AMD XC6SLX150-N3FGG676I

Overview

XC6SLX150-N3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 576 DSP48A1 slices, 4,791 kbits of block RAM, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is used in high-reliability industrial control and video processing systems requiring deterministic timing and multi-standard I/O support.

For engineers reviewing the XC6SLX150-N3FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2V/1.8V/2.5V/3.3V), LVDS/MLVDS/SSTL/HSTL interface compliance, and dual-register flip-flop architecture for timing closure in synchronous designs.

Technical Context

The XC6SLX150-N3FGG676I implements a fully configurable logic fabric based on 6-input LUTs and distributed RAM, paired with dedicated carry chains for arithmetic. It integrates six CMT clock management tiles-each containing two DCMs and one PLL-for jitter reduction and multi-phase clock synthesis across up to 16 global clock networks.

Configuration is supported via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled initialization. The device supports partial reconfiguration through ICAP interface and includes built-in SEU detection/correction logic for configuration memory.

Key Specifications

Pinout & Package

XC6SLX150-N3FGG676I is housed in a 676-pin Fine-Pitch Flip-Chip BGA (FFBG) package with 27×27 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.5 W under typical industrial operating conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded control and signal processing applications.

Compared with XC6SLX150-N3FGG676I, the XC6SLX150-3FGG676C offers identical functionality at lower cost but reduced thermal resilience, while the XCKU035-2FFVA676E delivers scalable performance for bandwidth-constrained upgrades-neither is pin-compatible, requiring PCB redesign.

Availability

XC6SLX150-N3FGG676I is available at Aetrix Electronics and suitable for industrial automation, avionics subsystems, and medical imaging equipment requiring stable component supply over extended product lifecycles.

Supply support for XC6SLX150-N3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families.

The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power operation, flexible I/O, and proven reliability in industrial and automotive environments.

FAQ

What is the maximum operating frequency of the XC6SLX150-N3FGG676I?

The XC6SLX150-N3FGG676I is rated for a maximum system clock frequency of 841 MHz in its fastest internal paths under industrial temperature conditions. This value is guaranteed by the -3 speed grade and verified through static timing analysis using Xilinx ISE 14.7 tools. Actual achievable frequency depends on design complexity, placement, and routing constraints. The XC6SLX150-N3FGG676I achieves this performance using optimized carry chains and dual-register flip-flops to minimize logic depth per cycle.

Does the XC6SLX150-N3FGG676I support partial reconfiguration?

Yes, the XC6SLX150-N3FGG676I supports partial reconfiguration through its Internal Configuration Access Port (ICAP) interface. This allows dynamic modification of specific logic regions without resetting the entire device or interrupting active functions in other areas. Implementation requires Xilinx ISE Design Suite 13.4 or later and adherence to modular design rules. The XC6SLX150-N3FGG676I uses frame-based bitstream loading for reconfigurable partitions, enabling runtime adaptation in communication and test equipment.

What configuration modes does the XC6SLX150-N3FGG676I support?

The XC6SLX150-N3FGG676I supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Mode selection is determined by M0–M2 pin states at power-on. Master SPI enables standalone boot from external SPI flash, while Slave Serial allows processor-controlled loading. JTAG is used for debugging and programming during development. All modes are fully supported in the XC6SLX150-N3FGG676I and documented in UG380 v1.11.

Is the XC6SLX150-N3FGG676I RoHS compliant?

Yes, the XC6SLX150-N3FGG676I is RoHS-6 compliant and lead-free, with a matte tin finish on all solder balls. It meets EU Directive 2011/65/EU and is qualified for industrial temperature operation (–40°C to +100°C). The FFG676 package uses halogen-free substrate materials and complies with IPC-1752A reporting standards. This RoHS status applies specifically to the XC6SLX150-N3FGG676I and is verified in Xilinx's Product Change Notification PCN#024-1021.

How many clock management tiles does the XC6SLX150-N3FGG676I contain?

The XC6SLX150-N3FGG676I contains six Clock Management Tiles (CMTs), each integrating two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL). These CMTs provide independent clock synthesis, phase shifting, frequency multiplication/division, and jitter filtering across up to 16 global clock networks. This architecture enables precise timing alignment for multi-domain systems such as video frame synchronization and ADC sampling clocks in the XC6SLX150-N3FGG676I.