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AMD XC6SLX150T-2FGG676C
- Part No.:
- XC6SLX150T-2FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150T-2FGG676C.pdf
- Description:
- IC FPGA 396 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,004
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Product details
Overview
XC6SLX150T-2FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 576 Kbits of block RAM, and support for DDR2/DDR3 memory interfaces. It operates at -2 speed grade with 1.2 V core voltage and is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA). This device targets high-volume industrial control and embedded vision systems requiring deterministic I/O timing.
For engineers reviewing the XC6SLX150T-2FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (512 user I/Os), LVDS-compatible differential signaling capability, and integrated DSP48A1 slices for arithmetic acceleration in real-time processing pipelines.
Technical Context
The XC6SLX150T-2FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated digital signal processing (DSP48A1) slices, and block RAM (BRAM) organized in 18 Kb dual-port modules. It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and TMDS.
Configuration is performed via Master SPI or JTAG interface, with support for fallback configuration and multi-boot using external serial flash. The device includes internal clock management units (DCMs) but no PLLs - clock synthesis relies on DCM-based frequency synthesis and phase alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| User I/O Pins | 512 - supports high-density parallel bus interfacing and multi-channel sensor aggregation |
| Block RAM | 576 Kbits - enables on-chip buffering for video frame storage or protocol packet staging |
| DSP Slices | 180 × DSP48A1 - provides fixed-point multiply-accumulate operations at up to 250 MHz for filtering and control loops |
| Speed Grade | -2 - guarantees timing closure at 500 MHz I/O toggle rate and 250 MHz system clock under worst-case conditions |
| Core Voltage | 1.2 V ±3% - requires tightly regulated power delivery with <±10 mV ripple for stable operation |
| Package | 676-pin FGG (Fine-Pitch BGA) - 27×27 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free finish |
Pinout & Package
The XC6SLX150T-2FGG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG) package with 27×27 array, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V output driver voltage per bank; must match connected peripheral interface standard |
| VCCAUX | Auxiliary supply | Provides 2.5 V to configuration circuitry, JTAG, and certain I/O banks; requires low-noise regulation |
| GND | Ground reference | Multiple dedicated ground balls distributed across package for signal integrity and EMI reduction |
| PROGRAM_B | Active-low configuration reset | Pulls device into configuration mode when asserted; synchronous deassertion initiates startup sequence |
| CCLK | Configuration clock | Drives internal configuration logic during SPI master mode; externally generated or internally derived |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization completion |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Eight Digital Clock Managers provide jitter-tolerant clock division, multiplication, and phase shifting without external PLL components |
| SelectIO Technology | Supports 19 I/O standards including LVDS, SSTL-18, and HSTL Class I - enables direct connection to FPGAs, ADCs, and memory without level-shifting |
| Multi-Boot Capability | Allows two independent bitstreams stored in external flash; runtime selection via GPIO enables field-upgradable firmware and fail-safe recovery |
| ISE Design Suite Support | Fully compatible with Xilinx ISE 14.7 - no migration required for legacy Spartan-6 designs targeting cost-sensitive industrial platforms |
| Extended Temperature Range | Industrial-grade (-40°C to +100°C junction) operation validated per AEC-Q100 Class 2 - suitable for uncooled factory-floor deployments |
Applications
| Industrial Motion Control | Embedded Vision Processing |
|---|---|
Use Scenario: Real-time servo loop execution with sub-microsecond latency in CNC machine controllers. IC Role / Device Role / Timing Role: FPGA fabric implements PID controllers, encoder interpolation, and PWM generation with deterministic timing enforced by DCM-synchronized clocks. Use Value: 512 user I/Os enable simultaneous connection to multiple axes, safety I/O, and fieldbus interfaces without glue logic. | Use Scenario: On-camera preprocessing of 1080p60 video streams before transmission to host processor. IC Role / Device Role / Timing Role: XC6SLX150T-2FGG676C performs Bayer demosaicing, histogram equalization, and edge enhancement using pipelined DSP48A1 slices. Use Value: 576 Kbits of block RAM buffers full-line image data while maintaining pixel-clock-aligned throughput. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Modular I/O expansion module supporting analog input, digital I/O, and CANopen communication. IC Role / Device Role / Timing Role: XC6SLX150T-2FGG676C serves as central I/O aggregator and protocol engine, managing time-critical cyclic data exchange. Use Value: SelectIO flexibility allows mixed-voltage I/O banks to interface directly with 24 V sensors, 5 V actuators, and 3.3 V microcontrollers. | Use Scenario: High-precision waveform generation and acquisition in automated test equipment (ATE). IC Role / Device Role / Timing Role: FPGA implements arbitrary waveform synthesis, trigger synchronization, and real-time FFT using dedicated DSP resources. Use Value: -2 speed grade ensures setup/hold timing margins for 200+ MHz sampling clock domains driving high-speed DACs/ADCs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface consolidation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FGG676C | Omits transceiver (SERDES) blocks; identical logic density, I/O count, and package; lower static power | Suitable where high-speed serial links (e.g., Gigabit Ethernet PHY interface) are not required | Prefer XC6SLX150-2FGG676C for cost-sensitive applications without serial connectivity needs |
| XC7A100T-2CSG324C | Artix-7 architecture; higher logic density (101,440 LUTs), 2.5x more DSP slices, native PCIe Gen2 endpoint support | Enables migration path to higher bandwidth protocols and larger algorithmic workloads | Choose XC7A100T-2CSG324C when future-proofing for PCIe, DDR3L, or AXI-based subsystems |
Compared with XC6SLX150-2FGG676C, the XC6SLX150T-2FGG676C adds GTP transceivers for 3.2 Gbps serial I/O, while XC7A100T-2CSG324C delivers architectural improvements including 6-input LUTs and hardened memory controllers - both alternatives require PCB redesign and toolchain updates.
