My Inquiry
My Account
AMD XC6SLX150T-2FG676C
- Part No.:
- XC6SLX150T-2FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150T-2FG676C.pdf
- Description:
- IC FPGA 396 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,027
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX150T-2FG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18-bit x 36Kb block RAM, 576 DSP48A1 slices, and operates at -2 speed grade with I/O support up to 1.25 Gbps. It is used in industrial video processing and reconfigurable I/O bridging applications.
For engineers reviewing the XC6SLX150T-2FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, embedded memory depth, DSP slice count, I/O voltage flexibility (1.2V/1.8V/2.5V/3.3V), and thermal performance in compact PCB layouts.
Technical Context
The XC6SLX150T-2FG676C implements a fully configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates SelectIO technology supporting single-ended and differential standards including LVCMOS, LVDS, and TMDS.
Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces; internal configuration memory supports fallback and multi-boot. The device includes clock management using DCMs (Digital Clock Managers) with phase shifting, frequency synthesis, and duty cycle correction across six independent clock networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total available LUT+FF pairs for combinational and sequential logic implementation |
| Block RAM | 3,096 kbits (18 × 36 Kb blocks) - supports dual-port FIFOs, data buffering, and local memory storage |
| DSP Slices | 576 × DSP48A1 - each performs 18×25-bit multiply-accumulate with pipeline registers |
| I/O Standards | LVCMOS, LVDS, TMDS, SSTL, HSTL - enables direct interface to FPD-Link, DDR2/3, HDMI, and parallel sensors |
| Speed Grade | -2 - guarantees timing closure at 595 MHz system clock (DCM output) and 333 MHz I/O toggle rate |
| Operating Temp | 0°C to 85°C - commercial temperature range suitable for enclosed industrial enclosures without forced cooling |
Pinout & Package
XC6SLX150T-2FG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 29 × 29 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad on underside requires exposed copper connection to PCB ground plane for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 10 µF near package |
| P4 | CLKIN_1 | Dedicated global clock input for DCM0 - accepts single-ended or differential (via IBUFDS) |
| T12 | M0 | Configuration mode select - low = Master SPI, high = JTAG or Slave Serial |
| V15 | PROGRAM_B | Active-low asynchronous reset for configuration logic - pulsed to reload bitstream |
| W18 | INIT_B | Open-drain status signal - goes high when configuration memory is ready for loading |
| Y16 | DONE | Open-drain completion indicator - pulled high externally after successful configuration |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Each of 12 I/O banks independently configurable for 1.2V/1.35V/1.5V/1.8V/2.5V/3.3V - enables mixed-voltage system interfacing without level shifters |
| Embedded Block RAM | 3,096 kbits distributed across 58 blocks - supports true dual-port operation with independent read/write clocks per block |
| DSP48A1 Slices | 576 slices with pre-adder, multiplier, ALU, and accumulator - enables real-time FIR filtering and motor control loop computation |
| Digital Clock Manager (DCM) | Six DCMs with jitter < ±150 ps - provides deterministic clock deskew and phase alignment across multiple I/O banks |
| Configuration Security | Bitstream encryption via AES-128 key stored in on-chip eFUSE - prevents reverse engineering of programmed logic |
Applications
| Industrial Machine Vision | HDMI Video Bridge |
|---|---|
Use Scenario: Real-time pixel preprocessing and ROI extraction in smart cameras with GigE Vision interface. IC Role / Device Role / Timing Role: Configurable logic fabric processes Bayer demosaicing and edge detection; DCM aligns image sensor clock with Ethernet MAC timing. Use Value: Enables sub-100 µs latency path from sensor to frame buffer using embedded BRAM as line buffers and DSP slices for convolution kernels. | Use Scenario: Converting parallel RGB/YUV video from FPGA-based video processors to HDMI 1.3a serial output. IC Role / Device Role / Timing Role: Implements TMDS encoder, HDCP authentication state machine, and audio packet insertion logic. Use Value: Eliminates external serializer ICs by integrating full HDMI PHY interface with programmable timing alignment for 720p60 and 1080p30 formats. |
| Programmable I/O Hub | Motor Control Interface |
Use Scenario: Aggregating and protocol-translating signals between CAN FD, RS-485, and SPI peripherals in PLC backplanes. IC Role / Device Role / Timing Role: Acts as glue logic and protocol converter; uses SelectIO for voltage-level translation and timing isolation between domains. Use Value: Reduces BOM count by replacing discrete bus switches and level translators while maintaining 25 ns inter-bank skew control. | Use Scenario: Closed-loop field-oriented control (FOC) for 3-phase PMSM drives with current sensing and PWM generation. IC Role / Device Role / Timing Role: Generates synchronized 20 kHz three-phase PWM with dead-time insertion; DSP slices compute Clarke/Park transforms in real time. Use Value: Achieves 1.2 µs worst-case interrupt latency from ADC sample to PWM update, meeting IEC 61800-5-1 functional safety timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FG676C | No transceiver capability; identical logic resources and I/O count but lacks GTX transceivers | Suitable only for non-serial-link applications such as parallel bus bridging or local processing | Select when serial connectivity (e.g., PCIe, SATA) is not required and cost reduction is prioritized |
| XC7A100T-2CSG324C | Artix-7 architecture with higher logic density (101,440 LUTs), 2.5x more DSP slices, and integrated PCIe Gen2 endpoint | Better suited for high-throughput data acquisition and embedded vision with AXI4 streaming interfaces | Choose when migrating to 28 nm process benefits, requiring lower static power or native PCIe integration |
Compared with XC6SLX150T-2FG676C, the XC6SLX150-2FG676C reduces cost by omitting transceivers while retaining identical I/O and logic capacity, whereas the XC7A100T-2CSG324C delivers architectural upgrades including hardened PCIe and improved DSP throughput at higher gate density and lower dynamic power.
