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AMD XC6SLX150-N3FGG900I
- Part No.:
- XC6SLX150-N3FGG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150-N3FGG900I.pdf
- Description:
- IC FPGA 576 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,000
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Product details
Overview
XC6SLX150-N3FGG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 4,032 Kbits of block RAM, and 320 DSP48E1 slices. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and uses a 900-pin Fine-Pitch BGA (FGG900) package. It is deployed in industrial motor control systems requiring deterministic timing and real-time I/O processing.
For engineers reviewing the XC6SLX150-N3FGG900I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count (516 user I/Os), LVDS support, embedded memory depth, and industrial-grade thermal performance.
Technical Context
The XC6SLX150-N3FGG900I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates six CMT clock management tiles-each containing two DCMs and one PLL-for multi-domain clock synthesis and phase alignment.
I/O banks support SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling (LVDS, BLVDS, RSDS) across 12 banks. Configuration is performed via Master SPI, Slave Serial, or JTAG, with support for dual-boot and fallback modes using external flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic density for custom state machines or protocol engines |
| Block RAM | 4,032 Kbits - supports dual-port FIFOs, frame buffers, or lookup tables up to 36 Kb per block |
| DSP Slices | 320 × DSP48E1 - enables 25×18 signed multiplication with pre-adder and pipeline registers |
| User I/O Pins | 516 - provides high-density interface capability for parallel buses, sensor arrays, or display controllers |
| Speed Grade | -3 - guarantees timing closure at 667 MHz DDR3 data rate and 375 MHz system clock in worst-case industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| Package | 900-pin FGG900 - 31×31 mm fine-pitch BGA with 1.0 mm ball pitch and thermal pad for PCB-level heat dissipation |
Pinout & Package
The XC6SLX150-N3FGG900I is housed in a 900-ball Fine-Pitch BGA (FGG900) package with 1.0 mm ball pitch, thermal pad, and 12 I/O banks arranged across four sides. Pin functions are bank- and voltage-referenced, requiring strict VCCO and VREF assignment per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_IO / INIT_B | Active-low configuration initialization signal; must be pulled high during power-up to enable normal startup |
| H2 | PROGRAM_B | Active-low asynchronous reset for configuration logic; toggling reloads bitstream from master SPI flash |
| K1 | CCLK | Configuration clock input; driven by FPGA during slave serial mode or by external source in master mode |
| M1 | DONE | Open-drain status output indicating successful configuration completion; requires external pull-up |
| P1 | VCCO_0 | Bank 0 I/O supply; sets voltage level (1.2–3.3 V) for all pins in Bank 0 |
| R1 | VREF_0 | Reference voltage for differential or SSTL/HSTL inputs in Bank 0; must match VCCO_0 within ±2% |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Hard-wired DDR2/DDR3 controller supporting 800 Mbps data rates with calibration and write leveling |
| PCI Express Endpoint | Gen1 x1 hard IP block compliant with PCIe Base 1.1; no soft-core resource consumption |
| Embedded Clock Management | Six CMTs each with dual DCMs + single PLL for jitter filtering, frequency synthesis, and phase shifting |
| Low-Power Architecture | Multi-voltage I/O banks and partial reconfiguration support reduce dynamic power by up to 40% vs. Virtex-5 |
| Configuration Security | Bitstream encryption via AES-256 and HMAC authentication prevent unauthorized programming or cloning |
Applications
| Industrial Motor Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time closed-loop servo control with synchronized PWM generation and encoder feedback sampling. IC Role / Device Role / Timing Role: FPGA fabric executes PID loops, generates 6-channel center-aligned PWM at 20 kHz, and times quadrature decoding with <5 ns jitter. Use Value: Deterministic latency and 516 I/Os allow integration of analog front-end, isolation, and fieldbus interfaces on a single device. | Use Scenario: High-speed digital pattern generation and response capture for IC functional validation. IC Role / Device Role / Timing Role: XC6SLX150-N3FGG900I acts as a programmable vector engine with precise 100 MHz clock domain alignment across 256 test channels. Use Value: 320 DSP48E1 slices accelerate pass/fail decision logic; block RAM stores 128K test vectors with dual-port access. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of multi-sensor ultrasound echo data before transmission to host processor. IC Role / Device Role / Timing Role: Configurable I/O banks interface directly with ADCs (LVDS) and image processors (DDR3); fabric performs real-time beamforming coefficient application. Use Value: 4,032 Kbits of block RAM buffer full-frame echo streams; -3 speed grade ensures sub-200 ns timing margin for 160 MHz pixel clocks. | Use Scenario: ARINC 429 and MIL-STD-1553B bus bridging with time-stamped message routing in flight control subsystems. IC Role / Device Role / Timing Role: XC6SLX150-N3FGG900I implements dual-bus controllers with hardware timestamping and priority-based arbitration logic. Use Value: Industrial temperature rating and configuration encryption meet DO-254 Level A design assurance requirements for airborne hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG900C | Commercial temperature range (0°C to +85°C); identical logic resources, I/O count, and speed grade | Not qualified for extended industrial or avionics thermal environments | Select only if operating ambient stays within 0–85°C and no configuration security or dual-boot is required |
| XCKU035-2FFVA676I | Kintex UltraScale architecture; 242K logic cells, 18.8 Mb BRAM, -2 speed grade, 676-pin FCBGA | Supports PCI Express Gen3, DDR4, and transceivers up to 12.5 Gbps-beyond Spartan-6 capability | Choose when migrating to higher bandwidth, lower power per function, or future-proofing for 10+ year product lifecycles |
Compared with XC6SLX150-N3FGG900I, the XC6SLX150-3FGG900C lacks industrial qualification but offers identical functionality at lower cost, while the XCKU035-2FFVA676I delivers architectural scalability at higher complexity and power efficiency-requiring PCB redesign and toolchain migration.
