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AMD XC6SLX150T-2FG900I
- Part No.:
- XC6SLX150T-2FG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150T-2FG900I.pdf
- Description:
- IC FPGA 540 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,610
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Product details
Overview
XC6SLX150T-2FG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 5,888 Kbits of block RAM, and 318 user I/Os in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and supports SelectIO™ standards up to 1.25 Gbps.
For engineers reviewing the XC6SLX150T-2FG900I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, embedded memory capacity, differential signaling support (LVDS, SSTL), and industrial-grade thermal performance.
Technical Context
The XC6SLX150T-2FG900I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, paired with 18×25 multipliers for DSP-intensive tasks. It integrates six CMT clock management tiles-each containing two DCMs and one PLL-for precise clock synthesis, phase alignment, and jitter reduction across multiple domains.
Configuration is supported via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled initialization. The device includes dedicated PCIe® Gen1 x1 endpoint hard IP, 24 transceivers capable of 3.2 Gbps operation, and integrated Ethernet MAC logic compatible with IEEE 802.3 CSMA/CD.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 5,888 Kbits - provides on-chip memory for FIFOs, buffers, lookup tables, and data caching without external SRAM |
| User I/Os | 318 - supports high-pin-count interface bridging, parallel bus expansion, and multi-standard signal routing |
| Speed Grade | -2 - guarantees timing closure at 667 MHz DDR3 SDRAM interface and 322 MHz system clock frequency |
| Operating Temp | -40°C to +100°C - enables deployment in industrial control cabinets, outdoor base stations, and motor drive enclosures |
| Transceiver Rate | 3.2 Gbps - allows native SATA, PCI Express Gen1, and Gigabit Ethernet PHY layer implementation |
| Config Interface | Master SPI / JTAG - enables field-upgradable bitstreams and boundary-scan testability per IEEE 1149.1 |
Pinout & Package
XC6SLX150T-2FG900I is housed in a 900-ball Fine-Pitch BGA (FG900) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and standard RoHS-compliant lead-free finish. Pin assignment follows Xilinx UG382 v1.11 and supports bank-wise voltage domain separation (1.2 V core, 1.8/2.5/3.3 V I/O).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 10 µF near the ball for signal integrity |
| K19 | CLKIN_1 | Dedicated single-ended clock input to CMT tile 1 - accepts 10–500 MHz CMOS/LVCMOS signals |
| R15 | IO_L1P_T0_0 | Differential pair positive terminal in Bank 0 - supports LVDS, TMDS, or RSDS with internal termination |
| T14 | IO_L1N_T0_0 | Differential pair negative terminal in Bank 0 - routed with matched length to R15 for <5 ps skew |
| E17 | M0 | Configuration mode select - tied HIGH to enable Master SPI boot from external serial flash |
| P16 | INIT_B | Open-drain status output - goes HIGH after configuration completes and CRC passes |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Endpoint | Hard IP supporting Gen1 x1 link with full enumeration, BAR mapping, and MSI interrupt handling |
| SelectIO Technology | Per-bank programmable I/O standards including LVDS, SSTL-18, HSTL-I, and MIPI D-PHY level support |
| DSP48A1 Slices | 180 dedicated arithmetic units - each delivers 18×25 signed multiplication with pre-adder and pipeline register |
| Embedded Memory | 18 Kb block RAM primitives configurable as dual-port RAM, ROM, or shift register with byte-write enable |
| Clock Management | Six CMTs with independent DCM+PLL combinations - enables simultaneous 100 MHz system clock and 125 MHz Ethernet MAC clock |
Applications
| Industrial Motor Control | Video Processing Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo control with encoder feedback, PWM generation, and safety monitoring in PLC-based drives. IC Role / Device Role / Timing Role: FPGA fabric executes PID algorithms, generates synchronized 20 kHz three-phase PWM, and validates functional safety per IEC 61508 SIL-2. Use Value: 318 I/Os route encoder A/B/Z, analog inputs, and isolated gate drivers; -2 speed grade ensures deterministic 250 ns loop latency. | Use Scenario: Converting HDMI 1.4a video streams to MIPI CSI-2 for image sensor interfacing in machine vision cameras. IC Role / Device Role / Timing Role: Implements pixel clock domain crossing, color space conversion (RGB→YUV), and packetized CSI-2 protocol framing. Use Value: Embedded DSP48A1 slices accelerate 3×3 matrix operations; LVDS I/Os handle 160 MHz pixel clocks with sub-cycle skew control. |
| Base Station Radio Front-End | Avionics Data Concentrator |