Availability
XC6SLX150T-2FG676C is available at Aetrix Electronics and suitable for industrial automation, video infrastructure, and embedded control systems requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX150T-2FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its portfolio in programmable logic and heterogeneous acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial and video markets.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-2FG676C?
The XC6SLX150T-2FG676C supports I/O voltages from 1.2 V to 3.3 V across its 12 independently powered I/O banks. Each bank can be set to a different VCCO level, enabling direct interfacing with mixed-voltage peripherals such as DDR2 memory (1.8 V), microcontrollers (3.3 V), and low-voltage sensors (1.2 V) without external level shifters. This capability is confirmed in the Spartan-6 FPGA SelectIO Resources User Guide (UG381 v1.12).
Does XC6SLX150T-2FG676C include built-in transceivers?
Yes, the XC6SLX150T-2FG676C includes four GTX transceivers capable of 2.5–3.2 Gbps operation, supporting protocols including PCI Express Gen1, SATA, and Serial RapidIO. These transceivers are not present in the non-T variant (XC6SLX150-2FG676C). The GTX blocks integrate CDR circuitry, 8B/10B encoding, and elastic buffers - all documented in the Spartan-6 FPGA Transceivers User Guide (UG375 v1.9).
What configuration modes does XC6SLX150T-2FG676C support?
The XC6SLX150T-2FG676C supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Mode selection is controlled by M2:M0 pins at power-up. Master SPI is most common for standalone boot from SPI flash; JTAG is used for debugging and programming during development. Configuration bitstream integrity is verified via CRC check, and fallback mode allows automatic reload from secondary flash if primary fails.
How many Digital Clock Managers (DCMs) are available in XC6SLX150T-2FG676C?
The XC6SLX150T-2FG676C contains six Digital Clock Managers (DCMs), each providing independent clock synthesis, phase shifting, frequency multiplication/division, and duty cycle correction. These DCMs drive global clock networks with sub-150 ps jitter and support simultaneous operation across multiple clock domains - critical for video timing alignment and synchronous data capture in applications using the XC6SLX150T-2FG676C.
Is XC6SLX150T-2FG676C qualified for extended temperature operation?
No, the XC6SLX150T-2FG676C is rated for commercial temperature range only (0°C to +85°C ambient). It is not offered in industrial (–40°C to +100°C) or automotive grades. For extended-temperature applications, designers should consider Spartan-6 LX/FXT variants with -3I or -3Q speed grades, or evaluate migration paths to Artix-7 or Kintex-7 families with broader thermal qualification.
XC6SLX150T-2FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150T-2FG676C FAQ
1.How can I place an order for XC6SLX150T-2FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-2FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-2FG676C reliable?
The price and inventory of XC6SLX150T-2FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-2FG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-2FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-2FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-2FG676C?
XC6SLX150T-2FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-2FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-2FG676C?
For technical support, including XC6SLX150T-2FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-2FG676C requirements.
6.How does Aetrix verify that XC6SLX150T-2FG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-2FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-2FG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-2FG676C?
All XC6SLX150T-2FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-2FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-2FG676C part is unused and in its original packaging.
Return procedure for XC6SLX150T-2FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX150T-2FG676C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
