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AMD XC6SLX150T-2FGG676I
- Part No.:
- XC6SLX150T-2FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150T-2FGG676I.pdf
- Description:
- IC FPGA 396 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,001
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Product details
Overview
XC6SLX150T-2FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 5,960 Kbits of block RAM, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It integrates 288 DSP48E1 slices and supports DDR2/DDR3 memory interfaces for high-throughput data processing in embedded vision systems.
For engineers reviewing the XC6SLX150T-2FGG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (516 user I/Os), LVDS support, SelectIO™ voltage flexibility (1.2V–3.3V), and configuration via SPI/BPI/JTAG.
Technical Context
The XC6SLX150T-2FGG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic and shift registers. It includes clock management tiles with DCMs supporting frequency synthesis, phase shifting, and duty cycle correction.
Configuration is performed through Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interface. Bitstream encryption and readback protection are supported for secure deployment in industrial control environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total programmable resources for combinational and sequential logic implementation |
| Block RAM | 5,960 Kbits - distributed across 233 blocks, each 18 Kb, enabling large FIFOs or buffer memory |
| DSP Slices | 288 × DSP48E1 - fixed-point multiply-accumulate units supporting 25×18-bit operations per slice |
| User I/O Pins | 516 - configurable as single-ended or differential standards including LVDS, SSTL, HSTL |
| Speed Grade | -2 - guarantees timing closure up to 667 MHz DDR3 data rate and 333 MHz system clock |
| Operating Temp | -40°C to +100°C - qualified for industrial ambient conditions without derating |
| Package | FGG676 - 676-pin Fine-Pitch BGA, 27×27 mm, 1.0 mm pitch, RoHS-compliant |
Pinout & Package
XC6SLX150T-2FGG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FGG676) package with 27×27 array, 1.0 mm ball pitch, and standard thermal pad layout. Pin functions follow Xilinx Spartan-6 pinout conventions with dedicated configuration, clock, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion |
| H2 | INIT_B | Active-low bidirectional initialization and reconfiguration control |
| K1 | CCLK | Configuration clock input for Master Serial mode; output in Slave Serial mode |
| M1 | DIN | Serial configuration data input during Master Serial programming |
| P1 | PROGRAM_B | Active-low asynchronous reset initiating full reconfiguration sequence |
| R1 | TCK | JTAG test clock input per IEEE 1149.1 boundary-scan protocol |
Key Features
| Feature | Design Value |
|---|---|
| Low-power 45 nm process | Reduces static power consumption by ~40% vs. previous 65 nm Spartan families, enabling fanless industrial designs |
| SelectIO™ technology | Supports 18 I/O standards including LVDS, SSTL-18, HSTL-I, and PCI-X with programmable drive strength and slew rate |
| Embedded Block RAM | Configurable as true dual-port RAM, ROM, or shift register, enabling flexible on-chip data buffering |
| DCM clock management | Provides jitter reduction, frequency synthesis, and phase alignment without external PLL components |
| Security features | Bitstream encryption using AES-256 and readback protection prevent unauthorized cloning or reverse engineering |
Applications
| Industrial Motor Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis synchronization and encoder feedback processing. IC Role / Device Role / Timing Role: FPGA fabric executes custom PWM generation, position interpolation, and safety monitoring logic with sub-microsecond latency. Use Value: 516 user I/Os enable direct connection to multiple encoders, analog sensors, and isolated gate drivers without glue logic. | Use Scenario: High-speed image sensor aggregation (e.g., CMOS line-scan or area-scan arrays) feeding FPGA-based preprocessing pipeline. IC Role / Device Role / Timing Role: XC6SLX150T-2FGG676I acts as pixel-level timing controller and real-time image filter engine before transmission to host CPU. Use Value: 288 DSP48E1 slices accelerate convolution kernels and histogram equalization at >100 MPix/s throughput. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control subsystems. IC Role / Device Role / Timing Role: Configurable logic implements deterministic time-triggered communication stacks with hardware timestamping. Use Value: Industrial temperature rating (-40°C to +100°C) ensures reliable operation in unconditioned avionics bays. | Use Scenario: High-resolution waveform capture and digital signal analysis in modular PXI or LXI instruments. IC Role / Device Role / Timing Role: XC6SLX150T-2FGG676I manages ADC/DAC interfacing, trigger sequencing, and on-board FFT computation. Use Value: 5,960 Kbits of block RAM enables deep acquisition buffers (≥1 Msample) with zero-host-transfer latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG676I | Faster speed grade (-3) with tighter timing margins; higher static power due to increased VCCINT leakage | Better suited for designs requiring >667 Mbps DDR3 or >200 MHz system clocks | Select only if timing closure fails at -2 grade; verify thermal design for increased power |
| XC7A100T-2CSG324I | Artix-7 architecture: 101K logic cells, 285 DSP slices, 4.9 Mb BRAM, native PCIe Gen2 endpoint support | Enables higher integration with hard IP (PCIe, Ethernet MAC), but requires board redesign due to different package and pinout | Choose for new designs needing PCIe connectivity or improved DSP density; not drop-in compatible |
Compared with XC6SLX150T-2FGG676I, the -3 variant offers marginally higher performance at cost of power and thermal headroom, while the Artix-7 alternative provides modern hard IP and higher logic efficiency but demands full PCB and firmware requalification.