Availability
XC6SLX150-N3FGG900I is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX150-N3FGG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic, integrated memory controllers, and industrial reliability-targeting embedded vision, industrial automation, and communications infrastructure.
FAQ
What is the maximum supported DDR3 data rate for XC6SLX150-N3FGG900I?
The XC6SLX150-N3FGG900I supports DDR3 memory interfaces up to 800 Mbps data rate using its hard memory controller. This is validated under industrial temperature conditions with the -3 speed grade and requires proper board-level termination and layout adherence to Xilinx UG388 guidelines. The XC6SLX150-N3FGG900I achieves this using calibrated write leveling and read-leveling circuitry embedded in the MIG IP core.
Does XC6SLX150-N3FGG900I support partial reconfiguration?
Yes, XC6SLX150-N3FGG900I supports partial reconfiguration through the ICAP (Internal Configuration Access Port) and FRAME_ECC primitives. This allows dynamic swapping of logic modules without resetting the entire device. The XC6SLX150-N3FGG900I requires use of Xilinx ISE Design Suite 14.7 or later with appropriate license and constraints files defining reconfigurable partitions.
What configuration modes are supported by XC6SLX150-N3FGG900I?
XC6SLX150-N3FGG900I supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. It also enables dual-boot capability using external SPI flash with fallback to secondary bitstream upon CRC error. The XC6SLX150-N3FGG900I requires correct MODE pin strapping (M1:M0) and proper power sequencing per DS162 specification.
Is XC6SLX150-N3FGG900I RoHS compliant and lead-free?
Yes, XC6SLX150-N3FGG900I is RoHS-compliant and lead-free, meeting EU Directive 2011/65/EU and JEDEC J-STD-609A Class 3 marking requirements. The FGG900 package uses matte tin finish on solder balls and halogen-free molding compound. The XC6SLX150-N3FGG900I part marking includes "N3" suffix indicating industrial-grade, lead-free, and RoHS-conforming build.
Can XC6SLX150-N3FGG900I implement a PCI Express endpoint without external logic?
Yes, XC6SLX150-N3FGG900I contains a hard PCIe Gen1 x1 endpoint block compliant with PCI Express Base Specification 1.1. It handles link training, transaction layer packet (TLP) generation, and error reporting without consuming LUT resources. The XC6SLX150-N3FGG900I requires use of Xilinx's PCIe LogiCORE IP and proper reference clock routing per UG380.
XC6SLX150-N3FGG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 576
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150-N3FGG900I FAQ
1.How can I place an order for XC6SLX150-N3FGG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150-N3FGG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150-N3FGG900I reliable?
The price and inventory of XC6SLX150-N3FGG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150-N3FGG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX150-N3FGG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150-N3FGG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150-N3FGG900I?
XC6SLX150-N3FGG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150-N3FGG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150-N3FGG900I?
For technical support, including XC6SLX150-N3FGG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150-N3FGG900I requirements.
6.How does Aetrix verify that XC6SLX150-N3FGG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150-N3FGG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150-N3FGG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX150-N3FGG900I?
All XC6SLX150-N3FGG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150-N3FGG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150-N3FGG900I part is unused and in its original packaging.
Return procedure for XC6SLX150-N3FGG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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