AMD XC6SLX150T-3CSG484C
- Part No.:
- XC6SLX150T-3CSG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX150T-3CSG484C.pdf
- Description:
- IC FPGA 296 I/O 484CSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,439
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Product details
Overview
XC6SLX150T-3CSG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 484-pin CSG package, -3 speed grade, and industrial temperature range (–40°C to +85°C). It integrates 4.9 Mbit of block RAM, 576 DSP48A1 slices, and supports PCIe Gen1 x1 endpoint operation in embedded vision and industrial control systems.
For engineers reviewing the XC6SLX150T-3CSG484C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (348 user I/Os), LVDS support, embedded memory bandwidth, and PCIe endpoint compliance for real-time interface bridging.
Technical Context
The XC6SLX150T-3CSG484C implements a configurable logic fabric based on 6-input LUTs with integrated flip-flops, distributed RAM, and shift registers. It includes dedicated clock management tiles with DCMs supporting frequency synthesis, phase shifting, and jitter reduction across up to eight global clock networks.
I/O banks support SelectIO™ standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling (LVDS, Mini-LVDS, RSDS, BLVDS) with programmable drive strength, slew rate, and on-die termination. Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 348 - supports high-density peripheral interfacing with bank-wise voltage and standard flexibility |
| Block RAM | 4.9 Mbit - enables large FIFOs, frame buffers, or lookup tables without external memory |
| DSP Slices | 576 × DSP48A1 - delivers 18×25-bit multiply-accumulate throughput for filtering and math acceleration |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies for critical paths in industrial designs |
| Operating Temp | –40°C to +85°C - qualified for deployment in uncontrolled industrial environments |
| PCIe Support | Gen1 x1 Endpoint - enables direct host communication without external bridge ICs |
Pinout & Package
484-pin CSG (Chip Scale Grid Array) package with 23×23 mm body, 0.8 mm pitch, and exposed thermal pad. RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output supply - sets voltage level for all outputs in Bank 0 (1.2–3.3 V) |
| K1 | GCLK1 | Global clock input - low-skew routing to all clock-capable resources |
| T3 | M0 | Configuration mode select - defines boot source (SPI, BPI, or JTAG) |
| V17 | INIT_B | Open-drain status signal - indicates configuration status and error flag |
| R18 | CCLK | Configuration clock - drives internal config logic during master SPI mode |
| Y18 | DONE | Open-drain completion indicator - signals successful configuration load |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Hard IP block supporting Gen1 x1 link with full protocol stack - eliminates soft-core overhead and timing risk |
| SelectIO Technology | Per-bank I/O voltage and standard independence - enables mixed-voltage system interfacing without level shifters |
| Dedicated Clock Management | DCM-based clock synthesis with ±100 ppm stability - meets deterministic timing for synchronous data acquisition |
| Low-Power Architecture | 1.2 V core voltage with dynamic power gating - reduces active power in always-on industrial gateways |
| Configuration Security | Bitstream encryption via AES-256 - prevents reverse engineering of proprietary logic in deployed equipment |
Applications
| Industrial Motion Control | Embedded Vision Processing |
|---|---|
Use Scenario: Real-time servo loop execution with multi-axis coordination in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, encoder interpolation, and safety monitoring logic with sub-microsecond latency. Use Value: Deterministic timing from DCM-controlled clocks and 348 I/Os enable simultaneous analog feedback sampling and PWM generation. | Use Scenario: Pre-processing of HD video streams from multiple CMOS sensors in smart cameras and inspection systems. IC Role / Device Role / Timing Role: XC6SLX150T-3CSG484C acts as pixel pipeline accelerator with parallelized Bayer demosaic, noise reduction, and edge detection kernels. Use Value: 576 DSP48A1 slices deliver real-time 1080p@60fps processing without offloading to host CPU. |
| Programmable Logic Controller (PLC) | Communications Gateway |
Use Scenario: Modular I/O expansion and fieldbus protocol translation (Modbus TCP, EtherCAT slave) in factory automation racks. IC Role / Device Role / Timing Role: XC6SLX150T-3CSG484C serves as protocol engine and hardware state machine managing cyclic data exchange and diagnostics. Use Value: 4.9 Mbit block RAM stores protocol buffers and device configuration while maintaining cycle consistency under 1 ms. | Use Scenario: Bridging legacy RS-485 field networks to Ethernet/IP or MQTT cloud infrastructure in IIoT edge nodes. IC Role / Device Role / Timing Role: XC6SLX150T-3CSG484C implements dual-interface controller with time-synchronized packet forwarding and TLS offload. Use Value: PCIe Gen1 x1 endpoint enables direct connection to ARM-based SoM hosts, reducing software stack latency by 40% vs. USB or UART bridges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG484C | Same logic resources but FGG package (Fine-Pitch BGA, 23×23 mm, 1.0 mm pitch); no exposed thermal pad | Limited thermal dissipation in sustained high-clock operation; unsuitable for convection-cooled enclosures | Prefer XC6SLX150T-3CSG484C when board-level thermal management requires enhanced heat transfer via thermal pad |
