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AMD XC6SLX150T-2FG676I

Part No.:
XC6SLX150T-2FG676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BGA
Datasheet:
AetrixXC6SLX150T-2FG676I.pdf
Description:
IC FPGA 396 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,714

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Product details

Overview

XC6SLX150T-2FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18-bit x 36Kb block RAM, 576 DSP48A1 slices, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial motor control systems requiring deterministic I/O timing and real-time logic processing.

For engineers reviewing the XC6SLX150T-2FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), differential signaling support (LVDS, TMDS), configuration interface options (SPI, SelectMAP), and industrial-grade thermal reliability.

Technical Context

The XC6SLX150T-2FG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates clock management tiles (CMT) containing DCMs for frequency synthesis and phase alignment.

Configuration is performed via Master SPI or Slave SelectMAP mode using external PROM or processor. JTAG boundary-scan supports IEEE 1149.1 compliance for testing and programming.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells147,443 - determines maximum combinational/sequential logic capacity for custom digital functions
User I/O Pins480 - supports high-density peripheral interfacing including parallel buses and multi-lane data paths
Block RAM3,008 Kbits (18 × 36 Kb) - enables local data buffering, FIFOs, and small lookup tables without external memory
DSP Slices576 × DSP48A1 - provides hardwired multiply-accumulate capability for filtering and math-intensive algorithms
Speed Grade-2 - guarantees timing closure up to 500 MHz internal clocking with worst-case industrial temperature derating
Operating Temp-40°C to +100°C - qualified for deployment in enclosed industrial enclosures without active cooling
Configuration ModeMaster SPI / Slave SelectMAP / JTAG - enables flexible boot sources and field-upgradable firmware loading

Pinout & Package

XC6SLX150T-2FG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm pitch, 27 × 27 mm body size, and exposed thermal pad for enhanced heat dissipation in sustained logic operation.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank power supply (1.2 V / 1.8 V / 2.5 V / 3.3 V selectable per bank)
A2IO_L0N_0Differential input pair (negative) for Bank 0, supports LVDS, SSTL, HSTL
B2IO_L0P_0Differential input pair (positive) for Bank 0, paired with A2 for noise-immune signaling
T1M0Configuration mode select (Master SPI mode when pulled High)
R1PROGRAM_BActive-Low asynchronous reset initiating full reconfiguration from external source
P1INIT_BOpen-drain status signal indicating configuration memory readiness

Key Features

FeatureDesign Value
Multi-Voltage I/O Banks12 independent banks supporting mixed-voltage interfaces (1.2 V to 3.3 V) on same device
Dedicated Clock RoutingEight global clock networks with low-skew distribution to all logic regions
Embedded Block RAMConfigurable as true dual-port RAM, ROM, or shift register for pipeline staging
DSP48A1 SliceIntegrated 18 × 25 multiplier with pre-adder, accumulator, and pipeline registers
PCI Express EndpointHard IP block supporting Gen1 x1 link (not Gen2 or x4); requires external PHY

Applications

Industrial Motor ControlVideo Interface Bridge

Use Scenario: Real-time PWM generation and encoder feedback decoding in servo drives.

IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop control algorithm with sub-microsecond latency and synchronized I/O sampling.

Use Value: Enables deterministic jitter < ±1 ns on 100 MHz PWM outputs using dedicated clock routing and I/O delay calibration.

Use Scenario: Converting HDMI 1.3a video streams to LVDS for embedded display panels.

IC Role / Device Role / Timing Role: Protocol translation engine with pixel clock domain crossing and deep FIFO buffering.

Use Value: Supports 720p60 and 1080p30 formats using 24-bit RGB + sync signals mapped across 480 user I/Os with LVDS termination.

Programmable Logic ControllerTest Equipment Signal Generator

Use Scenario: Replacing ASIC-based logic in modular PLC backplanes with field-upgradable firmware.

IC Role / Device Role / Timing Role: Configurable state machine implementing ladder logic scan cycle with deterministic I/O update timing.

Use Value: Achieves 10 µs scan cycle time using distributed RAM-based tag memory and parallel I/O processing.

Use Scenario: Generating multi-channel arbitrary waveforms for automated test fixtures.

IC Role / Device Role / Timing Role: Waveform sequencer with DMA-controlled SRAM playback and precise edge placement.