Availability
XC6SLX150T-2FGG676I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging interface, avionics data concentrators, and test & measurement equipment requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX150T-2FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.
The Spartan-6 family was designed for cost-sensitive, high-volume embedded applications requiring low power, small footprint, and robust industrial qualification - particularly in motor control, video processing, and communications infrastructure.
FAQ
What is the maximum supported DDR3 data rate for XC6SLX150T-2FGG676I?
The XC6SLX150T-2FGG676I supports DDR3 memory interfaces up to 667 Mbps (333 MHz clock) under -2 speed grade conditions. This is validated per Xilinx UG382 and confirmed in device-specific timing reports. The actual achievable rate depends on PCB layout quality, termination, and memory part selection. XC6SLX150T-2FGG676I includes dedicated DDR3 PHY logic and DQS tracking circuitry to maintain signal integrity at this rate.
Does XC6SLX150T-2FGG676I support JTAG boundary-scan testing?
Yes, XC6SLX150T-2FGG676I fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements mandatory boundary-scan instructions (SAMPLE/PRELOAD, EXTEST, INTEST) and optional IDCODE. JTAG is used for both configuration and post-configuration verification. XC6SLX150T-2FGG676I also supports partial reconfiguration through JTAG when combined with appropriate bitstream partitioning.
Can XC6SLX150T-2FGG676I be configured using a microcontroller?
Yes, XC6SLX150T-2FGG676I supports Slave Serial and Slave SelectMAP configuration modes, enabling direct control by an external microcontroller. In Slave Serial mode, the MCU drives CCLK and DIN to load the bitstream from internal flash or external memory. XC6SLX150T-2FGG676I provides INIT_B and DONE status signals for handshaking. Configuration via SPI flash is also supported using the Master Serial mode with on-chip oscillator.
What I/O standards are supported by XC6SLX150T-2FGG676I?
XC6SLX150T-2FGG676I supports 18 SelectIO™ standards including LVDS, LVPECL, SSTL-18/I/II, HSTL-I/III, PCI-X, and single-ended standards like LVTTL and LVCMOS. Each I/O bank is independently configurable for voltage (1.2V–3.3V), drive strength (2–24 mA), and slew rate. XC6SLX150T-2FGG676I does not support differential standards beyond LVDS/LVPECL or DDR4 interfaces.
Is XC6SLX150T-2FGG676I qualified for automotive applications?
No, XC6SLX150T-2FGG676I is specified for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. While its operating range overlaps with some automotive cabin applications, it lacks automotive-grade screening, failure-in-time (FIT) reporting, and extended reliability validation required for under-hood or safety-critical systems. For automotive use, AMD recommends the XA Spartan-6 family variants explicitly qualified to AEC-Q100 Grade 3.
XC6SLX150T-2FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150T-2FGG676I FAQ
1.How can I place an order for XC6SLX150T-2FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-2FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-2FGG676I reliable?
The price and inventory of XC6SLX150T-2FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-2FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-2FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-2FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-2FGG676I?
XC6SLX150T-2FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-2FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-2FGG676I?
For technical support, including XC6SLX150T-2FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-2FGG676I requirements.
6.How does Aetrix verify that XC6SLX150T-2FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-2FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-2FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-2FGG676I?
All XC6SLX150T-2FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-2FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-2FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX150T-2FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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