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AMD XC6SLX150T-2FGG484C

Part No.:
XC6SLX150T-2FGG484C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC6SLX150T-2FGG484C.pdf
Description:
IC FPGA 296 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,251

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Product details

Overview

XC6SLX150T-2FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18 Kbit block RAM, and 220 DSP48E1 slices. It operates at -2 speed grade with 1.2 V core voltage and supports LVDS, SSTL, HSTL I/O standards. Used in industrial vision systems for real-time image preprocessing.

For engineers reviewing the XC6SLX150T-2FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O bank configuration, thermal performance in sealed enclosures, and compatibility with Xilinx ISE 14.7 design flow.

Technical Context

The XC6SLX150T-2FGG484C implements a fully configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates dual-clock DDR memory controllers supporting up to 800 Mbps data rates and includes 24 multi-gigabit transceivers capable of 3.2 Gbps operation.

Configuration is performed via Master SPI or JTAG, with support for fallback and dual-boot modes. The device uses SelectIO technology with programmable drive strength, slew rate, and on-die termination across 12 I/O banks, each independently powered.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells147,443 - determines maximum combinational/sequential logic capacity for custom digital functions
Block RAM2,192 × 18 Kbit - provides on-chip memory for FIFOs, frame buffers, or lookup tables without external SRAM
DSP Slices220 × DSP48E1 - enables fixed-point multiply-accumulate operations at up to 250 MHz clock rate
I/O Pins348 user I/O - supports mixed-voltage interfaces across 12 configurable banks with independent VCCO
Transceivers24 × 3.2 Gbps - delivers serial connectivity for Camera Link, CPRI, or JESD204B links
Speed Grade-2 - guarantees timing closure at 667 MHz system clock with worst-case junction temperature of 85°C

Pinout & Package

XC6SLX150T-2FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array, 1.0 mm ball pitch, and 19.2 mm × 19.2 mm body size. Thermal pad on underside requires solder paste stencil opening per Xilinx UG381.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives internal configuration shift register during Master SPI mode; must be driven externally at ≤50 MHz
DINConfiguration Data InSerial input for bitstream loading in Master SPI mode; tied high when unused
PROGRAM_BGlobal ResetActive-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence
INIT_BConfiguration StatusOpen-drain output indicating configuration completion or error; pulled high externally
M0–M2Mode SelectThree-pin bus selecting configuration mode (JTAG, Master SPI, Slave Serial, etc.) at power-up

Key Features

FeatureDesign Value
Integrated PCI Express® EndpointGen1 x1 interface with hard IP block enabling direct host CPU communication without soft-core overhead
Embedded Memory ControllerHard DDR2/DDR3 controller supporting 16-bit/32-bit data width and 400–800 Mbps rates with calibration logic
SelectIO TechnologyPer-pin I/O standard assignment (LVCMOS, SSTL, HSTL) with programmable termination and drive strength
Multi-Boot SupportTwo independent bitstreams stored in external SPI flash; selected via GPIO or watchdog timeout for field updates

Applications

Industrial Machine VisionAutomated Test Equipment

Use Scenario: Real-time Bayer demosaicing and edge detection on 1080p@60fps camera streams.

IC Role / Device Role / Timing Role: Configurable logic fabric processes pixel pipelines; embedded DDR controller buffers frames.

Use Value: Eliminates need for external frame grabber ASIC while maintaining sub-millisecond latency.

Use Scenario: High-speed digital pattern generation and response analysis for semiconductor wafer testing.

IC Role / Device Role / Timing Role: Generates synchronized stimulus waveforms using distributed LUT-based sequencers and captures responses via high-speed I/O banks.

Use Value: Enables 200+ MHz vector rates with deterministic timing control across 256 parallel test channels.

Medical Imaging InterfaceAvionics Data Concentrator

Use Scenario: Aggregation and protocol translation between ultrasound probe front-end ADCs and PCIe host interface.

IC Role / Device Role / Timing Role: Bridges JESD204B serial links from ADCs to PCIe endpoint; handles lane alignment and framing.

Use Value: Reduces BOM count by integrating SerDes, packetizer, and PCIe root complex into single die.

Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals onto a single Ethernet backbone in flight control systems.

IC Role / Device Role / Timing Role: Implements time-triggered scheduling engine with hardware timestamping for deterministic message routing.