Use Scenario: Digital predistortion (DPD) and crest factor reduction (CFR) processing for LTE 20 MHz bandwidth RF transceivers. IC Role / Device Role / Timing Role: Configurable logic processes real-time IQ samples; transceivers interface with ADC/DAC at 125 MSPS via JESD204B-compatible lanes. Use Value: 3.2 Gbps transceivers support JESD204B subclass 0; 5,888 Kbits block RAM buffers 128-sample DPD coefficient tables. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553B, and discrete I/O signals into a unified Ethernet/IP backbone for flight control systems. IC Role / Device Role / Timing Role: Implements protocol translation engines, time-stamped message queuing, and deterministic 100 µs latency arbitration. Use Value: Industrial temp rating ensures operation in unpressurized avionics bays; 147K logic cells host four concurrent protocol state machines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FG900I | Faster -3 speed grade; higher static power; identical pinout and logic resources | Better suited for designs requiring >700 MHz DDR3 interfaces or tighter setup/hold margins | Select when timing closure fails at -2 grade but PCB layout and firmware remain unchanged |
| XCVU9P-2FLGA2104I | UltraScale architecture; 2588K logic cells; 48.5 Mb BRAM; 64 GTY transceivers @ 32.75 Gbps | Targets 5G NR baseband, AI inference acceleration, and high-throughput packet processing | Choose for scalability beyond Spartan-6 limits; requires new PCB, toolchain, and verification effort |
Compared with XC6SLX150T-2FG900I, the -3 variant offers marginally improved timing performance without layout changes, while the XCVU9P represents a generational upgrade with orders-of-magnitude higher bandwidth and logic density-requiring full redesign but enabling next-generation signal processing workloads.
Availability
XC6SLX150T-2FG900I is available at Aetrix Electronics and suitable for industrial motor control, video processing bridges, base station radio front-ends, and avionics data concentrators requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX150T-2FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, moderate logic density, and industrial temperature operation-targeting industrial automation, broadcast video, and communications infrastructure.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6SLX150T-2FG900I?
The XC6SLX150T-2FG900I supports DDR3 SDRAM interfaces up to 667 MHz data rate (333 MHz clock) under -2 speed grade conditions. This is validated per Xilinx UG388 and requires proper board-level termination, controlled impedance routing, and matching trace lengths. The XC6SLX150T-2FG900I includes dedicated DDR3 PHY logic and calibration circuitry to meet JEDEC timing specifications across industrial temperature ranges.
Does XC6SLX150T-2FG900I include built-in PCIe endpoint functionality?
Yes, the XC6SLX150T-2FG900I integrates a hard PCIe Gen1 x1 endpoint block compliant with PCI Express Base Specification 1.1. It handles link training, transaction layer packet (TLP) generation, configuration space access, and MSI interrupt delivery without consuming programmable logic resources. The XC6SLX150T-2FG900I requires external 100 MHz reference clock and proper PCIe AC-coupling capacitors per Xilinx UG384.
What configuration modes does XC6SLX150T-2FG900I support?
The XC6SLX150T-2FG900I supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Master SPI is most common for standalone operation using external SPI flash; JTAG is used for programming and debugging during development. All modes are selected via M[2:0] pins at power-up, and the XC6SLX150T-2FG900I includes internal pull-ups/pull-downs to default to Master SPI if pins are unconnected.
Can XC6SLX150T-2FG900I operate in extended temperature environments?
Yes, the XC6SLX150T-2FG900I is rated for industrial temperature operation from -40°C to +100°C ambient. Its thermal design supports continuous operation at full speed grade under natural convection in enclosures with ≤40°C case temperature rise. The XC6SLX150T-2FG900I uses a thermally enhanced FG900 package with exposed thermal pad and meets IPC/JEDEC J-STD-020 moisture sensitivity level 3.
How many transceivers does XC6SLX150T-2FG900I include and what protocols do they support?
The XC6SLX150T-2FG900I includes 24 GTX transceivers, each capable of 625 Mbps to 3.2 Gbps operation. They support SATA I/II, PCI Express Gen1, CPRI, and Gigabit Ethernet protocols through dedicated physical coding sublayer (PCS) logic. The XC6SLX150T-2FG900I transceivers require external 100 MHz reference clocks and comply with ANSI T11 FC-PI-4 for Fibre Channel compatibility.
XC6SLX150T-2FG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150T-2FG900I FAQ
1.How can I place an order for XC6SLX150T-2FG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-2FG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-2FG900I reliable?
The price and inventory of XC6SLX150T-2FG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-2FG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-2FG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-2FG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-2FG900I?
XC6SLX150T-2FG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-2FG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-2FG900I?
For technical support, including XC6SLX150T-2FG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-2FG900I requirements.
6.How does Aetrix verify that XC6SLX150T-2FG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-2FG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-2FG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-2FG900I?
All XC6SLX150T-2FG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-2FG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-2FG900I part is unused and in its original packaging.
Return procedure for XC6SLX150T-2FG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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