| XC7S100-2FTG256I | Artix-7 successor with higher logic density (101K LUTs), 256-pin FTG package, and integrated 66 MHz ARM Cortex-M1 microcontroller | Enables soft processor integration and firmware-driven reconfiguration; not pin-compatible | Choose XC6SLX150T-3CSG484C for legacy Spartan-6 toolchain compatibility and cost-sensitive industrial deployments without embedded processor need |
Compared with XC6SLX150-3FGG484C, the XC6SLX150T-3CSG484C offers superior thermal performance via its exposed pad; versus XC7S100-2FTG256I, it provides lower BOM cost and mature design ecosystem support for long-lifecycle industrial programs.
Availability
XC6SLX150T-3CSG484C is available at Aetrix Electronics and suitable for industrial motion control, embedded vision systems, and programmable logic controller (PLC) modules requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX150T-3CSG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan family as part of its adaptive computing portfolio for cost-optimized, high-reliability applications.
The Spartan-6 family was designed for high-volume industrial, automotive, and aerospace applications where predictable timing, long-term availability, and low-power logic density are prioritized over cutting-edge process node advantages.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-3CSG484C?
The XC6SLX150T-3CSG484C supports I/O voltages from 1.2 V to 3.3 V per bank, with independent VCCO assignment per bank. This allows mixed-voltage interfaces such as 1.8 V DDR2 memory and 3.3 V industrial sensors on the same device, provided each bank's VCCO matches the target standard's required voltage.
Does XC6SLX150T-3CSG484C include built-in configuration memory?
No, the XC6SLX150T-3CSG484C does not include non-volatile configuration memory. It requires an external serial PROM (e.g., XCFxx series) or flash memory to store the bitstream. Configuration occurs on power-up via Master SPI, Slave Serial, or JTAG, with INIT_B and DONE pins providing status feedback during the process.
Can XC6SLX150T-3CSG484C operate in extended temperature ranges beyond –40°C to +85°C?
No, the XC6SLX150T-3CSG484C is qualified only for the industrial temperature range of –40°C to +85°C. It is not rated for automotive (–40°C to +125°C) or military-grade operation. Thermal derating or extended qualification testing is not supported by AMD/Xilinx documentation for this specific speed grade and package.
How many clock regions does XC6SLX150T-3CSG484C contain?
The XC6SLX150T-3CSG484C contains eight clock regions, each served by one DCM (Digital Clock Manager). Each region supports independent clock domain management, enabling concurrent use of multiple clock frequencies and phase relationships across different functional blocks within the FPGA fabric.
Is XC6SLX150T-3CSG484C compatible with Vivado Design Suite?
The XC6SLX150T-3CSG484C is supported exclusively by Xilinx ISE Design Suite 14.7 and earlier versions. It is not supported in Vivado, which targets 7-series and newer FPGA families. Migration to Vivado requires architectural changes and is not feasible for existing Spartan-6 designs targeting XC6SLX150T-3CSG484C.
XC6SLX150T-3CSG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX150T-3CSG484C FAQ
1.How can I place an order for XC6SLX150T-3CSG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-3CSG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-3CSG484C reliable?
The price and inventory of XC6SLX150T-3CSG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-3CSG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-3CSG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-3CSG484C transactions.
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4.How is shipping managed for XC6SLX150T-3CSG484C?
XC6SLX150T-3CSG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-3CSG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-3CSG484C?
For technical support, including XC6SLX150T-3CSG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-3CSG484C requirements.
6.How does Aetrix verify that XC6SLX150T-3CSG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-3CSG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-3CSG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-3CSG484C?
All XC6SLX150T-3CSG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-3CSG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-3CSG484C part is unused and in its original packaging.
Return procedure for XC6SLX150T-3CSG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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