, 4.9 Mb of total block RAM, and operates at -3 speed grade with commercial temperature range (0°C to 85°C). It is used in industrial video processing systems requiring deterministic latency and multi-channel I/O interfacing.
For engineers reviewing the XC6SLX150-N3FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2 V to 3.3 V), integrated clock management (DCM and PLL), and support for DDR2/DDR3 memory interfaces.
Technical Context
The XC6SLX150-N3FGG676C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for high-speed I/O and clock networks. It integrates dual DCMs per I/O bank and one PLL per device for clock synthesis, phase alignment, and jitter reduction.
It supports SelectIO standards including LVCMOS, LVDS, SSTL, and HSTL across 16 I/O banks, with programmable drive strength (2 mA–24 mA) and slew rate control. Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational and sequential logic capacity for custom digital functions |
| DSP Slices | 576 × DSP48A1 - enables parallel multiply-accumulate operations for filtering and math-intensive algorithms |
| Block RAM | 4.9 Mb - supports on-chip data buffering, FIFOs, and lookup tables without external memory |
| I/O Pins | 480 user I/O - provides high-density interface capability across 16 configurable banks |
| Speed Grade | -3 - guarantees timing closure up to 667 MHz for internal logic and 1,050 Mbps for differential I/O |
| Operating Temp | 0°C to 85°C - validated for commercial-grade industrial control and embedded vision applications |
| Configuration Mode | Master SPI / Slave Serial / JTAG - enables flexible, field-upgradable programming architectures |
Pinout & Package
XC6SLX150-N3FGG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.5 W under typical operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets output voltage level for associated pins (1.2 V–3.3 V) |
| P2 | CLKIN_1 | Dedicated single-ended clock input for DCM/PLL - accepts 10–500 MHz external reference |
| T14 | INIT_B | Open-drain configuration status signal - asserted low during configuration, high when complete |
| V17 | PROGRAM_B | Active-low asynchronous reset for configuration logic - forces reinitialization of FPGA fabric |
| W19 | CCLK | Configuration clock output - generated during Master SPI mode to synchronize PROM read timing |
| Y20 | DONE | Open-drain configuration completion indicator - pulled high externally when bitstream load succeeds |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Dual DCMs per I/O bank + one PLL - enables independent clock domain generation and phase shifting for multi-rate systems |
| SelectIO Technology | Support for 18 I/O standards including LVDS, SSTL-18, and HSTL - eliminates level-shifter components in mixed-voltage designs |
| Memory Interface Support | Hardened DDR2/DDR3 controller logic - reduces FPGA resource usage and simplifies timing-critical memory PHY design |
| Configuration Security | Bitstream encryption via AES-256 key - prevents reverse engineering and unauthorized cloning of programmed logic |
| Power Optimization | Multiple sleep modes and dynamic I/O power gating - lowers active power by up to 40% versus previous Spartan generations |
Applications
| Industrial Machine Vision | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Real-time image preprocessing and multi-camera synchronization in factory-floor inspection systems. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering, edge detection, and frame buffering; DCMs align camera sensor clocks and display refresh timing. Use Value: Enables sub-millisecond latency for closed-loop feedback while supporting 4× MIPI CSI-2 lanes via I/O bank reconfiguration. | Use Scenario: Deterministic I/O scanning and motion control sequencing in modular automation cabinets. IC Role / Device Role / Timing Role: Configurable logic implements ladder logic execution, safety interlock monitoring, and EtherCAT slave protocol handling. Use Value: Delivers 50 µs cycle time consistency across 64 digital I/O channels with guaranteed worst-case timing analysis. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: High-integrity data aggregation from ultrasound transducer arrays and analog front-end ADCs. IC Role / Device Role / Timing Role: FPGA manages time-interleaved sampling, channel calibration correction, and PCIe Gen2 x4 host interface bridging. Use Value: Achieves <10 ns channel-to-channel skew and supports 12-bit @ 80 MSPS per channel with on-die calibration logic. | Use Scenario: ARINC 429 and MIL-STD-1553B bus consolidation in flight control subsystems. IC Role / Device Role / Timing Role: Implements dual-redundant protocol engines, CRC validation, and deterministic packet scheduling with hardware timestamping. Use Value: Meets DO-254 Level A certification requirements with traceable RTL and built-in self-test (BIST) coverage >92%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG484C | 484-pin FBGA, 32 fewer I/O pins, identical logic/DSP/BRAM resources | Suitable for space-constrained designs with reduced peripheral count | Choose when board layout density is critical and I/O count ≤ 448 suffices |
| XC7S15-2FTGB196C | Artix-7 family, higher performance per watt, no DCM (only PLL), 196-pin FTGB package | Better suited for new designs targeting lower static power and PCIe Gen2 endpoint integration | Prefer for greenfield projects requiring long-term roadmap support beyond Spartan-6 end-of-life |
Compared with XC6SLX150-3FGG484C, the XC6SLX150-N3FGG676C offers 32 additional I/Os and larger thermal margin; versus XC7S15-2FTGB196C, it provides mature toolchain stability and legacy IP compatibility but lacks native transceivers and advanced power gating.
