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AMD XC6SLX150T-2FGG900I
- Part No.:
- XC6SLX150T-2FGG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150T-2FGG900I.pdf
- Description:
- IC FPGA 540 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,999
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Product details
Overview
XC6SLX150T-2FGG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 480 DSP48A1 slices, 4.2 MB of total block RAM, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-reliability industrial control and embedded vision systems requiring deterministic timing and low-power reconfigurable logic.
For engineers reviewing the XC6SLX150T-2FGG900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (544 user I/Os), LVDS-capable banks, integrated clock management (DCM and PLL), and support for PCI Express Gen1 endpoint functionality.
Technical Context
The XC6SLX150T-2FGG900I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates dual DCMs and one PLL for clock synthesis, phase alignment, and jitter reduction across multiple clock domains.
It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential interfaces such as LVDS, Mini-LVDS, RSDS, and BLVDS. I/O banks are independently voltage-controlled (1.2 V to 3.3 V), enabling mixed-voltage system interfacing without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom digital functions |
| DSP Slices | 480 × DSP48A1 - enables parallel multiply-accumulate operations for filtering and math-intensive algorithms |
| Block RAM | 4.2 MB - supports large on-chip data buffering, FIFOs, and lookup tables without external memory |
| User I/O Pins | 544 - provides high-density interface capability for sensor arrays, display controllers, and bus expansion |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz internal clocking and 1000 Mbps I/O toggle rates |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded deployments |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS, LVTTL - allows direct connection to ADCs, FPD-Link, DDR2/3, and legacy peripherals |
Pinout & Package
The XC6SLX150T-2FGG900I is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 35×35 mm body size and 1.0 mm ball pitch. This package supports high I/O density and thermal performance for sustained operation in convection-cooled industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | I/O bank 0 output voltage supply - sets logic threshold for all pins in Bank 0 (supports 1.2–3.3 V) |
| P19 | CLKIN_1 | Dedicated single-ended clock input to DCM1 - accepts 1–500 MHz external reference clocks |
| A15 | IO_L1P_0 | Differential pair positive terminal in Bank 0 - used for LVDS input with internal 100 Ω termination |
| B15 | IO_L1N_0 | Differential pair negative terminal in Bank 0 - paired with A15 for noise-immune signaling |
| T14 | M0 | Configuration mode select - sets master serial mode when pulled High during power-up |
| R15 | PROGRAM_B | Active-Low configuration reset - forces reinitialization of FPGA logic and configuration memory |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Dual DCMs + 1 PLL per device - eliminates need for external clock synthesizers in multi-domain timing systems |
| SelectIO Technology | Per-bank voltage control and programmable slew rate - enables mixed-signal board design with minimal signal integrity risk |
| PCI Express Endpoint | Hard IP block supporting Gen1 x1/x2/x4 - reduces FPGA resource usage and verification effort for host communication |
| Power-Down Mode | Configurable partial or full device shutdown - lowers static power to <100 µW in standby while retaining configuration state |
| ISE Design Suite Support | Fully supported through Xilinx ISE 14.7 - ensures stable toolchain for long-lifecycle industrial maintenance |
Applications
| Industrial Motion Control | Embedded Vision Processing |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic PID controllers and high-speed quadrature decoding with sub-microsecond latency. Use Value: XC6SLX150T-2FGG900I delivers 544 I/Os for multi-axis I/O expansion and on-chip DSP slices for real-time trajectory interpolation. | Use Scenario: On-camera preprocessing of Bayer-pattern image streams from CMOS sensors before transmission to host processor. IC Role / Device Role / Timing Role: XC6SLX150T-2FGG900I acts as a pixel pipeline accelerator handling demosaicing, gamma correction, and histogram generation. Use Value: Block RAM and distributed memory enable line buffers for 1080p@60fps processing without external frame memory. |
| Avionics Data Acquisition | Test & Measurement Equipment |
Use Scenario: Modular analog-to-digital acquisition unit capturing synchronized multi-channel sensor data in UAV flight controllers. IC Role / Device Role / Timing Role: XC6SLX150T-2FGG900I manages time-stamped sampling, channel multiplexing, and ARINC 429/RS-422 protocol encoding. Use Value: Industrial temperature rating and radiation-tolerant configuration memory ensure reliability in unpressurized avionics bays. | Use Scenario: Digital pattern generator and logic analyzer core in portable benchtop instruments with multi-protocol trigger support. IC Role / Device Role / Timing Role: XC6SLX150T-2FGG900I implements high-speed state machines for protocol-aware triggering and deep sample buffering. Use Value: 4.2 MB block RAM enables 1 Msample deep capture at 200 MS/s with real-time post-processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG900C | Faster -3 speed grade; commercial temp range (0°C to +85°C); higher static power | Suitable for lab-grade test equipment but not certified for industrial ambient extremes | Choose only if timing margin is critical and operating environment remains within commercial limits |
| XC7K160T-2FFG676I | Kintex-7 architecture; 160K logic cells; 2.5x more DSP; no native PCI Express Gen1 hard IP | Enables higher-bandwidth protocols (PCIe Gen2, SATA, DisplayPort) but requires Vivado toolflow migration | Select when upgrading system bandwidth or adding transceiver-based interfaces beyond Spartan-6 capability |
Compared with XC6SLX150T-2FGG900I, the -3FGG900C offers tighter timing margins at lower cost but sacrifices industrial temperature compliance; the XC7K160T-2FFG676I provides architectural scalability and higher throughput but introduces toolchain and power delivery complexity.