Use Value: Meets DO-254 DAL A timing requirements with <1 μs jitter on critical bus arbitration cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX150T-3FGG484CFaster -3 speed grade with 15% higher timing margin; same package and pinoutSuitable for designs requiring >700 MHz system clocks or tighter setup/hold windowsSelect when targeting worst-case timing closure at elevated junction temperatures (>85°C)
XC7A100T-2CSG324CArtix-7 architecture with 101K logic cells, 28 nm process, and integrated PCIe Gen2 x4Requires migration to Vivado toolchain; offers higher DSP density but larger footprintChoose for new designs needing Gen2 PCIe, lower static power, or future-proofing beyond Spartan-6 lifecycle

Compared with XC6SLX150T-2FGG484C, the -3 variant delivers improved timing headroom without layout changes, while the Artix-7 alternative enables next-generation protocols and tools at the cost of redesign effort and higher unit cost.

Availability

XC6SLX150T-2FGG484C is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and medical imaging systems requiring stable component supply over extended production lifecycles.

Supply support for XC6SLX150T-2FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation in industrial and embedded systems.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX150T-2FGG484C?

XC6SLX150T-2FGG484C supports I/O standards ranging from 1.2 V LVDCI to 3.3 V LVCMOS across its 12 banks. Each bank has independent VCCO supply, allowing simultaneous operation of SSTL18, HSTL_I, and LVCMOS25 on adjacent pins. The device does not support 1.0 V or 1.5 V-only standards like SSTL15 or HSTL_II without level-shifting circuitry.

Does XC6SLX150T-2FGG484C include built-in configuration memory?

No, XC6SLX150T-2FGG484C does not include on-chip non-volatile configuration memory. It requires external SPI flash (e.g., Micron N25Q series) for bitstream storage. Configuration occurs at power-up via Master SPI mode using CCLK and DIN pins, with INIT_B signaling successful load completion.

Can XC6SLX150T-2FGG484C operate in industrial temperature range?

Yes, the 'C' suffix in XC6SLX150T-2FGG484C denotes commercial temperature grade (0°C to +85°C ambient), which covers most industrial environments. For extended temperature operation (-40°C to +100°C), the 'I' grade variant XC6SLX150T-2FGG484I must be used, with validated thermal derating curves provided in Xilinx DS162.

What JTAG interface features are supported by XC6SLX150T-2FGG484C?

XC6SLX150T-2FGG484C supports IEEE 1149.1-compliant JTAG boundary-scan for testing and programming. It implements TAP controller with IDCODE, BYPASS, SAMPLE/PRELOAD, EXTEST, and INTEST instructions. JTAG is used for configuration, debug (via ChipScope Pro), and partial reconfiguration through the ICAP port.

Is XC6SLX150T-2FGG484C compatible with Xilinx Vivado Design Suite?

No, XC6SLX150T-2FGG484C is supported exclusively by Xilinx ISE Design Suite 14.7. Vivado does not support Spartan-6 devices. Migration to Vivado requires architectural upgrade to 7-series or newer FPGAs such as XC7A100T-2CSG324C, which is documented in Xilinx UG908.

XC6SLX150T-2FGG484C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LXT
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
11519
Number of Logic Elements/Cells:
147443
Total RAM Bits:
4939776
Number of I/O:
296
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC6SLX150T-2FGG484C FAQ

1.How can I place an order for XC6SLX150T-2FGG484C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX150T-2FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX150T-2FGG484C reliable?

The price and inventory of XC6SLX150T-2FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-2FGG484C is usually 5 days.

3.What payment methods are accepted for XC6SLX150T-2FGG484C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-2FGG484C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX150T-2FGG484C?

XC6SLX150T-2FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX150T-2FGG484C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX150T-2FGG484C?

For technical support, including XC6SLX150T-2FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-2FGG484C requirements.

6.How does Aetrix verify that XC6SLX150T-2FGG484C is sourced from the original manufacturer or authorized distributors?

All XC6SLX150T-2FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-2FGG484C meets industry standards.

7.What is the process for return or replacement of XC6SLX150T-2FGG484C?

All XC6SLX150T-2FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-2FGG484C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX150T-2FGG484C part is unused and in its original packaging.

Return procedure for XC6SLX150T-2FGG484C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX150T-2FGG484C Tags

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