Availability
XC6SLX150T-2FGG676C is available at Aetrix Electronics and suitable for industrial motion control, embedded vision systems, and programmable logic controller (PLC) modules requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150T-2FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan-6 FPGA family as part of its adaptive computing portfolio.
The Spartan-6 family was designed for high-volume, cost-sensitive applications demanding low-power logic integration, flexible I/O, and long-term industrial availability - not for high-performance compute or AI acceleration.
FAQ
What is the maximum operating temperature for the XC6SLX150T-2FGG676C?
The XC6SLX150T-2FGG676C is rated for industrial temperature range: –40°C to +100°C junction temperature. This specification is validated per Xilinx DS162 and applies to the FGG676 package variant. Thermal design must ensure adequate heatsinking or airflow to maintain junction temperature within limits during sustained logic and I/O activity. The XC6SLX150T-2FGG676C does not support extended or military temperature grades.
Does the XC6SLX150T-2FGG676C support DDR3 memory interfaces?
Yes, the XC6SLX150T-2FGG676C supports DDR3 SDRAM interfaces up to 800 Mbps data rate per pin using its SelectIO resources and DCM-based clocking. Implementation requires adherence to Xilinx UG388 guidelines for board layout, termination, and timing constraints. The XC6SLX150T-2FGG676C does not include a hardened memory controller; DDR3 functionality is implemented in fabric using MIG IP core.
How many GTP transceivers does the XC6SLX150T-2FGG676C contain?
The XC6SLX150T-2FGG676C contains four GTP transceivers, each capable of line rates from 622 Mbps to 3.2 Gbps. These are used for protocols including SATA, PCI Express Gen1, and Serial RapidIO. Transceiver placement is fixed per package pinout; all four are accessible in the FGG676 package. The XC6SLX150T-2FGG676C does not support higher-speed GTPE2 or GTH transceivers found in 7-series devices.
Is the XC6SLX150T-2FGG676C pin-compatible with other Spartan-6 devices?
No, the XC6SLX150T-2FGG676C is not pin-compatible with smaller Spartan-6 devices due to differing ball counts and I/O bank arrangements. However, it shares the same FGG676 footprint with XC6SLX150-2FGG676C and XC6SLX150T-3FGG676C. Pin compatibility is limited to same-package variants within the LX150T speed-grade family.
What configuration modes are supported by the XC6SLX150T-2FGG676C?
The XC6SLX150T-2FGG676C supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Master SPI is most common for production systems using external flash memory. Configuration bitstream can be loaded from single or dual SPI flash, with optional fallback support. The XC6SLX150T-2FGG676C does not support BPI or NAND flash configuration modes.
XC6SLX150T-2FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150T-2FGG676C FAQ
1.How can I place an order for XC6SLX150T-2FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-2FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-2FGG676C reliable?
The price and inventory of XC6SLX150T-2FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-2FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-2FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-2FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-2FGG676C?
XC6SLX150T-2FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-2FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-2FGG676C?
For technical support, including XC6SLX150T-2FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-2FGG676C requirements.
6.How does Aetrix verify that XC6SLX150T-2FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-2FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-2FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-2FGG676C?
All XC6SLX150T-2FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-2FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-2FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX150T-2FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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