Availability
XC6SLX150T-2FGG900I is available at Aetrix Electronics and suitable for industrial motion control, embedded vision systems, and avionics data acquisition requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX150T-2FGG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for long-term industrial and aerospace applications. The company specializes in adaptive computing platforms combining FPGA, CPU, GPU, and AI engines.
The Spartan-6 family was designed for cost-sensitive, power-efficient, high-reliability embedded systems where predictable timing, broad I/O flexibility, and mature tool support are prioritized over raw compute density.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-2FGG900I?
The XC6SLX150T-2FGG900I supports I/O bank voltages from 1.2 V to 3.3 V, with each of its 12 I/O banks independently configurable. This allows simultaneous interfacing with 1.8 V sensors, 3.3 V legacy peripherals, and 2.5 V memory interfaces without external level shifters. The XC6SLX150T-2FGG900I datasheet specifies VCCO tolerance of ±3% and strict derating above 85°C ambient.
Does XC6SLX150T-2FGG900I include hard IP for PCI Express?
Yes, the XC6SLX150T-2FGG900I integrates a dedicated PCI Express Gen1 endpoint hard IP block supporting x1, x2, and x4 lane configurations. This hard macro handles link training, transaction layer packet (TLP) formatting, and error reporting without consuming LUT resources. The XC6SLX150T-2FGG900I does not support Gen2 or root complex functionality.
What configuration modes are supported by XC6SLX150T-2FGG900I?
The XC6SLX150T-2FGG900I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Configuration is initiated via dedicated mode pins (M2:M0) at power-up, with bitstream loaded from external SPI flash or delivered by a microcontroller. The XC6SLX150T-2FGG900I also supports fallback and multi-boot from dual flash images for field-upgrade resilience.
Is XC6SLX150T-2FGG900I qualified for automotive applications?
No, the XC6SLX150T-2FGG900I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably in under-hood environments, AMD does not certify this device for automotive safety-critical systems. For automotive use, designers should consider Xilinx Automotive (XA) variants like XA6SLX150T, which undergo additional screening and documentation per ISO/TS 16949.
What is the recommended programming toolchain for XC6SLX150T-2FGG900I?
The XC6SLX150T-2FGG900I is fully supported by Xilinx ISE Design Suite 14.7 - the final and only officially validated toolchain. AMD maintains legacy ISE licensing and device files for continued support. The XC6SLX150T-2FGG900I is not compatible with Vivado, as its architecture predates that tool's target families.
XC6SLX150T-2FGG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150T-2FGG900I FAQ
1.How can I place an order for XC6SLX150T-2FGG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-2FGG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-2FGG900I reliable?
The price and inventory of XC6SLX150T-2FGG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-2FGG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-2FGG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-2FGG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-2FGG900I?
XC6SLX150T-2FGG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-2FGG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-2FGG900I?
For technical support, including XC6SLX150T-2FGG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-2FGG900I requirements.
6.How does Aetrix verify that XC6SLX150T-2FGG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-2FGG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-2FGG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-2FGG900I?
All XC6SLX150T-2FGG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-2FGG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-2FGG900I part is unused and in its original packaging.
Return procedure for XC6SLX150T-2FGG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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