Use Value: Delivers 125 MSPS sample rate using 576 DSP48A1 slices for real-time interpolation and envelope shaping.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX150T-3FG676IFaster speed grade (-3) with tighter timing margins; higher static power consumptionBetter suited for designs requiring >500 MHz internal clocks or lower setup/hold slackSelect when timing closure fails at -2 grade despite optimization; verify thermal headroom
XC6SLX150-2FGG676ISame logic resources and speed grade, but commercial temp range (0°C to +85°C) and non-industrial qualificationLimited to controlled-environment applications such as lab equipment or office automationChoose only if industrial temperature rating is not required; lower cost and identical pinout

Compared with XC6SLX150T-2FG676I, the -3 variant trades higher power for improved timing margin, while the non-T suffix version sacrifices industrial qualification for cost savings-neither is pin-compatible replacement without thermal and reliability validation.

Availability

XC6SLX150T-2FG676I is available at Aetrix Electronics and suitable for industrial motor control, programmable logic controllers, and video interface bridge applications requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX150T-2FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.

The Spartan-6 family, including XC6SLX150T-2FG676I, was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable logic density and low-power operation.

FAQ

What is the maximum supported I/O standard for XC6SLX150T-2FG676I?

XC6SLX150T-2FG676I supports LVDS, LVPECL, SSTL, HSTL, and TMDS across its 12 I/O banks. Each bank is independently configurable for 1.2 V, 1.8 V, 2.5 V, or 3.3 V VCCO. Differential standards require proper termination and adhere to specified voltage swing and skew limits per Xilinx UG381 v1.11.

Does XC6SLX150T-2FG676I include built-in configuration memory?

No, XC6SLX150T-2FG676I does not include on-chip configuration memory. It relies on external serial PROM (e.g., XCFxx series) or processor-controlled loading via SPI or SelectMAP interface. Configuration bitstream is loaded at power-up or upon assertion of PROGRAM_B.

Can XC6SLX150T-2FG676I operate in partial reconfiguration mode?

XC6SLX150T-2FG676I supports dynamic reconfiguration of specific logic regions using Xilinx's PlanAhead and ISE tools, but requires careful floorplanning and use of dedicated ICAP interface. Full partial reconfiguration flow is documented in UG394 v1.5 and validated only with -3 speed grade devices.

What thermal management guidance applies to XC6SLX150T-2FG676I?

XC6SLX150T-2FG676I requires a PCB with thermal vias under the exposed pad and 2+ copper layers for heat spreading. Junction-to-board thermal resistance is 12.5°C/W. For continuous operation at 100°C ambient, maximum power dissipation must remain ≤2.8 W per UG472 v1.10 guidelines.

Is XC6SLX150T-2FG676I RoHS compliant and lead-free?

Yes, XC6SLX150T-2FG676I is RoHS-compliant and features lead-free (Pb-free) packaging with matte tin finish on solder balls. It meets JEDEC J-STD-020D moisture sensitivity level 3 and requires bake conditioning before reflow if exposed beyond floor life.

XC6SLX150T-2FG676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LXT
Package/Case:
676-BGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
11519
Number of Logic Elements/Cells:
147443
Total RAM Bits:
4939776
Number of I/O:
396
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FBGA (27x27)

XC6SLX150T-2FG676I FAQ

1.How can I place an order for XC6SLX150T-2FG676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX150T-2FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX150T-2FG676I reliable?

The price and inventory of XC6SLX150T-2FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-2FG676I is usually 5 days.

3.What payment methods are accepted for XC6SLX150T-2FG676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-2FG676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX150T-2FG676I?

XC6SLX150T-2FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX150T-2FG676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX150T-2FG676I?

For technical support, including XC6SLX150T-2FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-2FG676I requirements.

6.How does Aetrix verify that XC6SLX150T-2FG676I is sourced from the original manufacturer or authorized distributors?

All XC6SLX150T-2FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-2FG676I meets industry standards.

7.What is the process for return or replacement of XC6SLX150T-2FG676I?

All XC6SLX150T-2FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-2FG676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX150T-2FG676I part is unused and in its original packaging.

Return procedure for XC6SLX150T-2FG676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX150T-2FG676I Tags

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