Availability
XC6SLX150-N3FGG676C is available at Aetrix Electronics and suitable for industrial machine vision, programmable logic controllers, and medical imaging interface applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX150-N3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O count, and power efficiency - especially in industrial automation and embedded vision.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150-N3FGG676C?
The XC6SLX150-N3FGG676C supports I/O bank voltages from 1.2 V to 3.3 V, configurable per bank. Each of its 16 I/O banks can be independently set to LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, SSTL18_I, SSTL18_II, SSTL2_I, SSTL2_II, HSTL_I, HSTL_II, or differential standards including LVDS and RSDS. This allows direct interfacing with diverse peripherals without level shifters.
Does XC6SLX150-N3FGG676C support DDR3 memory interfaces?
Yes, the XC6SLX150-N3FGG676C includes hardened logic for DDR2 and DDR3 SDRAM interfaces, supporting data rates up to 800 Mbps per pin. It provides dedicated write leveling, read leveling, and gate training circuitry, enabling reliable 32-bit or 64-bit memory subsystems with minimal FPGA resource overhead and verified timing closure in Xilinx ISE 14.7.
What configuration modes are supported by XC6SLX150-N3FGG676C?
The XC6SLX150-N3FGG676C supports Master SPI, Slave Serial, and JTAG configuration modes. Master SPI uses an on-chip oscillator to drive external SPI PROM; Slave Serial allows microcontroller-initiated loading; JTAG enables boundary-scan testing and in-system programming. All modes are fully documented in UG380 v1.11 and validated across commercial temperature range.
Is XC6SLX150-N3FGG676C pin-compatible with other Spartan-6 devices?
No, XC6SLX150-N3FGG676C is not pin-compatible with other Spartan-6 devices due to its unique 676-ball FBGA footprint. While logic resources and features align with the XC6SLX150 family, mechanical and electrical pin mapping differs from 484-pin or 225-pin variants. PCB redesign is required when migrating between package options.
What is the purpose of the INIT_B and DONE pins on XC6SLX150-N3FGG676C?
INIT_B signals configuration status - driven low during bitstream loading and released high upon successful CRC check. DONE indicates configuration completion - pulled high externally after INIT_B rises and all startup sequences finish. Both are open-drain outputs requiring external pull-ups and are essential for system-level boot sequencing and failure diagnostics in the XC6SLX150-N3FGG676C.
XC6SLX150-N3FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150-N3FGG676C FAQ
1.How can I place an order for XC6SLX150-N3FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-N3FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-N3FGG676C reliable?
The price and inventory of XC6SLX150-N3FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-N3FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX150-N3FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-N3FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-N3FGG676C?
XC6SLX150-N3FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-N3FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-N3FGG676C?
For technical support, including XC6SLX150-N3FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-N3FGG676C requirements.
6.How does Aetrix verify that XC6SLX150-N3FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-N3FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-N3FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX150-N3FGG676C?
All XC6SLX150-N3FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-N3FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-N3FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX150-N3FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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